IC QUAD LINE DRIVER, CDIP16, CERAMIC, DIP-16, Line Driver or Receiver
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | DIP, DIP16,.3 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 差分输出 | YES |
| 驱动器位数 | 4 |
| 高电平输入电流最大值 | 0.000001 A |
| 输入特性 | STANDARD |
| 接口集成电路类型 | LINE DRIVER |
| 接口标准 | EIA-422 |
| JESD-30 代码 | R-GDIP-T16 |
| 长度 | 19.43 mm |
| 功能数量 | 4 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 最小输出摆幅 | 2 V |
| 输出特性 | 3-STATE |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP16,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT APPLICABLE |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 最大接收延迟 | |
| 筛选级别 | MIL-STD-883 |
| 座面最大高度 | 5.08 mm |
| 最大压摆率 | 2.1 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT APPLICABLE |
| 最大传输延迟 | 14 ns |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 5962-9163901MEA | 5962-9163901MFA | 5962-9163901M2A | |
|---|---|---|---|
| 描述 | IC QUAD LINE DRIVER, CDIP16, CERAMIC, DIP-16, Line Driver or Receiver | IC QUAD LINE DRIVER, CDFP16, CERAMIC, DFP-16, Line Driver or Receiver | IC QUAD LINE DRIVER, CQCC20, LCC-20, Line Driver or Receiver |
| 包装说明 | DIP, DIP16,.3 | DFP, FL16,.3 | QCCN, LCC20,.35SQ |
| Reach Compliance Code | compliant | compliant | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 |
| Is Samacsys | N | N | N |
| 差分输出 | YES | YES | YES |
| 驱动器位数 | 4 | 4 | 4 |
| 高电平输入电流最大值 | 0.000001 A | 0.000001 A | 0.000001 A |
| 输入特性 | STANDARD | STANDARD | STANDARD |
| 接口集成电路类型 | LINE DRIVER | LINE DRIVER | LINE DRIVER |
| 接口标准 | EIA-422 | EIA-422 | EIA-422 |
| JESD-30 代码 | R-GDIP-T16 | R-GDFP-F16 | S-CQCC-N20 |
| 长度 | 19.43 mm | 9.6645 mm | 8.89 mm |
| 功能数量 | 4 | 4 | 4 |
| 端子数量 | 16 | 16 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C |
| 最小输出摆幅 | 2 V | 2 V | 2 V |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | DFP | QCCN |
| 封装等效代码 | DIP16,.3 | FL16,.3 | LCC20,.35SQ |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | FLATPACK | CHIP CARRIER |
| 电源 | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
| 座面最大高度 | 5.08 mm | 2.032 mm | 1.905 mm |
| 最大压摆率 | 2.1 mA | 8.4 mA | 8.4 mA |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | FLAT | NO LEAD |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | QUAD |
| 最大传输延迟 | 14 ns | 14 ns | 14 ns |
| 宽度 | 7.62 mm | 6.604 mm | 8.89 mm |
| Base Number Matches | 1 | 1 | 1 |
| 是否Rohs认证 | 不符合 | 不符合 | - |
| 峰值回流温度（摄氏度） | NOT APPLICABLE | NOT SPECIFIED | - |
| 处于峰值回流温度下的最长时间 | NOT APPLICABLE | NOT SPECIFIED | - |
| JESD-609代码 | - | e0 | e0 |
| 端子面层 | - | TIN LEAD | TIN LEAD |
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