Decoder/Driver, 10K Series, True Output, ECL, CDFP16, CERPACK-16
| 参数名称 | 属性值 |
| 零件包装代码 | DFP |
| 包装说明 | DFP, |
| 针数 | 16 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 系列 | 10K |
| JESD-30 代码 | R-CDFP-F16 |
| 长度 | 9.906 mm |
| 逻辑集成电路类型 | OTHER DECODER/DRIVER |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 75 °C |
| 最低工作温度 | |
| 输出特性 | OPEN-EMITTER |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 最大电源电流(ICC) | 76 mA |
| 传播延迟(tpd) | 6 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.905 mm |
| 表面贴装 | YES |
| 技术 | ECL |
| 温度等级 | COMMERCIAL EXTENDED |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 6.731 mm |
| Base Number Matches | 1 |
| 10162FC | 10562FM | 10562DM | 10162DC | 10162PC | |
|---|---|---|---|---|---|
| 描述 | Decoder/Driver, 10K Series, True Output, ECL, CDFP16, CERPACK-16 | Decoder/Driver, 10K Series, True Output, ECL, CDFP16, CERPACK-16 | Decoder/Driver, 10K Series, True Output, ECL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | Decoder/Driver, 10K Series, True Output, ECL, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | Decoder/Driver, 10K Series, True Output, ECL, PDIP16, PLASTIC, DIP-16 |
| 零件包装代码 | DFP | DFP | DIP | DIP | DIP |
| 包装说明 | DFP, | DFP, | DIP, | DIP, | DIP, |
| 针数 | 16 | 16 | 16 | 16 | 16 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| Is Samacsys | N | N | N | N | N |
| 系列 | 10K | 10K | 10K | 10K | 10K |
| JESD-30 代码 | R-CDFP-F16 | R-CDFP-F16 | R-GDIP-T16 | R-GDIP-T16 | R-PDIP-T16 |
| 长度 | 9.906 mm | 9.906 mm | 19.558 mm | 19.558 mm | 19.05 mm |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 75 °C | 125 °C | 125 °C | 75 °C | 75 °C |
| 输出特性 | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY |
| 封装代码 | DFP | DFP | DIP | DIP | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | FLATPACK | IN-LINE | IN-LINE | IN-LINE |
| 最大电源电流(ICC) | 76 mA | 76 mA | 76 mA | 76 mA | 76 mA |
| 传播延迟(tpd) | 6 ns | 6 ns | 6 ns | 6 ns | 6 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.905 mm | 1.905 mm | 5.08 mm | 5.08 mm | 5.08 mm |
| 表面贴装 | YES | YES | NO | NO | NO |
| 技术 | ECL | ECL | ECL | ECL | ECL |
| 温度等级 | COMMERCIAL EXTENDED | MILITARY | MILITARY | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
| 端子形式 | FLAT | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 6.731 mm | 6.731 mm | 7.62 mm | 7.62 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 |
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