Datasheet> 器件分类 > 模拟混合信号IC> 信号电路> 5962-8971001XC

文档预览

5962-8971001XC: 产品描述IC 16-CHANNEL, SGL ENDED MULTIPLEXER, CDIP28, CERDIP-28, Multiplexer or Switch; 产品类别模拟混合信号IC 信号电路; 文件大小113KB，共13页; 制造商ADI(亚德诺半导体); 官网地址https://www.analog.com

下载文档详细参数选型对比全文预览

5962-8971001XC概述

IC 16-CHANNEL, SGL ENDED MULTIPLEXER, CDIP28, CERDIP-28, Multiplexer or Switch

5962-8971001XC规格参数

参数名称	属性值
是否无铅	含铅
是否Rohs认证	不符合
零件包装代码	DIP
包装说明	DIP,
针数	28
Reach Compliance Code	not_compliant
Is Samacsys	N
模拟集成电路 - 其他类型	SINGLE-ENDED MULTIPLEXER
JESD-30 代码	R-GDIP-T28
JESD-609代码	e0
标称负供电电压 (Vsup)	-15 V
信道数量	16
功能数量	1
端子数量	28
最大通态电阻 (Ron)	450 Ω
最高工作温度	125 °C
最低工作温度	-55 °C
封装主体材料	CERAMIC, GLASS-SEALED
封装代码	DIP
封装形状	RECTANGULAR
封装形式	IN-LINE
峰值回流温度（摄氏度）	NOT SPECIFIED
认证状态	Not Qualified
座面最大高度	5.72 mm
最大供电电流 (Isup)	1.5 mA
标称供电电压 (Vsup)	15 V
表面贴装	NO
最长断开时间	400 ns
最长接通时间	400 ns
技术	CMOS
温度等级	MILITARY
端子面层	Tin/Lead (Sn63Pb37)
端子形式	THROUGH-HOLE
端子节距	2.54 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	15.24 mm
Base Number Matches	1

文档预览

下载PDF文档

全文
预览

REVISIONS

LTR

DESCRIPTION

Changes in accordance with NOR 5962-R008-92

Changes in footnotes at the end of table I. Editorial changes

throughout.

DATE

(YR-MO-DA)

91-10-18

92-10-29

APPROVED

M. A. Frye

THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Rick C. Officer

DEFENSE ELECTRONICS SUPPLY CENTER

DAYTON, OHIO 45444

STANDARDIZED

MILITARY

DRAWING

THIS DRAWING IS

AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

CHECKED BY

Charles E. Besor

APPROVED BY

Michael A. Frye

MICROCIRCUIT, LINEAR, CMOS LATCHED

8- AND 16-CHANNEL ANALOG

MULTIPLEXERS, MONOLITHIC SILICON

SIZE

CAGE CODE

DRAWING APPROVAL DATE

90-08-08

REVISION LEVEL

SHEET

AMSC N/A

67268

5962-89710

DESC FORM 193

JUL 91

DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.

5962-E660-92

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and bulletin. Unless otherwise specified, the following specification, standards, and

bulletin of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the

solicitation, form a part of this drawing to the extent specified herein.

SPECIFICATION

MILITARY

MIL-M-38510 - Microcircuits, General Specification for.

STANDARDS

MILITARY

MIL-STD-883 - Test Methods and Procedures for Microelectronics.

MIL-STD-1835 - Microcircuit Case Outlines.

BULLETIN

MILITARY

MIL-BUL-103 - List of Standardized Military Drawings (SMD's).

(Copies of the specification, standards, and bulletin required by manufacturers in connection with specific acquisition functions

should be obtained from the contracting activity or as directed by the contracting activity.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of

this drawing shall take precedence.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements shall be in accordance with 1.2.1 of MIL-STD-883, "Provisions for the

use of MIL-STD-883 in conjunction with compliant non-JAN devices" and as specified herein.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in

MIL-M-38510 and herein.

3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1.

3.2.2 Truth tables. The truth tables shall be as specified on figure 2.

3.2.3 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.

3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as

specified in table I and apply over the full ambient operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests

for each subgroup are described in table I.

3.5 Marking. Marking shall be in accordance with MIL-STD-883 (see 3.1 herein). The part shall be marked with the PIN listed in

1.2 herein. In addition, the manufacturer's PIN may also be marked as listed in MIL-BUL-103 (see 6.6 herein).

SIZE

STANDARDIZED

MILITARY DRAWING

DEFENSE ELECTRONICS SUPPLY CENTER

DAYTON, OHIO 45444

DESC FORM 193A

JUL 91

REVISION LEVEL

5962-89710

SHEET

5962-8971001XC相似产品对比

	5962-8971001XC	5962-89710013B	5962-8971002XA	5962-8971002XC	ATS-14G-15-C2-R0	5962-8971001XB	5962-89710023C	5962-89710023A	5962-89710013C
描述	IC 16-CHANNEL, SGL ENDED MULTIPLEXER, CDIP28, CERDIP-28, Multiplexer or Switch	IC 16-CHANNEL, SGL ENDED MULTIPLEXER, CQCC28, CERAMIC, LCC-28, Multiplexer or Switch	8-CHANNEL, DIFFERENTIAL MULTIPLEXER, CDIP28, CERDIP-28	IC 8-CHANNEL, DIFFERENTIAL MULTIPLEXER, CDIP28, CERDIP-28, Multiplexer or Switch	pushPIN™ HS ASMBLY,FINE-PITCH,XCUT, HOLE PATTERN:4-CORNER,BLUE,T766	IC 16-CHANNEL, SGL ENDED MULTIPLEXER, CDIP28, CERDIP-28, Multiplexer or Switch	IC 8-CHANNEL, DIFFERENTIAL MULTIPLEXER, CQCC28, CERAMIC, LCC-28, Multiplexer or Switch	IC 8-CHANNEL, DIFFERENTIAL MULTIPLEXER, CQCC28, CERAMIC, LCC-28, Multiplexer or Switch	IC 16-CHANNEL, SGL ENDED MULTIPLEXER, CQCC28, CERAMIC, LCC-28, Multiplexer or Switch
是否无铅	含铅	含铅	含铅	-	-	含铅	-	含铅	含铅
是否Rohs认证	不符合	不符合	不符合	不符合	-	不符合	不符合	不符合	不符合
零件包装代码	DIP	QLCC	DIP	DIP	-	DIP	QLCC	QLCC	QLCC
包装说明	DIP,	QCCN,	CERDIP-28	CERDIP-28	-	DIP,	CERAMIC, LCC-28	QCCN, LCC28,.45SQ	QCCN,
针数	28	28	28	28	-	28	28	28	28
Reach Compliance Code	not_compliant	compliant	not_compliant	not_compliant	-	not_compliant	compliant	unknown	compliant
模拟集成电路 - 其他类型	SINGLE-ENDED MULTIPLEXER	SINGLE-ENDED MULTIPLEXER	DIFFERENTIAL MULTIPLEXER	DIFFERENTIAL MULTIPLEXER	-	SINGLE-ENDED MULTIPLEXER	DIFFERENTIAL MULTIPLEXER	DIFFERENTIAL MULTIPLEXER	SINGLE-ENDED MULTIPLEXER
JESD-30 代码	R-GDIP-T28	S-CQCC-N28	R-GDIP-T28	R-GDIP-T28	-	R-GDIP-T28	S-CQCC-N28	S-CQCC-N28	S-CQCC-N28
JESD-609代码	e0	-	e0	e0	-	e0	e0	e0	-
标称负供电电压 (Vsup)	-15 V	-15 V	-15 V	-15 V	-	-15 V	-15 V	-15 V	-15 V
信道数量	16	16	8	8	-	16	8	8	16
功能数量	1	1	1	1	-	1	1	1	1
端子数量	28	28	28	28	-	28	28	28	28
最大通态电阻 (Ron)	450 Ω	450 Ω	450 Ω	450 Ω	-	450 Ω	450 Ω	450 Ω	450 Ω
最高工作温度	125 °C	125 °C	125 °C	125 °C	-	125 °C	125 °C	125 °C	125 °C
最低工作温度	-55 °C	-55 °C	-55 °C	-55 °C	-	-55 °C	-55 °C	-55 °C	-55 °C
封装主体材料	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, GLASS-SEALED	CERAMIC, GLASS-SEALED	-	CERAMIC, GLASS-SEALED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
封装代码	DIP	QCCN	DIP	DIP	-	DIP	QCCN	QCCN	QCCN
封装形状	RECTANGULAR	SQUARE	RECTANGULAR	RECTANGULAR	-	RECTANGULAR	SQUARE	SQUARE	SQUARE
封装形式	IN-LINE	CHIP CARRIER	IN-LINE	IN-LINE	-	IN-LINE	CHIP CARRIER	CHIP CARRIER	CHIP CARRIER
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	220	NOT SPECIFIED
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	Not Qualified	Not Qualified	Qualified	Not Qualified
座面最大高度	5.72 mm	2.54 mm	5.72 mm	5.72 mm	-	5.72 mm	2.54 mm	2.54 mm	2.54 mm
最大供电电流 (Isup)	1.5 mA	1.5 mA	1.5 mA	1.5 mA	-	1.5 mA	1.5 mA	1.5 mA	1.5 mA
标称供电电压 (Vsup)	15 V	15 V	15 V	15 V	-	15 V	15 V	15 V	15 V
表面贴装	NO	YES	NO	NO	-	NO	YES	YES	YES
最长断开时间	400 ns	400 ns	400 ns	400 ns	-	400 ns	400 ns	400 ns	400 ns
最长接通时间	400 ns	400 ns	400 ns	400 ns	-	400 ns	400 ns	400 ns	400 ns
技术	CMOS	CMOS	CMOS	CMOS	-	CMOS	CMOS	CMOS	CMOS
温度等级	MILITARY	MILITARY	MILITARY	MILITARY	-	MILITARY	MILITARY	MILITARY	MILITARY
端子面层	Tin/Lead (Sn63Pb37)	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	Tin/Lead (Sn63Pb37)	TIN LEAD	Tin/Lead (Sn/Pb)	-
端子形式	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	-	THROUGH-HOLE	NO LEAD	NO LEAD	NO LEAD
端子节距	2.54 mm	1.27 mm	2.54 mm	2.54 mm	-	2.54 mm	1.27 mm	1.27 mm	1.27 mm
端子位置	DUAL	QUAD	DUAL	DUAL	-	DUAL	QUAD	QUAD	QUAD
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	NOT SPECIFIED	NOT SPECIFIED	30	NOT SPECIFIED
宽度	15.24 mm	11.43 mm	15.24 mm	15.24 mm	-	15.24 mm	11.43 mm	11.43 mm	11.43 mm
Base Number Matches	1	1	1	1	-	1	1	1	-

5962-8971001XC

5962-8971001XC概述

5962-8971001XC规格参数

文档预览

5962-8971001XC相似产品对比

推荐资源