Multilayer Ceramic Chip Capacitors
FEATURES
• CRACK RESISTANT TERMINATION
• SOFT TERMINATION, OPEN MODE FAILURE
• WIDE VOLTAGE RANGE (16V TO 5KV)
• HIGH CAPACITANCE (UP TO 10µF)
• RoHS COMPLIANT
• SAC SOLDER COMPATIBLE**
Temperature Coefficient
Capacitance Range
NMC-P Series
RoHS
Compliant
includes all homogeneous materials
*See Part Number System for Details
NPO
X7R
2.2pF ~ 0.22µF
180pF ~ 10µF
For 2.2pF ~ 10pF: ±0.1pF (B), ±0.25pF (C), ±0.5pF (D), ±1pF (F)
Capacitance Tolerance
±10% (K) & ±20% (M)
Above 10pF: ±1% (F), ±2% (G), ±5% (J), ±10% (K)
Operating Temperature Range
-55°C ~ +125°C
Temperature Characteristics
±30ppm/°C
±15%
∆
Cap.
Rated Voltages
16Vdc, 25Vdc, 50Vdc, 100Vdc, 200Vdc, 250Vdc, 500Vdc, 630Vdc, 1KVdc, 2Kvdc, 3Kvdc & 5Kvdc
Q = > 1000 (more then 30pF)*
2.5% max. @ 1KHz, 1.0V ± 0.2Vrms
Q or Dissipation Factor
Q = > 400 + 20 x C in pF (30pF and below)*
insulation Resistance
10,000Megohm or 500Megohm/µF whichever is less @ +25°C
200% of rated voltage for 5 seconds, 50mA max. (16V ~ 250V)
Dielectric Withstanding Voltage
150% of rated voltage for 5 seconds, 50mA max. (500V ~ 630V)
120% of rated voltage for 5 seconds, 50mA max. (1KV ~ 5KV)
*Test Frequency & Voltage: Up to 100pF 1MHz/1.0Vrms, Above 100pF 1KHz/1.0Vrms
**Reflow soldering is recommended. Contact NIC regarding the use of other soldering methods.
PART NUMBER SYSTEM
NMC-P 1206 X7R 105 K 50 TRP or TRPLP F
RoHS Compliant
Tape & Reel (Plastic Carrier)
Tape & Reel (Paper Carrier)
Voltage (Vdc)
Capacitance Tolerance Code (see chart)
Capacitance Code, expressed in pF, first 2 digits are
significant, 3rd digit is no. of zeros
Temperature Characteristic (NPO or X7R)
Size Code (see chart)
Series
CONSTRUCTION
Base layer (Cu 50V ~ 250V)
(Ag 500V ~ up)
Flexible layer (Polymer)
Barrier layer (Ni)
Finish layer (Sn)
OPEN MODE FAILURE AS A RESULT OF BENDING STRESS
Termination Separation
(Open Failure Mode)
®
NIC COMPONENTS CORP.
NMC-P rev. 1 05302007
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
15
能源基础设施
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
