Standard SRAM, 256KX1, 25ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-24
| 参数名称 | 属性值 |
| 厂商名称 | Mitsubishi(日本三菱) |
| 零件包装代码 | SOJ |
| 包装说明 | SOJ, |
| 针数 | 24 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 25 ns |
| JESD-30 代码 | R-PDSO-J24 |
| 内存密度 | 262144 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 1 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 24 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 256KX1 |
| 输出特性 | 3-STATE |
| 可输出 | NO |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOJ |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 3.63 V |
| 最小供电电压 (Vsup) | 2.97 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | J BEND |
| 端子位置 | DUAL |
| M5M5V257DJ-25T | M5M5V257DP-25 | M5M5V257DJ-20 | M5M5V257DJ-20T | M5M5V257DP-15 | M5M5V257DP-20 | M5M5V257DJ-15 | M5M5V257DJ-15T | M5M5V257DJ-25 | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Standard SRAM, 256KX1, 25ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-24 | Standard SRAM, 256KX1, 25ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Standard SRAM, 256KX1, 20ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-24 | Standard SRAM, 256KX1, 20ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-24 | Standard SRAM, 256KX1, 15ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Standard SRAM, 256KX1, 20ns, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Standard SRAM, 256KX1, 15ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-24 | Standard SRAM, 256KX1, 15ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-24 | Standard SRAM, 256KX1, 25ns, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOJ-24 |
| 厂商名称 | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) |
| 零件包装代码 | SOJ | DIP | SOJ | SOJ | DIP | DIP | SOJ | SOJ | SOJ |
| 包装说明 | SOJ, | DIP, DIP24,.3 | SOJ, SOJ24,.34 | SOJ, | DIP, DIP24,.3 | DIP, DIP24,.3 | SOJ, SOJ24,.34 | SOJ, | SOJ, SOJ24,.34 |
| 针数 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 25 ns | 25 ns | 20 ns | 20 ns | 15 ns | 20 ns | 15 ns | 15 ns | 25 ns |
| JESD-30 代码 | R-PDSO-J24 | R-PDIP-T24 | R-PDSO-J24 | R-PDSO-J24 | R-PDIP-T24 | R-PDIP-T24 | R-PDSO-J24 | R-PDSO-J24 | R-PDSO-J24 |
| 内存密度 | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 256KX1 | 256KX1 | 256KX1 | 256KX1 | 256KX1 | 256KX1 | 256KX1 | 256KX1 | 256KX1 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 可输出 | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOJ | DIP | SOJ | SOJ | DIP | DIP | SOJ | SOJ | SOJ |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V | 3.63 V |
| 最小供电电压 (Vsup) | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 2.97 V | 2.97 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | NO | YES | YES | NO | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | J BEND | THROUGH-HOLE | J BEND | J BEND | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND | J BEND |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 是否Rohs认证 | - | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 | - | 不符合 |
| I/O 类型 | - | SEPARATE | SEPARATE | - | SEPARATE | SEPARATE | SEPARATE | - | SEPARATE |
| JESD-609代码 | - | e0 | e0 | - | e0 | e0 | e0 | - | e0 |
| 封装等效代码 | - | DIP24,.3 | SOJ24,.34 | - | DIP24,.3 | DIP24,.3 | SOJ24,.34 | - | SOJ24,.34 |
| 电源 | - | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V |
| 最大待机电流 | - | 0.001 A | 0.001 A | - | 0.001 A | 0.001 A | 0.001 A | - | 0.001 A |
| 最小待机电流 | - | 3 V | 3 V | - | 3 V | 3 V | 3 V | - | 3 V |
| 最大压摆率 | - | 0.08 mA | 0.09 mA | - | 0.1 mA | 0.09 mA | 0.1 mA | - | 0.08 mA |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| 端子节距 | - | 2.54 mm | 1.27 mm | - | 2.54 mm | 2.54 mm | 1.27 mm | - | 1.27 mm |
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