IC,ECL-TO-MST TRANSLATOR,ECL,FP,16PIN,CERAMIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | DFP, FL16,.3 |
| Reach Compliance Code | unknown |
| 接口集成电路类型 | INTERFACE CIRCUIT |
| JESD-30 代码 | R-XDFP-F16 |
| JESD-609代码 | e0 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DFP |
| 封装等效代码 | FL16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 表面贴装 | YES |
| 技术 | ECL |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 10591/BFAJC | 10591M/B2AJC | 10591/BEBJC | 10591/BFBJC | 10591M/B2CJC | |
|---|---|---|---|---|---|
| 描述 | IC,ECL-TO-MST TRANSLATOR,ECL,FP,16PIN,CERAMIC | IC,ECL-TO-MST TRANSLATOR,ECL,LLCC,20PIN,CERAMIC | IC,ECL-TO-MST TRANSLATOR,ECL,DIP,16PIN,CERAMIC | IC,ECL-TO-MST TRANSLATOR,ECL,FP,16PIN,CERAMIC | IC,ECL-TO-MST TRANSLATOR,ECL,LLCC,20PIN,CERAMIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | DFP, FL16,.3 | QCCN, LCC20,.35SQ | DIP, DIP16,.3 | DFP, FL16,.3 | QCCN, LCC20,.35SQ |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| 接口集成电路类型 | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT | INTERFACE CIRCUIT |
| JESD-30 代码 | R-XDFP-F16 | S-XQCC-N20 | R-XDIP-T16 | R-XDFP-F16 | S-XQCC-N20 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 16 | 20 | 16 | 16 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC | CERAMIC | CERAMIC | CERAMIC | CERAMIC |
| 封装代码 | DFP | QCCN | DIP | DFP | QCCN |
| 封装等效代码 | FL16,.3 | LCC20,.35SQ | DIP16,.3 | FL16,.3 | LCC20,.35SQ |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | FLATPACK | CHIP CARRIER | IN-LINE | FLATPACK | CHIP CARRIER |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B | 38535Q/M;38534H;883B |
| 表面贴装 | YES | YES | NO | YES | YES |
| 技术 | ECL | ECL | ECL | ECL | ECL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT | NO LEAD | THROUGH-HOLE | FLAT | NO LEAD |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | QUAD | DUAL | DUAL | QUAD |
| 厂商名称 | - | - | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
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