电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

IS61LPD51218A-200B3I

产品描述Cache SRAM, 512KX18, 3.1ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, PLASTIC, BGA-165
产品类别存储    存储   
文件大小312KB,共32页
制造商Integrated Silicon Solution ( ISSI )
下载文档 详细参数 全文预览

IS61LPD51218A-200B3I概述

Cache SRAM, 512KX18, 3.1ns, CMOS, PBGA165, 13 X 15 MM, 1 MM PITCH, PLASTIC, BGA-165

IS61LPD51218A-200B3I规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
零件包装代码BGA
包装说明TBGA, BGA165,11X15,40
针数165
Reach Compliance Codecompliant
ECCN代码3A991.B.2.A
Is SamacsysN
最长访问时间3.1 ns
其他特性PIPELINED ARCHITECTURE
最大时钟频率 (fCLK)200 MHz
I/O 类型COMMON
JESD-30 代码R-PBGA-B165
JESD-609代码e0
长度15 mm
内存密度9437184 bit
内存集成电路类型CACHE SRAM
内存宽度18
功能数量1
端子数量165
字数524288 words
字数代码512000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织512KX18
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码TBGA
封装等效代码BGA165,11X15,40
封装形状RECTANGULAR
封装形式GRID ARRAY, THIN PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
电源2.5/3.3,3.3 V
认证状态Not Qualified
座面最大高度1.2 mm
最大待机电流0.06 A
最小待机电流3.14 V
最大压摆率0.275 mA
最大供电电压 (Vsup)3.465 V
最小供电电压 (Vsup)3.135 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子面层Tin/Lead (Sn/Pb)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度13 mm
Base Number Matches1

文档预览

下载PDF文档
IS61VPD25636A IS61LPD25636A
IS61VPD51218A IS61LPD51218A
256K x 36, 512K x 18
9 Mb SYNCHRONOUS PIPELINED,
DOUBLE CYCLE DESELECT STATIC RAM
ISSI
DECEMBER 2006
®
FEATURES
• Internal self-timed write cycle
• Individual Byte Write Control and Global Write
• Clock controlled, registered address, data and
control
• Burst sequence control using MODE input
• Three chip enable option for simple depth
expansion and address pipelining
• Common data inputs and data outputs
• Auto Power-down during deselect
• Double cycle deselect
• Snooze MODE for reduced-power standby
• JTAG Boundary Scan for PBGA package
• Power Supply
LPD: V
DD
3.3V + 5%, V
DDQ
3.3V/2.5V + 5%
VPD: V
DD
2.5V + 5%, V
DDQ
2.5V + 5%
• JEDEC 100-Pin TQFP,
119-pin PBGA and 165-pin PBGA package
• Lead-free available
DESCRIPTION
The
ISSI
IS61LPD/VPD25636A and IS61LPD/VPD51218A
are high-speed, low-power synchronous static RAMs de-
signed to provide burstable, high-performance memory for
communication and networking applications. The IS61LPD/
VPD25636A is organized as 262,144 words by 36 bits, and
the IS61LPD/VPD51218A is organized as 524,288 words
by 18 bits. Fabricated with
ISSI
's advanced CMOS technol-
ogy, the device integrates a 2-bit burst counter, high-speed
SRAM core, and high-drive capability outputs into a single
monolithic circuit. All synchronous inputs pass through
registers controlled by a positive-edge-triggered single
clock input.
Write cycles are internally self-timed and are initiated by the
rising edge of the clock input. Write cycles can be one to four
bytes wide as controlled by the write control inputs.
Separate byte enables allow individual bytes to be written.
The byte write operation is performed by using the byte
write enable (BWE) input combined with one or more
individual byte write signals (BWx). In addition, Global
Write (GW) is available for writing all bytes at one time,
regardless of the byte write controls.
Bursts can be initiated with either
ADSP
(Address Status
Processor) or
ADSC
(Address Status Cache Controller)
input pins. Subsequent burst addresses can be generated
internally and controlled by the
ADV
(burst address
advance) input pin.
The mode pin is used to select the burst sequence order,
Linear burst is achieved when this pin is tied LOW.
Interleave burst is achieved when this pin is tied HIGH or
left floating.
FAST ACCESS TIME
Symbol
t
KQ
t
KC
Parameter
Clock Access Time
Cycle Time
Frequency
250
2.6
4
250
200
3.1
5
200
Units
ns
ns
MHz
Copyright © 2006 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without notice. ISSI assumes no liability
arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version of this device specification before relying on any
published information and before placing orders for products.
Integrated Silicon Solution, Inc. — 1-800-379-4774
Rev. B
12/13/06
1
TMDSSOLARUINVKIT_v100中DC-AC逆变这个是什么电路
本帖最后由 idealpursuer 于 2014-11-4 22:07 编辑 177602 图中D33,D2,D3,D4有什么作用,为什么L7和L11要这样接,而不是直接输出共模滤波,谢谢。 ...
idealpursuer 微控制器 MCU
基于TMS320F2812的交流电机控制系统设计
基于TMS320F2812的交流电机控制系统设计 352976 352977 ...
Jacktang DSP 与 ARM 处理器
#闲置市集# 4G模块
439116出售4G模块,3000芯币,邮费自理。 模块的imei数据有点问题,与原来的对接不上。 ...
lehuijie 淘e淘
关于CRC-16的问题
CRC-16-IBM 的多项式为 x16 +x15 + x2 + 1 为什么维基百科给出的表达式有 0x8005 or 0xA001 (0x4003) 这几个? 正确算出来应该是0x18005才对,这个有什么说法吗? 维基百科:http://zh.wiki ......
practiceiqx 单片机
怎么能够学好驱动及linux内核及各种常见的外设
2年Android上层开发,3年系统层framework开发,现在学习驱动就是看系统又有的源码,c语言基本能看懂,但要自己写驱动感觉有点难度,有什么方法可以快速学好驱动及各种外设调试? 是要买个开发板 ......
WinstonLu Linux开发
向大家推荐论坛里面的一个帖子,很精练也很实在
帖子位于【TI模拟技术体验】版块,链接如下: 《硬件设计中的30个错误想法与原因分析》 https://bbs.eeworld.com.cn/viewthread.php?tid=372210&page=1&extra=#pid1475341 绝对是经验之谈, ......
wstt 微控制器 MCU

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 72  1522  1780  1434  2633  32  5  2  37  17 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved