Posistor
®
for over current protection PRG SERIES
BC-E0167J
PRG21BB***MB1RK SERIES
1.Part Numbering
ex)
PR
G
Product ID Series
21
Dimensions
BB
Temperature
Characteristics
150
Resistance
M
Resistance
Tolerance
B1
Individual
Specifications
RK C
Packaging
2. Ratings
Part Number
PRG21BB150MB1RK
Resistance
(at 25°C)
15ohm ±20%
Max.
Voltage
*1
Max.
Current
1.6A
*2
Hold Current
*3
Trip Current
140mA(-10°C)
116mA(+25°C)
110mA(-10°C)
91mA(+25°C)
40mA(+60°C)
59mA(+25°C)
DC
30mA(+60°C)
20 V
PRG21BB220MB1RK
22ohm ±20%
1.1A
44mA(+25°C)
Packaging Tape : Taping (Standard quantity is 3000pcs. Per reel)
*1 Shows the Maximum Current value which Shall be passed repeatedly when the circuit runs abnormally.
*2 Shows the Maximum Current value which Shall be passed continuously without tripping at 25°C and 60°C
*3 Shows the Trip Current value when Posistor
®
shall protects circuit frow over load at 25°C and -10°C
3. Dimensions [mm]
L1
W
(1) Electrode
（Sn
Plating）
(2) BaTiO
3
Semiconductive Ceramic
(1)
L2
L4
L3
(2)
W
H
H
L1
2.00±0.20
W
1.25±0.20
H
1.25±0.20
L2 and L3
Min. 0.2
L4
Min. 0.5
4. Quantity (Standard Quantity)
Products quantity in a reel
3,000 pcs. /reel
This information may be changed without a previous notice.
Murata Manufacturing Co., Ltd.
C6S - C - G013
Resistance-Temperature Characteristics
Typical Curve
1000
100
Resistance Change（R/R25）
10
1
0.1
-20
0
20
40
60
80
100
120
140
160
180
200
Temperature (℃)
BB-035'
This information may be changed without a previous notice.
Notice for use
CAUTION
1. This product is designed for application, which is used under ordinary environment. (room temperature,
normal humidity, normal pressure) Do not expose this to the following environments, because all these
factors can deteriorate the characteristic of this and can cause failure or burn out.
(1) Corrosive gas or deoxidizing gases (Cl
2
, H
2
S, NH
3
, SOx, NOx etc.)
(2) Volatile, flammable gas
(3) Dusty place
(4) Place in a vacuum, reducing or putting pressure
(5) Place in splashed water, or high humidity and dewing place
(6) Salt water, oil, chemical liquid and solvent
(7) Vibratile place
(8) Other place equivalent to the above
2. Limitation of Applications
This product is designed to use for a general application and general electric equipment such as office
equipment, communication equipment, measurement equipment and electric household appliance.
Please provide an appropriate fail-safe function or redundant design on your product in order to prevent
an accident and other magnifying inquiry, in case of a special quality or reliability are required and using
our products for the following applications which might directly cause damage to a human life or property
by an accident of your product, or using except general applications, which we intend.
(1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment
(4) Power plant control equipment (5) Medical equipment
(6) Transportation equipment (automobiles, trains, ships, etc.)
(7) Traffic signal equipment
(8) Disaster prevention / Crime prevention equipment (9) Data-processing equipment
(10) Applications of similar complexity or with reliability requirements comparable to the applications
listed in the above
3. Be sure to provide an appropriate fail-safe function on your product to prevent a second damage that may
be caused by the abnormal function or the failure of our product.
Notice
1. Do not apply abnormal voltage exceeding the specified maximum value. Because they may deteriorate or
destroy PTC element.
2. Use this product within the specified temperature. A higher temperature may deteriorate the characteristic
or material.
3. The body of this product is not insulated. Please keep an adequate distance to surrounding components
and wiring.
4. Storage conditions
To keep solderability from declining, following storage condition is recommended.
(1) Condition Temperature : -10 to +40°C
Humidity
: Less than 85%RH (not dewing condition)
(2) Term: Please use this POSISTOR within 6 months after shipment by first-in and first-out stocking system.
(3) Handling after seal open: After unpacking of the minimum package, reseal it promptly or store it
inside a sealed container with a drying agent.
(4) Place: Do not store this product in corrosive gas (SOx, Cl etc) or under sunlight.
This information may be changed without a previous notice.
Murata Manufacturing Co., Ltd.
CE-018U
5. Solder and Flux
(1) Solder Paste
Use Sn:Pb=60:40wt% ,Sn:Pb=63:37wt%, Sn:Ag:Cu=96.5:3.0:0.5wt% or equivalent type of solder paste.
Do not use strong acidic flux (with halide content exceeding 0.2wt%).
Use of the solder containing Zn may reduce adhesive strength.
When you use the solder containing Zn, please contact us in advance.
For your reference, we are using
‘63Sn/37Pb RMA9086 90-3-M18’, manufactured by Alpha Metals Japan Ltd.,
’96.5Sn/3.0Ag/0.5Cu M705-GRN360-K2-V’, manufactured by Senju Metal Industry Co.,LTD.
for any Internal tests of this product.
(2) Flux
Use rosin type flux in soldering process.
If below flux is used, some problems might be caused in the product characteristics and reliability.
Please do not use below flux.
・Strong
acidic flux (with halide content exceeding 0.2wt%).
・Water-soluble
flux(*Water-soluble flux can be defined as non rosin type flux including wash-type
flux and non-wash-type flux.)
6. For removing the flux after soldering, observe the following points in order to avoid deterioration of the
characteristics or any change of the external electrodes quality.
(1) Cleaning Conditions
Solvent
Dipping Cleaning
Ultrasonic Cleaning
Less than 5 min.
A sufficient cleaning shall
Less than 1 min.
at room temp.
be applied to remove flux
20W/L max.
2-propanol
or
completely.
Frequency of several 10 kHz
Less than 2 min.
to several 100 kHz.
at 40°C max.
(2) Drying: After cleaning, dry promptly this product.
7. In your mounting process, observe the following points in order to avoid deterioration of the
characteristics or destruction of this product. The mounting quality of this product may also be affected by
the mounting conditions, shown the points below.
This product is for only reflow soldering. Flow soldering shall not be allowed.
Please mount this product by soldering. When mounted by other methods, such as conductive adhesives,
please contact us in advance.
(1) Standard Land Size
Too big land size gives too much solder paste on the land. It may cause destruction of this product,
because of the mechanical stress especially in the case of board bending.
b
a
b
c
1.0~1.2
0.5~0.7
1.0~1.2
a
c
(mm)
(2) Printing Conditions of Solder Paste
i. Standard thickness of solder paste printing shall be from 0.10 to 0.15 mm.
ii. After soldering, the solder fillet shall be a height from 0.2 mm to the thickness of this product.
(See the figures below.)
iii. Too much solder gives too strong mechanical stress to this product, such stress may cause cracking or
any mechanical damage. And also, it can destroy the electrical performance of this product.
This information may be changed without a previous notice.
Murata Manufacturing Co., Ltd.
CE-018U
(3) Allowable Soldering Temperature and Time
i. Solder within the temperature and time combinations, indicated by the slanted lines in the following
graphs.
ii. The excessive soldering conditions may cause dissolution of metallization or deterioration of
solder-wetting on the external electrode.
iii. In case of repeated soldering, the total accumulated soldering time should be within the range shown
below figure. (For example, Reflow peak temperature : 250°C, twice → The total accumulated soldering
time at 250°C is within 20sec.)
<Allowable Reflow Soldering Temp. and Time>
270
260
Temperature ( °C )
250
240
230
220
210
200
0
10
20 30 40
Time (sec.)
50
60
(4) Standard Temperature Profile for Soldering
i. Insufficient preheating may cause a crack on ceramic body.
Difference between preheating temperature and maximum temperature in the profile shall be 100 °C.
ii.Rapid cooling by dipping in solvent or by other means is not recommended.
<Reflow Soldering Condition>
Preheating (in air)
Soldering
Gradual cooling
(in air)
Temperature( °C )
240°C
200
Preheating: 150 +/- 10 °C
1min. to 2 min.
Soldering: 240 °C
20sec.
#:
In case of repeated soldering, the total
accumulated soldering time should be
within the range shown above figure (3).
100
0
~
~
1~2 min.
#
20sec.
(5) There is a fear of unexpected failures (tombstone, insufficient solder-wetting, etc.) in your
mounting process, caused by the mounting conditions. Please evaluate if this product is
correctly mounted under your mounting conditions.
(6) Conditions with Soldering Iron
When hand soldering by iron is applied, be sure to keep following conditions.
Item
Conditions
Preheating
at 150°C for 1 to 2 minute
Temperature of Iron-tip
350°C max.
Soldering Iron Wattage
30W max.
Diameter of Iron-tip
3mm dia. max.
Soldering Time
5sec. max.
Solder
H60A (Sn:Pb=60:40wt%) type ,
H63A (Sn:Pb=63:37wt%) type, Sn:Ag:Cu=96.5:3.0:0.5wt%
or equivalent type.
Flux
Do not use strong acidic flux (with halide content exceeding 0.2wt%).
Caution
・Do
not allow the iron-tip to directly touch the ceramic body.
・Preheat
the ceramic body and mounting board.
8. Do not give this product a strong press-force nor a mechanical shock. Because such
mechanical forces may cause cracking or chipping of this ceramic product.
9. Rapid cooling or heating during soldering is not recommended.
Such treatment may destroy the element.
This information may be changed without a previous notice.
Murata Manufacturing Co., Ltd.
CE-018U
PCB设计
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