Table of Contents
The 01005 to 1806 series ranger of Miniature Ferrite beads contains the very latest in multi layer ferrite beads
technology, thus providing the ultimate in performance demanded by today's high Speed EMI noise filtering
products . The ferrite beads are in an industry standard size and footprint .
Ferrite beads . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Parts number Legend . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
Competitor Cross . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
Reliability and Test Condition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3-5
Derating Curve . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5
Product Specifications
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Lead Free Solder re-flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Solder Iron . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Solder Volume . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6
Packaging Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Reel Dimension . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Qty/reel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Tearing Off Force . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
Application Notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
Ferrite Bead EMI Suppressor
Single Type - 01005FB, 0201FE, 0402FB, 0603FB & 0805FB Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-11
Single GHz Type - 00402HFB & 0603HFB Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12-13
Array Type - 1206FBA Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14-15
Power Type - 0603PFB, 0805PFB, 1206PFB, & 1806PFB Series . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16-17
Pulse Jack
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CHIP FERRITE BEADS
1.0 Ferrite Beads
It is known as absorptive beads, is more lossy and make good power filter networks because they are designed
to absorb high-frequency noise currents and dissipate it as heat . These beads have high impedance over wide high-
frequency bands, making them ideal as low-pass noise filters .
Structure
FREQUENCY (MHz)
Z = Impedance (ohm)
R = Real Part (resistance)
X = imaginary Part (inductance)
Application
Vcc
Ferrite Bead
Ferrite
Bead
+
-
Chipchoke™
Common Mode
Noise suppression
2.0 Parts Number Legend
PE-0201
PACKAGE STYLE
FB
CORE MATERIAL
FB = Ferrite Bead
01005, 0201,
0402, 0603,
0805, 1206
1806
HFB = High Frequency Ferrite Bead
PFB = High Current Ferrite Bead
AFB=Automotive Ferrite Bead
FBA = Frequency Bead Array
* There is no tolerance option for these products.
121
Impedance (Ω)
121=120
Ω
S
TOLERANCE *
J =
±5%
S =
±25%
X = not apply
T
PACKAGE
T = Tape & Reel
A
Enhanced
A = Alternative
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CHIP FERRITE BEADS
3.0 Competitor Cross
ITEM
Ferrite Bead Single
Pulse
FB Series
TAIYO YUDEN
BK & FBM Series
TDK
MMZ Series
MURATA
BLMxxAG Series
BLMxxBD Series
BLMxxAX Series
Ferrite Bead Array
GHz Ferrite Beads Single
Power Ferrite Bead Single
FBA Series
HFB Series
PFB Series
BKxxxx4S Series
FBMH Series
MZA Series
MMZ1005-E Series
BLA Series
BLMxxH Series
BLMxxPG Series
4.0 Reliability and Test Condition
Item
Series No.
Operating
Temperature
Transportation
Storage
Temperature
Impedance (Z)
Inductance (Ls)
Q Factor
DC Resistance
Rated Current
Refer to standard electrical characteristics list
Agilent4291
AgilentE4991
Agilent4287
Agilent16192
Agilent4338
DC Power Supply
Over Rated Current requirements
Temperature Rise
Test
Resistance to
Soldering Heat
Rated Current < 1A
∆T
20½C Max
Appearance: No damage
Impedance: Within
±15%
of initial value
Inductance: Within
±10%
of initial value
Q: Shall not exceed the specification value.
RDC: Shall not exceed the specification value.
Preheating Dipping Natural Cooling
260 C
Performance
PE-01005FB/0201FB/0402FB/0603FB/0805FB/0402HFB/0603HFB/
1206FBA
-40
~+105½C
(Including self-temperature rise)
-40
~+125½C
Test Condition
1. Applied the allowed DC current
2. Temperature measured by digital surface thermometer
Preheat: 150½C, 60sec
Solder: Sn99.5%-Cu0.5%
Solder temperature: 260±5½C
Flux for lead free: Rosin.9.5%
Temperature ramp/immersion and immersion rate: 25±6 mm/s
Dip time: 10±1sec.
Depth: completely cover the termination.
Rated Current
≥
1A
∆T
20½C Max
150 C
Pulse Jack
60
second
10 1.0
second
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CHIP FERRITE BEADS
4.0 Reliability and Test Condition
Item
Solderability
Performance
More than 95% of the terminal electrode should be covered with solder
Preheating Dipping Natural Cooling
245 C
Test Condition
Preheat: 150½C, 60sec
Solder: Sn99.5%-Cu0.5%
Solder temperature: 245±5½C
Flux for lead free: Rosin.9.5%
60
second
4 1.0
second
150 C
Depth: completely cover the termination.
Dip time: 4±1sec.
Terminal strength
Appearance: No damage.
Impedance: within±15% of initial value
Inductance: within±10% of initial value
Q: Shall not exceed the specification value.
RDC: Shall not exceed the specification value.
Preconditioning: Run through IR reflow for 2 times. (IPC/JEDEC
J-STD-020D Classification Reflow Profiles)
Component mounted on a PCB apply a force (>0805:1kg<=080
5:0.5kg) to the side of a device being tested. This force shall be
applied for 60 +1 econds. Also the force shall be applied gradually
as not to shock the component being tested.
Bending
Appearance: No damage.
Impedance: within
±10%
of initial value
Inductance: within
±10%
of initial value
Q: Shall not exceed the specification value
RDC: Shall not exceed the specification value
Shall be mounted on a FR4 substrate of the
Following dimensions: >=0805:40x100x1.2mm
<0805:40x100x0.8mm
Bending depth: >=0805:1.2mm
Duration of 10 sec for a min.
Preconditioning: Run through IR reflow for 2 times. (IPC/JEDEC
J-STD-020D Classification Reflow Profiles)
~~
Oscillation Frequency: 10 2K 10Hz for 20 minutes
Equipment: Vibration checker
Total Amplitude: 1.52mm
±10%
Vibration Test
Appearance: No damage.
Impedance: within
±15%
of initial value
Inductance: within
±10%
of initial value
Q: Shall not exceed the specification value
RDC: within
±15%
of initial value and shall not exceed the specification Testing Time: 12 hours (20 minutes 12 cycles each of 3 orientations).
value
Shock
Appearance: No damage.
Impedance: within
±15%
of initial value
Inductance: within
±10%
of initial value
Q: Shall not exceed the specification value
RDC: within
±15%
of initial value and shall not exceed the
specification value
SMD
Lead
Test condition:
Type
Peak
Value
(g’s)
1,500
100
Normal
duration
Velocity
change
Wave
(D) (ms) form
(Vi)ft/sec
0.5
Half-sine
15.4
6
Half-sine
12.3
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4
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CHIP FERRITE BEADS
Life Test
Appearance: No damage.
Impedance: within
±15%
of initial value
Inductance: within
±10%
of initial value
Q: Shall not exceed the specification value
RDC: within
±15%
of initial value and shall not exceed the
specification value
Load Humidity
Preconditioning: Run through IR reflow for 2 times. (IPC/JEDEC
J-STD-020D Classification Reflow Profiles)
Temperature: 125±2½C(bead),
85±2½C(inductor)
Applied current: rated current
Duration: 1000±12hrs.
Measured at room temperature after placing for 24±2 hrs.
Preconditioning: Run through IR reflow for 2 times. (IPC/JEDEC
J-STD-020D Classification Reflow Profiles)
Humidity: 85±2%R.H.
Temperature: 85±2½C
Duration: 1000hrs Min. with 100% rated current.
Measured at room temperature after placing for 24±2 hrs.
Thermal Shock
Appearance: no damage
Impedance: within
±15%
of initial value
Inductance: within
±10%
of initial value
Q: Shall not exceed the specification value
RDC: Shall not exceed the specification value
Preconditioning: Run through IR reflow for 2 times. (IPC/JEDEC
J-STD-020D Classification Reflow Profiles)
Condition for 1 cycle
Step1: -40±2½C 30±5 min.
Step2: 25±2½C≤30±0.5 min.
Step3: +105±2½C 30±5 min.
Number of cycles: 500
Measured at room temperature after placing for 24±2 hrs.
Insulation
Resistance
IR>1GΩ
Chip Inductor Only
Test Voltage: 100±10%V for 30Sec
5. **Derating Curve
For the ferrite chip bead which withstanding current
over 1 .5A, as operating temperature over 85½C, the
derating current information is necessary to consider .
For the detail derating of current, please refer to the
Derated Current vs . perating Temperature curve .
Wave
6. Soldering
Mildly activated rosin fluxes are preferred . The termination are suitable for re-flow soldering systems . If hand
soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools .
Note . If wave soldering is used, there will be some risk . Re-flow soldering temperatures below 240 degrees, there will
be non-wetting risk .
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