SiHW21N80AE
www.vishay.com
Vishay Siliconix
E Series Power MOSFET
D
FEATURES
• Low figure-of-merit (FOM) R
on
x Q
g
• Low effective capacitance (C
o(er)
)
• Reduced switching and conduction losses
TO-247AD
G
• Avalanche energy rated (UIS)
• Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
G
D
S
S
N-Channel MOSFET
APPLICATIONS
• Server and telecom power supplies
• Switch mode power supplies (SMPS)
• Power factor correction power supplies (PFC)
PRODUCT SUMMARY
V
DS
(V) at T
J
max.
R
DS(on)
typ. () at 25 °C
Q
g
max. (nC)
Q
gs
(nC)
Q
gd
(nC)
Configuration
V
GS
= 10 V
72
9
22
Single
850
0.205
• Lighting
- High-intensity discharge (HID)
- Fluorescent ballast lighting
• Industrial
- Welding
- Induction heating
- Motor drives
- Battery chargers
- Solar (PV inverters)
ORDERING INFORMATION
Package
Lead (Pb)-free and halogen-free
TO-247AD
SiHW21N80AE-GE3
ABSOLUTE MAXIMUM RATINGS
(T
C
= 25 °C, unless otherwise noted)
PARAMETER
Drain-source voltage
Gate-source voltage
Continuous drain current (T
J
= 150 °C)
Pulsed drain current
a
Linear derating factor
Single pulse avalanche energy
b
Maximum power dissipation
Operating junction and storage temperature range
Drain-source voltage slope
Reverse diode dv/dt
d
Soldering recommendations (peak temperature)
c
For 10 s
T
J
= 125 °C
E
AS
P
D
T
J
, T
stg
dv/dt
V
GS
at 10 V
T
C
= 25 °C
T
C
= 100 °C
SYMBOL
V
DS
V
GS
I
D
I
DM
LIMIT
800
± 30
17.4
11
38
1.4
32
32
-55 to +150
70
39
260
W/°C
mJ
W
°C
V/ns
°C
A
UNIT
V
Notes
a. Repetitive rating; pulse width limited by maximum junction temperature
b. V
DD
= 140 V, starting T
J
= 25 °C, L = 28.2 mH, R
g
= 25
,
I
AS
= 1.5 A
c. 1.6 mm from case
d. I
SD
I
D
, di/dt = 100 A/μs, starting T
J
= 25 °C
S19-0401-Rev. A, 06-May-2019
Document Number: 92269
1
For technical questions, contact:
hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
SiHW21N80AE
www.vishay.com
Vishay Siliconix
SYMBOL
R
thJA
R
thJC
TYP.
-
-
MAX.
40
0.7
UNIT
°C/W
THERMAL RESISTANCE RATINGS
PARAMETER
Maximum junction-to-ambient
Maximum junction-to-case (drain)
SPECIFICATIONS
(T
J
= 25 °C, unless otherwise noted)
PARAMETER
Static
Drain-source breakdown voltage
V
DS
temperature coefficient
Gate-source threshold voltage (N)
Gate-source leakage
Zero gate voltage drain current
Drain-source on-state resistance
Forward transconductance
Dynamic
Input capacitance
Output capacitance
Reverse transfer capacitance
Effective output capacitance, energy
related
a
Effective output capacitance, time
related
b
Total gate charge
Gate-source charge
Gate-drain charge
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Gate input resistance
Drain-Source Body Diode Characteristics
Continuous source-drain diode current
Pulsed diode forward current
Diode forward voltage
Reverse recovery time
Reverse recovery charge
Reverse recovery current
I
S
I
SM
V
SD
t
rr
Q
rr
I
RRM
MOSFET symbol
showing the
integral reverse
p - n junction diode
D
SYMBOL
V
DS
V
DS
/T
J
V
GS(th)
I
GSS
I
DSS
R
DS(on)
g
fs
C
iss
C
oss
C
rss
C
o(er)
TEST CONDITIONS
V
GS
= 0 V, I
D
= 250 μA
Reference to 25 °C, I
D
= 1 mA
V
DS
= V
GS
, I
D
= 250 μA
V
GS
= ± 20 V
V
GS
= ± 30 V
V
DS
= 800 V, V
GS
= 0 V
V
DS
= 640 V, V
GS
= 0 V, T
J
= 125 °C
V
GS
= 10 V
I
D
= 11 A
V
DS
= 30 V, I
D
= 3 A
MIN.
800
-
2.0
-
-
-
-
-
-
-
-
-
-
TYP.
-
0.8
-
-
-
-
-
0.205
4.0
1388
53
5
43
276
48
9
22
21
38
71
76
0.55
MAX.
-
-
4.0
± 100
±1
1
10
0.235
-
-
-
-
UNIT
V
V/°C
V
nA
μA
μA
S
a
V
GS
= 0 V,
V
DS
= 100 V,
f = 1 MHz
pF
-
-
72
-
-
42
76
107
114
1.1
ns
nC
V
DS
= 0 V to 480 V, V
GS
= 0 V
C
o(tr)
Q
g
Q
gs
Q
gd
t
d(on)
t
r
t
d(off)
t
f
R
g
f = 1 MHz, open drain
V
DD
= 640 V, I
D
= 11 A,
V
GS
= 10 V, R
g
= 20
V
GS
= 10 V
I
D
= 11 A, V
DS
= 640 V
-
-
-
-
-
-
-
-
0.2
-
-
-
-
-
-
-
-
-
400
5
20
17.4
A
38
1.2
800
10
-
V
ns
μC
A
G
S
T
J
= 25 °C, I
S
= 11 A, V
GS
= 0 V
T
J
= 25 °C, I
F
= I
S
= 11 A,
di/dt = 100 A/μs, V
R
= 25 V
Notes
a. C
oss(er)
is a fixed capacitance that gives the same energy as C
oss
while V
DS
is rising from 0 % to 80 % V
DSS
b. C
oss(tr)
is a fixed capacitance that gives the same charging time as C
oss
while V
DS
is rising from 0 % to 80 % V
DSS
S19-0401-Rev. A, 06-May-2019
Document Number: 92269
2
For technical questions, contact:
hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
SiHW21N80AE
www.vishay.com
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)
Axis Title
40
2nd line
I
D
- Drain-to-Source Current (A)
15 V
14 V
13 V
12 V
11 V
10 V
9V
8V
T
J
= 25 °C
7V
Vishay Siliconix
Axis Title
10000
R
DS(on)
- Drain-to-Source On-Resistance
(Normalized)
3.0
2.5
2.0
1.5
1.0
0.5
0
-60 -40 -20 0
20 40 60 80 100 120 140 160
T
J
- Junction Temperature (°C)
10
V
GS
= 10 V
I
D
= 3 A
10000
30
1000
1st line
2nd line
1000
1st line
2nd line
100
Axis Title
10000
V
GS
= 0 V, f = 1 MHz
C
iss
= C
gs
+ C
gd
, C
ds
shorted
C
rss
= C
gd
C
oss
= C
ds
+ C
gd
C
iss
20
6V
100
10
5V
0
0
5
10
15
20
V
DS
- Drain-to-Source Voltage (V)
10
Fig. 1 - Typical Output Characteristics
Axis Title
24
2nd line
I
D
- Drain-to-Source Current (A)
15 V
14 V
13 V
12 V
11 V
10 V
9V
8V
7V
T
J
= 150 °C
Fig. 4 - Normalized On-Resistance vs. Temperature
10000
100 000
10 000
2nd line
C - Capacitance (pF)
1000
1st line
2nd line
18
1000
1st line
2nd line
100
10
200
300
400
500
600
Axis Title
9
8
7
6
E
oss
1000
12
5V
100
C
rss
C
oss
100
6
10
0
0
5
10
15
20
V
DS
- Drain-to-Source Voltage (V)
10
1
0
100
V
DS
- Drain-to-Source Voltage (V)
Fig. 2 - Typical Output Characteristics
Axis Title
50
2nd line
I
D
- Drain-to-Source Current (A)
T
J
= 25 °C
Fig. 5 - Typical Capacitance vs. Drain-to-Source Voltage
100 000
2nd line
C
oss
- Output Capacitance (pF)
40
10 000
1000
1st line
2nd line
30
T
J
= 150 °C
1000
C
oss
5
4
3
20
100
10
V
DS
= 29.4 V
100
2
1
0
0
5
10
15
20
V
GS
- Gate-to-Source Voltage (V)
10
10
0
100
200
300
400
500
600
V
DS
- Drain-to-Source Voltage (V)
0
Fig. 3 - Typical Transfer Characteristics
Fig. 6 - C
oss
and E
oss
vs. V
DS
S19-0401-Rev. A, 06-May-2019
Document Number: 92269
3
For technical questions, contact:
hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
E
oss
- Output Capacitance Stored Energy (µJ)
2nd line
10000
SiHW21N80AE
www.vishay.com
Vishay Siliconix
Axis Title
10000
20
10000
Axis Title
12
2nd line
V
GS
- Gate-to-Source Voltage (V)
V
DS
= 640 V
V
DS
= 400 V
V
DS
= 160 V
1000
1st line
2nd line
6
100
3
2nd line
I
D
- Drain Current (A)
9
15
1000
10
100
5
1st line
2nd line
10
25
50
75
100
125
150
T
C
- Case Temperature (°C)
Axis Title
10000
1000
1st line
2nd line
100
I
D
= 1 mA
0
0
15
30
45
60
Q
g
- Total Gate Charge (nC)
10
0
Fig. 7 - Typical Gate Charge vs. Gate-to-Source Voltage
Axis Title
100
2nd line
I
SD
- Reverse Drain Current (A)
10000
Fig. 10 - Maximum Drain Current vs. Case Temperature
2nd line
V
DS
- Drain-to-Source Breakdown Voltage (V)
1025
1000
975
950
925
900
875
850
825
800
-60 -40 -20 0
T
J
= 150 °C
10
T
J
= 25 °C
1000
1st line
2nd line
1
100
0.1
0.2
0.4
0.6
0.8
V
GS
= 0 V
10
1.2
10
1.0
20 40 60 80 100 120 140 160
V
SD
- Source-Drain Voltage (V)
T
J
- Junction Temperature (°C)
Fig. 8 - Typical Source-Drain Diode Forward Voltage
Axis Title
100
Operation in this area
limited by R
DS(on)
Fig. 11 - Temperature vs. Drain-to-Source Voltage
10000
I
DM
limited
2nd line
I
D
- Drain Current (A)
10
1000
100 µs
Limited by R
DS(on)
a
1
T
C
= 25 °C,
T
J
= 150 °C,
single pulse
100
1 ms
BVDSS limited
10
10
ms
0.1
1
10
100
V
DS
- Drain-to-Source Voltage (V)
1000
Fig. 9 - Maximum Safe Operating Area
Note
a. V
GS
> minimum V
GS
at which R
DS(on)
is specified
S19-0401-Rev. A, 06-May-2019
Document Number: 92269
4
For technical questions, contact:
hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
1st line
2nd line
SiHW21N80AE
www.vishay.com
Vishay Siliconix
Axis Title
1
Duty cycle = 0.5
10000
Thermal Impedance
0.2
1000
1st line
2nd line
100
0.02
0.1
0.1
0.05
Single pulse
0.01
0.0001
10
0.001
0.01
Pulse Time (s)
0.1
1
Fig. 12 - Normalized Transient Thermal Impedance, Junction-to-Case
R
D
t
p
D.U.T.
+
-
V
DD
10 V
Pulse width ≤ 1 μs
Duty factor ≤ 0.1 %
V
DS
V
GS
R
g
V
DS
V
DD
V
DS
I
AS
Fig. 13 - Switching Time Test Circuit
Fig. 16 - Unclamped Inductive Waveforms
V
DS
90 %
10 V
Q
gs
10 %
V
GS
t
d(on)
t
r
t
d(off)
t
f
Q
g
Q
gd
V
G
Charge
Fig. 14 - Switching Time Waveforms
L
V
DS
Vary t
p
to obtain
required I
AS
R
g
D.U.T.
I
AS
10 V
t
p
0.01
Ω
V
GS
3 mA
Fig. 17 - Basic Gate Charge Waveform
Current regulator
Same
type as D.U.T.
50 kΩ
+
- V
DD
12 V
0.2 μF
0.3 μF
+
D.U.T.
-
V
DS
Fig. 15 - Unclamped Inductive Test Circuit
I
G
I
D
Current
sampling
resistors
Fig. 18 - Gate Charge Test Circuit
S19-0401-Rev. A, 06-May-2019
Document Number: 92269
5
For technical questions, contact:
hvm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
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