VIPER26K
1050 V high voltage converter for ultra-wide input
Datasheet - production data
Description
The device is a high voltage converter smartly
integrating a 1050 V avalanche-rugged power
section, with a PWM current mode control. The
1050 V-BV power MOSFET allows to extend input
voltage range, and reduce the size of the DRAIN
snubber circuit. This IC meets the most stringent
energy-saving standards as it has very low
consumption and operates in burst mode under
light load.
The integrated HV startup, sense-FET, error
amplifier and oscillator with jitter allow a complete
application to be designed with the minimum
number of components.
The VIPer26K supports the most common SMPS
topologies such as: isolated flyback with
optocoupler, primary-side regulation, non-isolated
flyback with resistive feedback, buck, and buck
boost.
Features
1050 V avalanche-rugged power MOSFET
allowing ultra-wide VAC input range to be
covered
Embedded HV startup and sense-FET
Current mode PWM controller
Drain current limit protection:
-500 mA (VIPER265K)
-700 mA (VIPER267K)
Jittered switching frequency reduces the EMI
filter cost: 60 kHz ± 4kHz
Standby power < 30 mW at 230 VAC
Embedded E/A with 3.3 V reference
Safe auto-restart after a fault condition
Hysteretic thermal shutdown
Built-in soft-start for improved system reliability
Applications
SMPS for energy metering
Auxiliary power supplies for 3-phase input
industrial systems
LED lighting
Air conditioning
May 2019
This is information on a product in full production.
DS12978 Rev 1
1/28
www.st.com
VIPER26K
Figure 1. Basic application schematic
2/28
DS12978 Rev 1
VIPer26K
Contents
Contents
1
2
3
Pin setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Electrical and thermal ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
3.1
Typical electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
4
General description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
4.10
4.11
4.12
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Typical power capability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Primary MOSFET . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
High voltage startup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Oscillator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Soft-start . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Current limit set point . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
FB pin and COMP pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Burst Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Automatic auto restart after overload or short-circuit . . . . . . . . . . . . . . . . 18
Open loop failure protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Thermal shutdown . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
5
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
5.1
Layout guidelines and design recommendations . . . . . . . . . . . . . . . . . . . 22
6
Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
6.1
SO16N package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
7
8
Order code . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
DS12978 Rev 1
3/28
28
Pin setting
VIPER26K
1
Pin setting
Figure 2. Connection diagram
Table 1. Pin description
SO16
N
1
2, 3
4
5
6
Name
GND
N.C
N.A.
VDD
N.C.
Function
Ground.
Connected to the source of the internal power MOSFET and
controller ground reference.
Not internally connected.
It can be connected to GND (pin 1) or left
floating.
Not available for user.
This pin is mechanically connected to the controller
die pad of the frame. It is highly recommended to connect it to GND (pin 1).
Supply voltage of the control section.
This pin provides the charging
current of the external capacitor.
Not available for user.
It is highly recommended to connect it to GND (pin
1).
Inverting input of the internal trans-conductance error amplifier.
Connecting the converter output to this pin through a single resistor results
in an output voltage equal to the error amplifier reference voltage. An
external resistors divider is required for higher output voltages.
Output of the internal trans conductance error amplifier.
The
compensation network has to be placed between this pin and GND to
achieve stability and good dynamic performance of the voltage control loop.
The pin is used also to directly control the PWM with an optocoupler. The
linear voltage range extends from V
COMPL
to V
COMPH
.
Not internally connected.
It has to be left floating.
High voltage drain pin.
The built-in high voltage switched start-up bias
current is drawn from this pin too. Pins connected to the metal frame to
facilitate heat dissipation.
7
FB
8
COMP
9-12
13-16
N.C.
DRAIN
4/28
DS12978 Rev 1
VIPer26K
Electrical and thermal ratings
2
Electrical and thermal ratings
Table 2. Absolute maximum ratings
Symbol
Pin
Parameter
(1)
,
(2)
Drain-to-source (ground) voltage
Pulse drain current (limited by
T
J
= 150 °C)
Value
Min.
Max.
Unit
V
DRAIN
I
DRAIN
V
DD
I
DD
V
FB
V
COMP
P
TOT
T
J
T
STG
13-16
1.05
3
-0.3
Internally
limited
20
-0.3
-0.3
4.8
3.5
1.05
(3)
-40
-55
150
150
KV
A
V
mA
V
V
W
°C
°C
5
5
7
8
Supply voltage
Input current
Feedback pin voltage
Input pin voltage
Power dissipation at T
A
< 60 °C
Operating junction temperature range
Storage temperature
1. Stresses beyond those listed absolute maximum ratings may cause permanent damage to the device.
2. Exposure to absolute-maximum-rated conditions for extended periods may affect the device reliability.
3. When mounted on a standard single side FR4 board with 100 mm² (0.1552 inch) of Cu (35 μm thick).
Table 3. Thermal data
Symbol
R
TH-JC
R
TH-JC
R
TH-JA
R
TH-JA
Parameter
Thermal resistance junction to case
(1)
(Dissipated power = 1 W)
Thermal resistance junction to case
(2)
(Dissipated power = 1 W)
Thermal resistance junction ambient
(1)
(Dissipated power = 1 W)
Thermal resistance junction ambient
(2)
(Dissipated power = 1 W)
Max. value
10
Unit
°C/W
5
°C/W
120
°C/W
85
°C/W
1. When mounted on a standard, single side FR4 board with minimum copper area.
2. When mounted on a standard, single side FR4 board with 100 mm2 of Cu (35 μm thick).
DS12978 Rev 1
5/28
28
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