电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

NAND02GR3B2CZA1

产品描述128M X 8 FLASH 3V PROM, 35 ns, PDSO48
产品类别存储   
文件大小402KB,共64页
制造商ST(意法半导体)
官网地址http://www.st.com/
下载文档 详细参数 全文预览

NAND02GR3B2CZA1概述

128M X 8 FLASH 3V PROM, 35 ns, PDSO48

NAND02GR3B2CZA1规格参数

参数名称属性值
功能数量1
端子数量48
最小工作温度-40 Cel
最大工作温度85 Cel
额定供电电压3 V
最小供电/工作电压2.7 V
最大供电/工作电压3.6 V
加工封装描述12 X 20 MM, PLASTIC, TSOP-48
状态Contact Mfr
ccess_time_max35 ns
jesd_30_codeR-PDSO-G48
jesd_609_codee0
存储密度1.02E9 bit
内存IC类型FLASH
内存宽度8
moisture_sensitivity_levelNOT SPECIFIED
位数1.28E8 words
位数128M
操作模式ASYNCHRONOUS
组织128MX8
包装材料PLASTIC/EPOXY
ckage_codeTSOP1
包装形状RECTANGULAR
包装尺寸SMALL OUTLINE, THIN PROFILE
串行并行PARALLEL
eak_reflow_temperature__cel_NOT SPECIFIED
gramming_voltage__v_3
qualification_statusCOMMERCIAL
seated_height_max1.2 mm
表面贴装YES
温度等级INDUSTRIAL
端子涂层TIN LEAD
端子形式GULL WING
端子间距0.5000 mm
端子位置DUAL
ime_peak_reflow_temperature_max__s_NOT SPECIFIED
length18.4 mm
width12 mm

文档预览

下载PDF文档
NAND01G-B
NAND02G-B
1 Gbit, 2 Gbit,
2112 Byte/1056 Word Page, 1.8V/3V, NAND Flash Memory
Feature summary
High Density NAND Flash memories
Up to 2 Gbit memory array
Up to 64Mbit spare area
Cost effective solutions for mass
storage applications
x8 or x16 bus width
Multiplexed Address/ Data
Pinout compatibility for all densities
FBGA
NAND interface
TSOP48 12 x 20mm
Supply voltage
1.8V device: V
DD
= 1.7 to 1.95V
3.0V device: V
DD
= 2.7 to 3.6V
x8 device: (2048 + 64 spare) Bytes
x16 device: (1024 + 32 spare) Words
x8 device: (128K + 4K spare) Bytes
x16 device: (64K + 2K spare) Words
Random access: 25µs (max)
Sequential access: 50ns (min)
Page program time: 300µs (typ)
Page size
VFBGA63 9.5 x 12 x 1mm
TFBGA63 9.5 x 12 x 1.2mm
Block size
Serial Number option
Data protection
Hardware and Software Block Locking
Hardware Program/Erase locked during
Power transitions
100,000 Program/Erase cycles
10 years Data Retention
Page Read/Program
Data integrity
Copy Back Program mode
Fast page copy without external
buffering
Internal Cache Register to improve the
program and read throughputs
Block erase time: 2ms (typ)
ECOPACK
®
packages
Development tools
Error Correction Code software and
hardware models
Bad Blocks Management and Wear
Leveling algorithms
File System OS Native reference
software
Hardware simulation models
Cache Program and Cache Read modes
Fast Block Erase
Status Register
Electronic Signature
Chip Enable ‘don’t care’
for simple interface with microcontroller
February 2006
Rev 4.0
1/64
www.st.com
2

技术资料推荐更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 30  651  2179  506  108  1  14  44  11  3 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved