2381 673...../PTCTT..R....TE
Vishay BCcomponents
TWIN Vertical SMD PTC Thermistors
For Telcom Overload Protection
FEATURES
•
Very small footprint, allowing to increase the
number of lines per PCB
•
Matched pairs in one component, significantly reducing the
assembly time
•
Narrow tracking between the 2 PTC’s over a wide
temperature range (matching at 85 °C:
≤
2 x matching at
25 °C)
•
Limited height and weight, used on high speed pick-and-
place circuit assembly
•
•
•
•
•
Flat pick-up ceramic area for easy placement
Small ceramics for faster response time
Thermal coupled PTC’s for enhanced protection
Coated versions available on request
Four spaced terminations for heat flow regulation and
improved mechanical stability
QUICK REFERENCE DATA
PARAMETER
Maximum voltage (RMS)
Temperature range
Climatic category
Weight
VALUE
240
- 40 to + 85
40/125/56
∼
1.3
g
UNIT
V
°C
•
Small and large pitch available
•
Compliant with the enhanced level requirements of
ITU - K20-21-45 edition 2003
•
Suitable for Pb-bearing and lead (Pb)-free reflow soldering
•
Compliant to RoHS directive 2002/95/EC and in
accordance to WEEE 2002/96/EC
APPLICATIONS
Over-temperature/over-load protection:
•
Telecom
- Telecommunications infrastructure
- PABX
- Set-top box
DESCRIPTION
The component consists of a high-performance PTC ceramic
disc mounted in a lead-frame for direct soldering onto a
printed-circuit board (PCB) or substrate.
The ceramic is soldered to the leadframe by a local reflow
process, during which the solder layer is melted to the
metallized ceramic surface using a low residue flux.
MOUNTING
With a flat pick-up area = 30 mm
2
the PTC thermistors are
suitable for processing on high speed automatic insertion
equipment.
Typical soldering
235 °C, duration: 5 s (Pb-bearing)
245 °C, duration: 5 s (Lead (Pb)-free)
Resistance to soldering heat
260 °C, duration: 10 s max.
MARKING
•
All TWIN Vertical SMD PTC’s are marked with the last
3-digits of the type number (BCxxx) and a date code
(YYWW)
ELECTRICAL DATA
R
25
± 20 %
(Ω)
10
20
25
35
50
I
nt
at
MATCHING
(Ω)
0.5
0.5
0.5
1.0
1.0
V
max.
(V
RMS
)
240
240
240
240
240
25 °C
(mA)
140
90
100
100
90
70 °C
(mA)
85
60
60
60
50
85 °C
(mA)
55
40
40
40
35
I
t
(mA)
300
200
200
200
190
MAX.
TRIP-TIME
at 1 A
(s)
4.0
2.0
2.0
1.5
1.2
I
max.
at
V
max.
(A)
4.0
8.0
4.0
4.0
2.5
I
res
(2 PIECES POWERED)
at V
max.
(mA)
12.0
12.0
12.0
12.0
12.0
Note
(1)
All data is measured at 25 °C unless otherwise specified
www.vishay.com
40
For technical questions, contact:
nlr@vishay.com
Document Number: 29088
Revision: 27-Oct-09
2381 673...../PTCTT..R....TE
TWIN Vertical SMD PTC Thermistors
For Telcom Overload Protection
ORDERING INFORMATION
R
25
± 20 %
(Ω)
10
20
25
35
50
12NC
SMALL PITCH
2381 673 61109
2381 673 61209
2381 673 61259
2381 673 61359
2381 673 61509
LARGE PITCH
2381 673 62109
2381 673 62209
2381 673 62259
2381 673 62359
2381 673 62509
SMALL PITCH
PTCTT95R100GTE
PTCTT95R200GTE
PTCTT95R250GTE
PTCTT95R350GTE
PTCTT95R500GTE
SAP CODING
LARGE PITCH
PTCTT95R100GTELAR
PTCTT95R200GTELAR
PTCTT95R250GTELAR
PTCTT95R350GTELAR
PTCTT95R500GTELAR
Vishay BCcomponents
ELECTRICAL CHARACTERISTICS
3.5
Trip current vs Tamb
Typical
3.0
PTC
will
trip
(1 PTC powered)
2.5
Current deviation factor
2.0
1.5
I
TRIP
1.0
PTC
will
not trip
(2 PTC's powered)
0.5
I
HOLD
0
- 40
- 20
0
20
40
Tamb(°C)
60
80
100
PTC OUTLINES
X (4x)
0.3
L
T
DIMENSIONS
in millimeters
L
T
H
b
b
1
S
d
t
P
P
1
P
2
X
K
1
K
2
SMALL PITCH
9.0 ± 0.1
7.2 ± 0.25
6.9 ± 0.25
1.5 ± 0.1
0.9 ± 0.15
1.25 ± 0.15
0.22 ± 0.025
2.3 ± 0.1
6.5 ± 0.5
2.55 ± 0.15
2.2 ± 0.1
0.5 ± 0.2
6.0 ± 0.5
5.0 ± 0.5
LARGE PITCH
9.0 ± 0.1
8.4 ± 0.25
6.9 ± 0.25
1.5 ± 0.1
0.9 ± 0.15
1.25 ± 0.15
0.22 ± 0.025
2.3 ± 0.1
6.5 ± 0.5
2.55 ± 0.15
3.45 ± 0.15
0.5 ± 0.2
7.2 ± 0.5
5.0 ± 0.5
H
S
P
b
d
P
1
P
2
0.1
K
1
b
1
FOOTPRINT
D
E
BCXXX
YYWW
K
2
t
RECOMMENDED FOOTPRINT
in millimeters
A
B
C
D
E
For technical questions, contact:
nlr@vishay.com
SMALL PITCH
2.0
2.4
3.8
3.8
2.7
LARGE PITCH
2.0
2.4
5.0
4.0
1.4
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41
A
B
C
Document Number: 29088
Revision: 27-Oct-09
2381 673...../PTCTT..R....TE
Vishay BCcomponents
PACKAGING
Tape specifications
All tape and reel specifications are in accordance with
IEC 60286-3
. Carrier tape material is non-conductive polystyrene or
polycarbonate.
Blister tape
T
K
0
D
0
P
0
P
2
E
TWIN Vertical SMD PTC Thermistors
For Telcom Overload Protection
F
cover
tape
BCXXX
YYWW
W
B
0
T
1
T
2
A
0
P
1
D
1
direction of
unreeling
Cumulative pitch error: 0.2 mm over 10 pitches
Cumulative tolerance over 10 holes: ± 0.2 mm
DIMENSIONS OF BLISTER TAPE
in millimeters
SMALL PITCH
A
0
B
0
K
0
W
E
F
D
0
7.2 ± 0.1
9.3 ± 0.1
7.2 ± 0.1
16.0 ± 0.3
1.75 ± 0.1
7.5 ± 0.1
1.5 + 0.1
LARGE PITCH
8.4 ± 0.1
9.3 ± 0.1
7.2 ± 0.1
16.0 ± 0.3
1.75 ± 0.1
7.5 ± 0.1
1.5 + 0.1
D
1
P
0
P
1
P
2
T
T
1
T
2
SMALL PITCH
1.5 + 0.1
4.0 ± 0.1
12.0 ± 0.1
2.0 ± 0.1
0.5 ± 0.05
0.05
7.8 max.
LARGE PITCH
1.5 + 0.1
4.0 ± 0.1
12.0 ± 0.1
2.0 ± 0.1
0.5 ± 0.05
0.05
7.8 max.
REEL SPECIFICATIONS
in millimeters
Reel
W
2
20.5
12.75 +0.15
N
A
0
W
1
REEL DIMENSIONS
in millimeters
UNITS PER REEL
1000
TAPE WIDTH
16
A
380
N
64
W
1
16.4
W
2
MAX.
20.4
Note
Reels are packed in sealed plastic bags for protection against high humidity and corrosive atmospheres.
www.vishay.com
42
For technical questions, contact:
nlr@vishay.com
Document Number: 29088
Revision: 27-Oct-09
2381 673...../PTCTT..R....TE
TWIN Vertical SMD PTC Thermistors
For Telcom Overload Protection
SOLDERING CONDITIONS
This SMD thermistor is only suitable for reflow soldering, in accordance with JEDEC J-STD-020. Soldering processes which can
be used are reflow (infrared and convection heating) and vapour phase. The maximum temperature of 260 °C during 10 s should
not be exceeded and no liquid flux should be allowed to reach the ceramic body.
Typical examples of soldering processes that will provide reliable joints without damage, are shown below.
Reflow soldering
300
T
(°C)
250
200
150
100
2 K/s
260 °C
≈
245 °C
215 °C
180 °C
10 s
40 s
10 s
Vishay BCcomponents
130 °C
50
0
Typical values (solid line)
Process limits (dotted lines)
Vapour phase soldering
300
T
(°C)
250
0
50
100
150
200
t (s)
250
20 to 40 s
215 °C
200
150
100
50
0
0
180 °C
130 °C
external preheating
100 °C
forced
cooling
internal preheating,
e.g. by infrared,
max. 2 K/s
50
100
150
200
t (s)
250
Typical values (solid line)
Process limits (dotted line)
HANDLING PRECAUTIONS
Because of the nature of PTC ceramic material the component should not be touched with bare hands, as the residue of
perspiration can influence component behaviour at high temperatures.
Handling forces applied to the centre of the component should be limited to 20 N vertically and 5 N horizontally in non-soldered
condition. These forces should not be exceeded during the handling, transportation and packaging of the soldered product.
Document Number: 29088
Revision: 27-Oct-09
For technical questions, contact:
nlr@vishay.com
www.vishay.com
43
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www.vishay.com
Vishay
Disclaimer
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RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
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“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
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operating parameters, including typical parameters, must be validated for each customer application by the customer’s
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including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
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Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Revision: 12-Mar-12
1
Document Number: 91000