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29F002

产品描述2M-BIT [256K x 8] CMOS FLASH MEMORY
文件大小923KB,共49页
制造商Macronix
官网地址http://www.macronix.com/en-us/Pages/default.aspx
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29F002概述

2M-BIT [256K x 8] CMOS FLASH MEMORY

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MX29F002/002N
2M-BIT [256K x 8] CMOS FLASH MEMORY
FEATURES
262,144x 8 only
Fast access time: 55/70/90/120ns
Low power consumption
- 30mA maximum active current(5MHz)
- 1uA typical standby current
Programming and erasing voltage 5V ± 10%
Command register architecture
- Byte Programming (7us typical)
- Sector Erase (16K-Byte x1, 8K-Byte x 2, 32K-Byte
x1, and 64K-Byte x 3)
Auto Erase (chip & sector) and Auto Program
- Automatically erase any combination of sectors or the
whole chip with Erase Suspend capability.
- Automatically programs and verifies data at specified
address
Erase Suspend/Erase Resume
- Suspends an erase operation to read data from, or
program data to, a sector that is not being erased, then
resumes the erase operation.
Status Reply
- Data polling & Toggle bit for detection of program and
erase cycle completion.
Sector protection
- Hardware method to disable any combination of
sectors from program or erase operations
- Sector protect/unprotect for 5V only system or 5V/
12V system
100,000 minimum erase/program cycles
Latch-up protected to 100mA from -1 to VCC+1V
Boot Code Sector Architecture
- T = Top Boot Sector
- B = Bottom Boot Sector
Hardware RESET pin(only for 29F002T/B)
- Resets internal state machine to read mode
Low VCC write inhibit is equal to or less than 3.2V
Package type:
- 32-pin PDIP
- 32-pin PLCC
- 32-pin TSOP (Type 1)
20 years data retention
GENERAL DESCRIPTION
The MX29F002T/B is a 2-mega bit Flash memory organ-
ized as 256K bytes of 8 bits only. MXIC's Flash memories
offer the most cost-effective and reliable read/write non-
volatile random access memory. The MX29F002T/B is
packaged in 32-pin PDIP,PLCC and 32-pin TSOP(I). It is
designed to be reprogrammed and erased in-system or in-
standard EPROM programmers.
The standard MX29F002T/B offers access time as fast as
55ns, allowing operation of high-speed microprocessors
without wait states. To eliminate bus contention, the
MX29F002T/B has separate chip enable (CE) and output
enable (OE) controls.
MXIC's Flash memories augment EPROM functionality
with in-circuit electrical erasure and programming. The
MX29F002T/B uses a command register to manage this
functionality. The command register allows for 100% TTL
level control inputs and fixed power supply levels during
erase and programming, while maintaining maximum
EPROM compatibility.
MXIC's Flash technology reliably stores memory contents
even after 100,000 erase and program cycles. The MXIC
cell is designed to optimize the erase and programming
mechanisms. In addition, the combination of advanced
tunnel oxide processing and low internal electric fields for
erase and programming operations produces reliable
cycling. The MX29F002T/B uses a 5.0V ± 10% VCC
supply to perform the High Reliability Erase and auto
Program/Erase algorithms.
The highest degree of latch-up protection is achieved with
MXIC's proprietary non-epi process. Latch-up protection
is proved for stresses up to 100 milliamps on address and
data pin from -1V to VCC + 1V.
P/N: PM0547
1
REV. 1.1, JUN. 14, 2001

29F002相似产品对比

29F002 M29F002 IMX29F002BPI-70 IMX29F002BTI-70 IMX29F002TQI-70
描述 2M-BIT [256K x 8] CMOS FLASH MEMORY 2M-BIT [256K x 8] CMOS FLASH MEMORY 2M-BIT [256K x 8] CMOS FLASH MEMORY 2M-BIT [256K x 8] CMOS FLASH MEMORY 2M-BIT [256K x 8] CMOS FLASH MEMORY
厂商名称 - - Macronix Macronix Macronix
包装说明 - - DIP, DIP32,.6 TSSOP, TSSOP32,.8,20 QCCJ, LDCC32,.5X.6
Reach Compliance Code - - unknown unknown unknown
最长访问时间 - - 70 ns 70 ns 70 ns
启动块 - - BOTTOM BOTTOM TOP
命令用户界面 - - YES YES YES
数据轮询 - - YES YES YES
耐久性 - - 100000 Write/Erase Cycles 100000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 代码 - - R-PDIP-T32 R-PDSO-G32 R-PQCC-J32
内存密度 - - 2097152 bit 2097152 bit 2097152 bit
内存集成电路类型 - - FLASH FLASH FLASH
内存宽度 - - 8 8 8
部门数/规模 - - 1,2,1,3 1,2,1,3 1,2,1,3
端子数量 - - 32 32 32
字数 - - 262144 words 262144 words 262144 words
字数代码 - - 256000 256000 256000
最高工作温度 - - 85 °C 85 °C 85 °C
最低工作温度 - - -40 °C -40 °C -40 °C
组织 - - 256KX8 256KX8 256KX8
封装主体材料 - - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 - - DIP TSSOP QCCJ
封装等效代码 - - DIP32,.6 TSSOP32,.8,20 LDCC32,.5X.6
封装形状 - - RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 - - IN-LINE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER
并行/串行 - - PARALLEL PARALLEL PARALLEL
电源 - - 5 V 5 V 5 V
认证状态 - - Not Qualified Not Qualified Not Qualified
部门规模 - - 16K,8K,32K,64K 16K,8K,32K,64K 16K,8K,32K,64K
最大待机电流 - - 0.000005 A 0.000005 A 0.000005 A
最大压摆率 - - 0.05 mA 0.05 mA 0.05 mA
标称供电电压 (Vsup) - - 5 V 5 V 5 V
表面贴装 - - NO YES YES
技术 - - CMOS CMOS CMOS
温度等级 - - INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子形式 - - THROUGH-HOLE GULL WING J BEND
端子节距 - - 2.54 mm 0.5 mm 1.27 mm
端子位置 - - DUAL DUAL QUAD
切换位 - - YES YES YES
类型 - - NOR TYPE NOR TYPE NOR TYPE
Base Number Matches - - 1 1 1

 
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