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PRODUCT PREVIEW
3 VOLT ADVANCED+ BOOT BLOCK
8-, 16-, 32-MBIT
FLASH MEMORY FAMILY
28F008C3, 28F016C3, 28F032C3
28F800C3, 28F160C3, 28F320C3
Flexible SmartVoltage Technology
2.7 V–3.6 V Read/Program/Erase
2.7 V or 1.65 V I/O Option Reduces
Overall System Power
12 V for Fast Production
Programming
High Performance
2.7 V–3.6 V: 90 ns Max Access Time
3.0 V–3.6 V: 80 ns Max Access Time
Optimized Architecture for Code Plus
Data Storage
Eight 8-Kbyte Blocks,
Top or Bottom Locations
Up to Sixty-Three 64-KB Blocks
Fast Program Suspend Capability
Fast Erase Suspend Capability
Flexible Block Locking
Lock/Unlock Any Block
Full Protection on Power-Up
WP# Pin for Hardware Block
Protection
V
PP
=
GND Option
V
CC
Lockout Voltage
Low Power Consumption
9 mA Typical Read Power
10 µA Typical Standby Power with
Automatic Power Savings Feature
Extended Temperature Operation
–40 °C to +85 °C
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Easy-12 V
Faster Production Programming
No Additional System Logic
128-bit Protection Register
64-bit Unique Device Identifier
64-bit User Programmable OTP
Cells
Extended Cycling Capability
Minimum 100,000 Block Erase
Cycles
Flash Data Integrator Software
Flash Memory Manager
System Interrupt Manager
Supports Parameter Storage,
Streaming Data (e.g., voice)
Automated Word/Byte Program and
Block Erase
Command User Interface
Status Registers
SRAM-Compatible Write Interface
Cross-Compatible Command Support
Intel Basic Command Set
Common Flash Interface
x 16 for High Performance
48-Ball
µBGA*
Package
48-Lead TSOP Package
x 8 I/O for Space Savings
48-Ball
µBGA*
Package
40-Lead TSOP Package
0.25
µ
ETOX™ VI Flash Technology
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The 0.25 µm 3 Volt Advanced+ Boot Block, manufactured on Intel’s latest 0.25 µ technology, represents a
feature-rich solution at overall lower system cost. Smart 3 flash memory devices incorporate low voltage
capability (2.7 V read, program and erase) with high-speed, low-power operation. Flexible block locking
allows any block to be independently locked or unlocked. Add to this the Intel-developed Flash Data
Integrator (FDI) software and you have a cost-effective, flexible, monolithic code plus data storage solution on
the market today. 3 Volt Advanced+ Boot Block products will be available in 48-lead TSOP, 40-lead TSOP,
and 48-ball µBGA* packages. Additional information on this product family can be obtained by accessing
Intel’s WWW page: http://www.intel.com/design/flcomp.
May 1998
Order Number: 290645-001
Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or
otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions of
Sale for such products, Intel assumes no liability whatsoever, and Intel disclaims any express or implied warranty, relating to
sale and/or use of Intel products including liability or warranties relating to fitness for a particular purpose, merchantability, or
infringement of any patent, copyright or other intellectual property right. Intel products are not intended for use in medical, life
saving, or life sustaining applications.
Intel may make changes to specifications and product descriptions at any time, without notice.
The 28F008C3, 28F016C3, 28F032C3, 28F800C3, 28F160C3, 28F320C3 may contain design defects or errors known as
errata which may cause the product to deviate from published specifications. Current characterized errata are available on
request.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
Copies of documents which have an ordering number and are referenced in this document, or other Intel literature, may be
obtained from:
Intel Corporation
P.O. Box 5937
Denver, CO 80217-9808
or call 1-800-548-4725
or visit Intel’s website at http:\\www.intel.com
COPYRIGHT © INTEL CORPORATION 1998
*
Third-party brands and names are the property of their respective owners.
CG-041493
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CONTENTS
PAGE
1.0 INTRODUCTION .............................................5
1.1 3 Volt Advanced+ Boot Block Flash Memory
Enhancements ............................................5
1.2 Product Overview.........................................6
2.0 PRODUCT DESCRIPTION..............................6
2.1 Package Pinouts ..........................................6
2.2 Block Organization .....................................10
2.2.1 Parameter Blocks ................................10
2.2.2 Main Blocks .........................................10
3.0 PRINCIPLES OF OPERATION .....................11
3.1 Bus Operation ............................................11
3.1.1 Read....................................................11
3.1.2 Output Disable.....................................11
3.1.3 Standby ...............................................11
3.1.4 Reset...................................................12
3.1.5 Write....................................................12
3.2 Modes of Operation....................................12
3.2.1 Read Array ..........................................12
3.2.2 Read Configuration..............................13
3.2.3 Read Status Register ..........................13
3.2.3.1 Clearing the Status Register .........13
3.2.4 Read Query .........................................13
3.2.5 Program Mode.....................................14
3.2.5.1 Suspending and Resuming
Program.......................................14
3.2.6 Erase Mode .........................................14
3.2.6.1 Suspending and Resuming Erase.15
3.3 Flexible Block Locking................................19
3.3.1 Locking Operation ...............................19
3.3.2 Locked State .......................................19
3.3.3 Unlocked State ....................................19
3.3.4 Lock-Down State .................................19
3.3.5 Reading a Block’s Lock Status ............20
3.3.6 Locking Operations during Erase
Suspend.............................................20
3.3.7 Status Register Error Checking ...........20
3 VOLT ADVANCED+ BOOT BLOCK
PAGE
3.4 128-Bit Protection Register.........................21
3.4.1 Reading the Protection Register ..........21
3.4.2 Programming the Protection Register ..21
3.4.3 Locking the Protection Register ...........22
3.5 V
PP
Program and Erase Voltages...............22
3.5.1 Easy-12 V Operation for Fast
Manufacturing Programming...............22
3.5.2 V
PP
≤
V
PPLK
for Complete Protection ...22
3.5.3 V
PP
Usage ...........................................22
3.6 Power Consumption ...................................23
3.6.1 Active Power (Program/Erase/Read) ...23
3.6.2 Automatic Power Savings (APS) .........23
3.6.3 Standby Power ....................................23
3.6.4 Deep Power-Down Mode.....................24
3.7 Power-Up/Down Operation.........................24
3.7.1 RP# Connected to System Reset ........24
3.7.2 V
CC
, V
PP
and RP# Transitions .............24
3.8 Power Supply Decoupling ..........................24
4.0 ABSOLUTE MAXIMUM RATINGS ................25
4.2 Operating Conditions..................................25
4.3 Capacitance ...............................................26
4.4 DC Characteristics .....................................26
4.5 AC Characteristics—Read Operations—
Extended Temperature..............................30
4.6 AC Characteristics—Write Operations—
Extended Temperature..............................32
4.7 Erase and Program Timings .......................33
4.8 Reset Operations .......................................35
5.0 ORDERING INFORMATION..........................36
6.0 ADDITIONAL INFORMATION .......................37
APPENDIX A: WSM Current/Next States ..........38
APPENDIX B: Program/Erase Flowcharts ........40
APPENDIX C: Common Flash Interface Query
Structure ......................................................46
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PRODUCT PREVIEW
3 VOLT ADVANCED+ BOOT BLOCK
APPENDIX D: Architecture Block Diagram ......52
APPENDIX E: Word-Wide Memory Map
Diagrams .....................................................53
APPENDIX F: Byte-Wide Memory Map
Diagrams .....................................................55
APPENDIX G: Device ID Table ..........................57
APPENDIX H: Protection Register
Addressing ..................................................58
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REVISION HISTORY
Date of
Revision
05/12/98
Version
-001
Original version
Description
4
PRODUCT PREVIEW
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1.0
3 VOLT ADVANCED+ BOOT BLOCK
INTRODUCTION
1.1
3 Volt Advanced+ Boot Block
Flash Memory Enhancements
This document contains the specifications for the
3 Volt Advanced+ Boot Block flash memory family.
These flash memories add features which can be
used to enhance the security of systems: instant
block locking and a protection register.
Throughout this document, the term “2.7 V” refers
to the full voltage range 2.7 V–3.6 V (except where
noted otherwise) and “V
PP
= 12 V” refers to 12 V
±5%. Sections 1 and 2 provide an overview of the
flash memory family including applications, pinouts,
pin descriptions and memory organization. Section
3 describes the operation of these products. Finally,
Section 4 contains the operating specifications.
The 3 Volt Advanced+ Boot Block flash memory
features:
•
•
•
Zero-latency, flexible block locking
128-bit Protection Register
Simple system implementation for 12 V
production programming with 2.7 V in-field
programming
Ultra-low power operation at 2.7 V
Minimum 100,000 block erase cycles
Common Flash Interface for software query of
device specs and features
•
•
•
Table 1. 3 Volt Advanced+ Boot Block Feature Summary
Feature
V
CC
Operating Voltage
V
PP
Voltage
V
CCQ
I/O Voltage
Bus Width
Speed (ns)
Blocking (top or bottom)
8-bit
8 M
(2)
16 M
32 M
(1)
2.7 V – 3.6 V
Provides complete write protection with
optional 12V Fast Programming
2.7 V– 3.6 V
16-bit
8 M
(2)
16 M
32 M
Reference
Table 8
Table 8
Note 3
Table 2
Table 11
Section 2.2
Appendix E and F
90, 110 @ 2.7 V and 80, 100 @ 3.0 V
8 x 8-Kbyte parameter
4-Mb: 7 x 64-Kbyte main
8-Mb: 15 x 64-Kbyte main
16-Mb: 31 x 64-Kbyte main
32-Mb: 63 x 64-Kbyte main
8 x 4-Kword parameter
4-Mb: 7 x 32-Kword main 8-
Mb: 15 x 32-Kword main
16-Mb: 31 x 32-Kword main
32-Mb: 63 x 32-Kword main
Operating Temperature
Program/Erase Cycling
Packages
Block Locking
Protection Register
Extended: –40 °C to +85 °C
100,000 cycles
40-Lead TSOP
(1)
48-Ball
µBGA*
CSP
(2)
48-Lead TSOP
48-Ball
µBGA*
CSP
(2)
Table 8
Table 8
Figures 1, 2, 3,
and 4
Section 3.3
Section 3.4
Flexible locking of any block with zero latency
64-bit unique device number, 64-bit user programmable
NOTES:
1. 32-Mbit density not available in 40-lead TSOP.
2. 8-Mbit density not available in µBGA* CSP.
3. V
CCQ
operation at 1.65 V — 2.5 V available upon request.
PRODUCT PREVIEW
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