Preliminary
SIGC14T60SN
IGBT Chip in NPT-technology
FEATURES:
•
600V NPT technology
•
100µm chip
•
short circuit prove
•
positive temperature coefficient
•
easy paralleling
C
This chip is used for:
•
SGP15N60
Applications:
•
drives
G
E
Chip Type
SIGC14T60SN
V
CE
600V
I
Cn
15A
Die Size
3.80 x 3.80 mm
2
Package
sawn on foil
Ordering Code
Q67041-A4665-
A001
MECHANICAL PARAMETER:
Raster size
Area total / active
Emitter pad size
Gate pad size
Thickness
Wafer size
Flat position
Max.possible chips per wafer
Passivation frontside
Emitter metalization
Collector metalization
Die bond
Wire bond
Reject Ink Dot Size
Recommended Storage Environment
3.8 x 3.8
14.44 / 10.7
1.89 x 2.19
0.70 x 1.09
100
125
270
703
Photoimide
3200 nm Al Si 1%
1400 nm Ni Ag –system
suitable for epoxy and soft solder die bonding
electrically conductive glue or solder
Al,
≤500µm
tbd
store in original container, in dry nitrogen,
< 6 month
µm
mm
2
mm
deg
Edited by INFINEON technologies AI IP DD HV2, L 7232-F, Edition 1, 13.03.2000
Preliminary
SIGC14T60SN
MAXIMUM RATINGS:
Parameter
Collector-emitter voltage
DC collector current, limited by T
jmax
Pulsed collector current, t
p
limited by T
jmax
Gate emitter voltage
Operating junction and storage temperature
Symbol
V
CE
I
C
I
cpuls
V
GE
T
j
, T
s t g
Value
600
31
62
±20
-55 ... +150
Unit
V
A
A
V
°C
STATIC CHARACTERISTICS
(tested on chip),
T
j=25
°C,
unless otherwise specified:
Parameter
Collector-emitter breakdown voltage
Collector-emitter saturation voltage
Gate-emitter threshold voltage
Zero gate voltage collector current
Gate-emitter leakage current
Symbol
V
(BR)CES
V
CE(sat )
V
GE(th)
I
CES
I
GES
Conditions
min.
V
GE
=0V , I
C
=500µA
V
GE
=15V, I
C
=15A
I
C
=400µA , V
GE
=V
CE
V
CE
=600V , V
GE
=0V
V
CE
=0V , V
GE
=30V
600
1.6
3.0
2.0
4.0
2.5
5.0
70
120
µA
nA
V
Value
typ.
max.
Unit
DYNAMIC CHARACTERISTICS
(tested at component):
Parameter
Input capacitance
Output capacitance
Reverse transfer capacitance
Symbol
C
i s s
C
o s s
C
r s s
Conditions
V
C E
= 2 5 V ,
V
GE
= 0 V ,
f
=1MHz
Value
min.
-
-
-
typ.
800
84
52
max.
960
100
63
Unit
pF
SWITCHING CHARACTERISTICS
(tested at component), Inductive Load:
Parameter
Turn-on delay time
Rise time
Turn-off delay time
Fall time
Symbol
t
d(on)
t
r
t
d( o f f )
t
f
Conditions
T
j
= 2 5
°
C
V
C C
=400V,
I
C
=15A
V
GE
= + 1 5 / 0 V ,
R
G
= 2 1Ω
Value
min.
-
-
-
-
typ.
24
33
234
46
max.
29
40
280
55
Unit
ns
Edited by INFINEON technologies AI IP DD HV2, L 7232-F, Edition 1, 13.03.2000
Preliminary
SIGC14T60SN
FURTHER ELECTRICAL CHARACTERISTICS:
This chip data sheet refers to the
device data sheet
SGP15N60
Package :TO220
Description:
AQL 0,65 for visual inspection according to failure catalog
Electrostatic Discharge Sensitive Device according to MIL-STD 883
Test-Normen Villach/Prüffeld
Published by
Infineon Technologies AG i Gr.,
Bereich Kommunikation
St.-Martin-Strasse 53,
D-81541 München
© Infineon Technologies AG 1999
All Rights Reserved.
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Edited by INFINEON technologies AI IP DD HV2, L 7232-F, Edition 1, 13.03.2000