Standard SRAM, 32KX9, 35ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Mitsubishi(日本三菱) |
| 零件包装代码 | SOIC |
| 包装说明 | SOP, SOP32,.5 |
| 针数 | 32 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 35 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | R-PDSO-G32 |
| JESD-609代码 | e0 |
| 内存密度 | 294912 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 9 |
| 功能数量 | 1 |
| 端口数量 | 1 |
| 端子数量 | 32 |
| 字数 | 32768 words |
| 字数代码 | 32000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 32KX9 |
| 输出特性 | 3-STATE |
| 可输出 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP32,.5 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 最大待机电流 | 0.01 A |
| 最小待机电流 | 4.5 V |
| 最大压摆率 | 0.12 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| M5M5269FP-35 | M5M5269P-25 | M5M5269FP-35T | M5M5269FP-25 | M5M5269P-35 | M5M5269P-20 | M5M5269FP-25T | |
|---|---|---|---|---|---|---|---|
| 描述 | Standard SRAM, 32KX9, 35ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32 | Standard SRAM, 32KX9, 25ns, CMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32 | Standard SRAM, 32KX9, 35ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32 | Standard SRAM, 32KX9, 25ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32 | Standard SRAM, 32KX9, 35ns, CMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32 | Standard SRAM, 32KX9, 20ns, CMOS, PDIP32, 0.300 INCH, PLASTIC, DIP-32 | Standard SRAM, 32KX9, 25ns, CMOS, PDSO32, 0.450 INCH, PLASTIC, SOP-32 |
| 厂商名称 | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) | Mitsubishi(日本三菱) |
| 零件包装代码 | SOIC | DIP | SOIC | SOIC | DIP | DIP | SOIC |
| 包装说明 | SOP, SOP32,.5 | DIP, DIP32,.3 | SOP, | SOP, SOP32,.5 | DIP, DIP32,.3 | DIP, DIP32,.3 | SOP, |
| 针数 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | 3A991.B.2.B | EAR99 |
| 最长访问时间 | 35 ns | 25 ns | 35 ns | 25 ns | 35 ns | 20 ns | 25 ns |
| JESD-30 代码 | R-PDSO-G32 | R-PDIP-T32 | R-PDSO-G32 | R-PDSO-G32 | R-PDIP-T32 | R-PDIP-T32 | R-PDSO-G32 |
| 内存密度 | 294912 bit | 294912 bit | 294912 bit | 294912 bit | 294912 bit | 294912 bit | 294912 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
| 字数 | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
| 字数代码 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 32KX9 | 32KX9 | 32KX9 | 32KX9 | 32KX9 | 32KX9 | 32KX9 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 可输出 | YES | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | DIP | SOP | SOP | DIP | DIP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | YES | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 是否无铅 | 含铅 | 含铅 | - | 含铅 | 含铅 | 含铅 | - |
| 是否Rohs认证 | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 | - |
| I/O 类型 | COMMON | COMMON | - | COMMON | COMMON | COMMON | - |
| JESD-609代码 | e0 | e0 | - | e0 | e0 | e0 | - |
| 封装等效代码 | SOP32,.5 | DIP32,.3 | - | SOP32,.5 | DIP32,.3 | DIP32,.3 | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
| 电源 | 5 V | 5 V | - | 5 V | 5 V | 5 V | - |
| 最大待机电流 | 0.01 A | 0.01 A | - | 0.01 A | 0.01 A | 0.01 A | - |
| 最小待机电流 | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V | - |
| 最大压摆率 | 0.12 mA | 0.13 mA | - | 0.13 mA | 0.12 mA | 0.14 mA | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| 端子节距 | 1.27 mm | 2.54 mm | - | 1.27 mm | 2.54 mm | 2.54 mm | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - |
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