Datasheet> 器件分类 > 连接器> 插座> FGAX168-823G

文档预览

FGAX168-823G: 产品描述IC Socket, BGA168, 168 Contact(s),; 产品类别连接器插座; 文件大小170KB，共1页; 制造商Advanced Interconnections Corp; 标准

下载文档详细参数全文预览

FGAX168-823G概述

IC Socket, BGA168, 168 Contact(s),

FGAX168-823G规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
Reach Compliance Code	compliant
ECCN代码	EAR99
Is Samacsys	N
其他特性	STANDARD: UL 94V-0
联系完成配合	GOLD OVER NICKEL
联系完成终止	Gold (Au) - with Nickel (Ni) barrier
触点材料	BRASS/COPPER ALLOY
设备插槽类型	IC SOCKET
使用的设备类型	BGA168
外壳材料	GLASS FILLED EPOXY
JESD-609代码	e4
触点数	168
Base Number Matches	1

文档预览

下载PDF文档

全文
预览

Ball Grid Array

(BGA) Adapters

5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com

BGA Adapters

Standard Adapter (A):

• Mates with Standard Socket (S)

• Adapter size equals BGA Device

body + .079/(2.0)

Extraction Slot Adapter (AX):

• Slots allow AIC extraction tool (sold

separately) to easily remove device/

adapter assembly from socket.

• Mates with Extraction Socket (SB)

or Guide Post Socket (SG)

• Adapter size equals the BGA

Device body + .157/(4.0)

Features:

• Soldering BGA Device to adapter subjects

BGA to less thermal stress than soldering

BGA directly to a PCB due to the adapter’s

lower mass.

• Uses same footprint as BGA device.

• Custom adapters available for heat sink

attachment.

BGA Body + .079/(2.0)

.039/(1.0)

BGA Device

BGA Body + .157/(4.0)

.079/(2.0)

BGA Device

BGA Adapter Extraction Tool:

• Insert “T” bar end of tool into extraction slot adapter.

• Slide tool to end of slot and pry adapter from socket.

• Repeat in additional slots until adapter is separated from socket.

Device Package Size

< 1.024 (26mm) > 1.024 (26mm)

Tool P/N

5566

.373/(9.5mm)

5504

.675/(17.1mm)

Terminals:

Brass - Copper Alloy (C36000),

ASTM-B-16

Plating:

G - Gold over Nickel

Body Material:

FR-4 Glass Epoxy, U.L. Rated 94V-O

P/N 5504

P/N 5566

Blade Width

How It Works:

1.27mm & 1.5mm Pitch

Type -638

DEVICE

Terminals

1.0mm Pitch

Type -715

0.80mm Pitch

Type -700

0.75mm Pitch

Type -757

ADAPTER

Reflow (solder) BGA

Device to Adapter

.182

(4.62)

.159

(4.04)

.146

(3.71)

.142

(3.61)

.018

(0.46) Dia.

.011/(0.28)

Dia.

.011

(0.28)Dia.

.008

(0.20)Dia.

SOCKET

Reflow (solder)

Socket to PCB

How To Order

XXX -638

Terminal Plating

G - Gold

Terminal Type

Number of Positions

*See BGA Footprint Section or web site

Model Type

= Standard Adapter

= Extraction Slot Adapter

(1.5, 1.27, 1.0mm Pitch only)

Footprint Dash#

If Applicable*

Body Type

F - FR-4

Pitch

B = .059/(1.5mm)

G = .050/(1.27mm)

H = .039/(1.0mm)

J = .0315/(0.80mm)

K = .0295/(0.75mm)

PC BOARD

inch/(mm)

Products shown covered by patents issued and/or pending. Specifications subject to change without notice.

Page 4

推荐资源

器件捷径: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

热门器件

开源项目推荐更多

热门活动更多

热门文章更多

技术资料推荐更多