IC,FLIP-FLOP,OCTAL,D TYPE,ACT-CMOS,DIP,20PIN,CERAMIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | DIP, DIP20,.3 |
| Reach Compliance Code | not_compliant |
| Is Samacsys | N |
| JESD-30 代码 | R-XDIP-T20 |
| 负载电容(CL) | 50 pF |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 最大频率@ Nom-Sup | 68000000 Hz |
| 最大I(ol) | 0.024 A |
| 功能数量 | 8 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 触发器类型 | POSITIVE EDGE |
| Base Number Matches | 1 |
| 5962-01-412-2587 | CD74AC534M96 | CD74AC374M96 | CD74ACT374M | CD74ACT374M96 | CD74ACT374E | CD74AC374M | CD74AC374E | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC,FLIP-FLOP,OCTAL,D TYPE,ACT-CMOS,DIP,20PIN,CERAMIC | DRIVER | DRIVER | ACT SERIES, 8-BIT DRIVER, TRUE OUTPUT, PDSO20 | DRIVER | DRIVER | DRIVER | DRIVER |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| JESD-30 代码 | R-XDIP-T20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 | R-PDIP-T20 |
| 负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | D FLIP-FLOP | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 最大频率@ Nom-Sup | 68000000 Hz | 89000000 Hz | 89000000 Hz | 110000000 Hz | 110000000 Hz | 110000000 Hz | 89000000 Hz | 89000000 Hz |
| 最大I(ol) | 0.024 A | 0.024 A | 0.012 A | 0.024 A | 0.024 A | 0.024 A | 0.012 A | 0.012 A |
| 功能数量 | 8 | 8 | 1 | 8 | 8 | 8 | 1 | 1 |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | SOP | SOP | SOP | DIP | SOP | DIP |
| 封装等效代码 | DIP20,.3 | SOP20,.4 | SOP20,.4 | SOP20,.4 | SOP20,.4 | DIP20,.3 | SOP20,.4 | DIP20,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE |
| 电源 | 5 V | 3.3/5 V | 3.3/5 V | 5 V | 5 V | 5 V | 3.3/5 V | 3.3/5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | NO | YES | YES | YES | YES | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 包装说明 | DIP, DIP20,.3 | - | SOP, SOP20,.4 | SOP, SOP20,.4 | SOP, SOP20,.4 | DIP, DIP20,.3 | SOP, SOP20,.4 | DIP, DIP20,.3 |
| 标称供电电压 (Vsup) | 5 V | - | 3.3 V | 5 V | 5 V | 5 V | 3.3 V | 3.3 V |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - | - |
| JESD-609代码 | - | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved