Decoder/Driver, 10K Series, True Output, ECL, CDFP16, CERPACK-16
参数名称 | 属性值 |
零件包装代码 | DFP |
包装说明 | DFP, |
针数 | 16 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
Is Samacsys | N |
其他特性 | UNSELECTED OUTPUTS HIGH |
系列 | 10K |
JESD-30 代码 | R-CDFP-F16 |
长度 | 9.906 mm |
逻辑集成电路类型 | OTHER DECODER/DRIVER |
功能数量 | 2 |
端子数量 | 16 |
最高工作温度 | 75 °C |
最低工作温度 | |
输出特性 | OPEN-EMITTER |
输出极性 | TRUE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DFP |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
最大电源电流(ICC) | 77 mA |
传播延迟(tpd) | 6 ns |
认证状态 | Not Qualified |
座面最大高度 | 1.905 mm |
表面贴装 | YES |
技术 | ECL |
温度等级 | COMMERCIAL EXTENDED |
端子形式 | FLAT |
端子节距 | 1.27 mm |
端子位置 | DUAL |
宽度 | 6.731 mm |
Base Number Matches | 1 |
10171FC | 10571DM | 10171DC | 10171PC | 10571FM | |
---|---|---|---|---|---|
描述 | Decoder/Driver, 10K Series, True Output, ECL, CDFP16, CERPACK-16 | Decoder/Driver, 10K Series, True Output, ECL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | Decoder/Driver, 10K Series, True Output, ECL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | Decoder/Driver, 10K Series, True Output, ECL, PDIP16, PLASTIC, DIP-16 | Decoder/Driver, 10K Series, True Output, ECL, CDFP16, CERPACK-16 |
零件包装代码 | DFP | DIP | DIP | DIP | DFP |
包装说明 | DFP, | DIP, | DIP, | DIP, | DFP, |
针数 | 16 | 16 | 16 | 16 | 16 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Is Samacsys | N | N | N | N | N |
其他特性 | UNSELECTED OUTPUTS HIGH | UNSELECTED OUTPUTS HIGH | UNSELECTED OUTPUTS HIGH | UNSELECTED OUTPUTS HIGH | UNSELECTED OUTPUTS HIGH |
系列 | 10K | 10K | 10K | 10K | 10K |
JESD-30 代码 | R-CDFP-F16 | R-GDIP-T16 | R-GDIP-T16 | R-PDIP-T16 | R-CDFP-F16 |
长度 | 9.906 mm | 19.558 mm | 19.558 mm | 19.05 mm | 9.906 mm |
功能数量 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 16 | 16 | 16 | 16 | 16 |
最高工作温度 | 75 °C | 125 °C | 75 °C | 75 °C | 125 °C |
输出特性 | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER |
输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DFP | DIP | DIP | DIP | DFP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | IN-LINE | IN-LINE | IN-LINE | FLATPACK |
最大电源电流(ICC) | 77 mA | 77 mA | 77 mA | 77 mA | 77 mA |
传播延迟(tpd) | 6 ns | 6 ns | 6 ns | 6 ns | 6 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.905 mm | 5.08 mm | 5.08 mm | 5.08 mm | 1.905 mm |
表面贴装 | YES | NO | NO | NO | YES |
技术 | ECL | ECL | ECL | ECL | ECL |
温度等级 | COMMERCIAL EXTENDED | MILITARY | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | MILITARY |
端子形式 | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT |
端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 6.731 mm | 7.62 mm | 7.62 mm | 7.62 mm | 6.731 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 |
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