SF-3812TL-T Series – Time Lag & Low Power SMD Fuses
Rated
Current
(A)
0.5
0.75
1
1.5
2
2.5
3
3.5
4
5
Fusing
Time
Resistance
(Ω) Typ.***
0.5479
0.26
0.18
0.1027
0.0504
0.037
0.028
0.0199
0.0158
0.012
Rated Interrupting
Typical
2
Voltage
Rating
I t (A
2
s) ****
1.963
3.375
11.22
14.85
250
VAC
50 A @
250 VAC
19.84
20.5
54
57.82
125.6
185
Agency Recognition
E198545
cUL
R 50421699
TÜV
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
3
Open within
120 sec.
at 250 %
rated current
*** Resistance value measured with ≤10 % rated current at 25 °C ambient. Tolerance ±30 %.
**** Melting I
2
t calculated at 10 times rated current.
Reliability Testing
No.
1
2
Test
Solderability
Test Condition
Temperature setup: 235 ±5 °C
Time setup: 10 ±1 sec.
Requirement
Test Reference
After test terminal electrode wetting area
IEC 60068-2-58
must be greater than 95 %
DCR change ≤ ±15 %
DCR change ≤ ±15 %
No mechanical damage
IEC 60068-2-58
MIL-STD-202G
Method 107G
Test Condition B
MIL-STD-202G
Method 103B
Test Condition A
MIL-STD-202G
Method 101E
Test Condition A
IEC 60127-4
MIL-STD-202G
Method 201A
Resistance to soldering Temperature setup: 235 ±5 °C
heat
Time setup: 30 ± 5 sec.
Temperature setup:
25 °C ~ -65 °C ~ 25 °C ~ 125 °C
Time setup: -65 °C (30 min)
~ 25 °C (5 min) ~ 125 °C (30 min)
~ 25 °C (5 min), 5 cycles
Heat (85 ±0.5 °C)
High Humidity (85 ±1 % RH)
240 hours
Salt spray concentration: 5 ±1 %
Test liquid temperature: 35 ±0.5 °C
96 hours
The board shall be bent by 1 mm
at a rate of 1 mm/sec.
Frequency setup: 10 ~ 55 ~ 10 Hz
Time setup: 1 Minute/cycle
(X-Y-Z, 120 cycles, 6 hours)
3
Thermal shock
4
Humidity unload
DCR change ≤ ±15 %
No mechanical damage
DCR change ≤ ±15 %
No mechanical damage
DCR change ≤ ±15 %
DCR change ≤ ±15 %
No mechanical damage
5
6
7
Salt spray
Bending
Vibration
WARNING Cancer and Reproductive Harm -
www.P65Warnings.ca.gov
* RoHS Directive 2002/95/EC Jan. 27, 2003 including annex and RoHS Recast 2011/65/EU June 8, 2011.
** Bourns considers a product to be “halogen free” if (a) the Bromine (Br) content is 900 ppm or less; (b) the Chlorine (Cl) content is 900 ppm or less; and (c) the total Bromine (Br) and
Chlorine (Cl) content is 1500 ppm or less.
“SinglFuse” is a trademark of Bourns, Inc.
Specifications are subject to change without notice. Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
SinglFuse
™
SF-3812TL-T Series Applications
n
Lighting systems
n
Power adaptors
n
Power supplies
n
AC/DC converters
n
Telecom equipment system power
SF-3812TL-T Series – Time Lag & Low Power SMD Fuses
Environmental Characteristics
Operating Temperature................................................................................. -55 °C to +125 °C
Storage Conditions
Temperature ............................................................................................. +15 °C to +30 °C
Humidity.......................................................................................................... 20 % to 70 %
Shelf Life...........................................................................2 years from manufacturing date
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
SF-3812TL-T
2 mm SMD
Lag & Low Power SMD Fuses
3312 -
Series – Time
Trimming Potentiometer
Average Pre-Arcing Time vs. Current Curves
2 A
2 A
1.5
1.5 A
A
1 A
1 A
0.75
0.75 A
A
Average I
2
t vs. t Curves
2.5
2.5 A
A
3 A
3 A
3.5
3.5 A
A
4 A
4 A
5 A
5 A
0.5
0.5 A
A
100000
100000
1000000
1000000
0.5
0.5 A
A
0.75
0.75 A
A
1 A
1 A
1.5
1.5 A
A
2 A
2 A
2.5
2.5 A
A
3 A
3 A
3.5
3.5 A
A
4 A
4 A
5 A
5 A
10000
10000
100000
100000
PRE-ARCING TIME (SECONDS)
PRE-ARCING TIME (SECONDS)
1000
1000
10000
10000
100
100
10
10
I
2
t (A
2
s)
I
2
t (A
2
s)
1000
1000
100
100
1
1
0.1
0.1
10
10
0.01
0.01
0.1
0.1
1
1
10
10
100
100
1
1
0.01
0.01
0.1
0.1
1
1
10
10
100
100
1000
10000 100000
10000 100000
1000
CURRENT (A)
CURRENT (A)
TIME (SECONDS)
TIME (SECONDS)
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
SF-3812TL-T
2 mm SMD
Lag & Low Power SMD Fuses
3312 -
Series – Time
Trimming Potentiometer
Current Rating Thermal Derating Curve
120
100
DERATING (%)
80
60
40
25 °C
20
0
-60
-40
-20
0
20
40
60
80
100
120
140
AMBIENT TEMPERATURE (°C)
Pulse Cycle Withstand Capability
100,000
NUMBER OF PULSES
10,000
1,000
100
10 %
100 %
PULSE I
2
t / AVERAGE MELTING I
2
t
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
SF-3812TL-T Series – Time Lag & Low Power SMD Fuses
Solder Reflow Recommendations
tp
RAMP-UP
TL
CRITICAL ZONE
T L TO TP
TP
Temperature
TS MAX.
tL
RAMP-DOWN
TS MIN.
ts
PREHEAT
Liquidous Temperature (T
L
)
Time (t
L
) maintained above T
L
Peak Package Body
Temperature (T
p
)
Ramp Up Rate (T
smax
to T
L
)
Ramp Up Rate (T
L
to T
p
)
Profile Feature
Preheat / Soak:
Temperature Min. (T
smin
)
Temperature Max. (T
smax
)
Time (t
s
) from (T
smin
to T
smax
)
Pb-Free Assembly
150 °C
200 °C
60~180 seconds
3 °C / second max.
5 °C / second max.
217 °C
60~90 seconds
235 °C ± 5 °C
20~30 seconds*
6 °C / second max.
8 minutes max.
240 °C
25 °C
t 25 °C TO PEAK
Time
Time within 5 °C of actual peak
temperature (T
p
)
Ramp Down Rate (T
p
to T
L
)
Do not exceed
Time 25 °C to Peak Temperature
* Tolerance for peak profile temperature (Tp ) is defined as a
supplier minimum and a user maximum.
Solder Wave Recommendations
Peak Temperature (Dwell Time)
300
280
260
240
220
Temperature (°C)
Preheat:
Temperature Max. (T
smax
)
Time (Min. to Max.)
Solder Pot Temperature
Solder Dwell Time
Profile Feature
Pb-Free Assembly
150 °C
60~90 seconds
260 °C max.
2~3 seconds
200
180
160
140
120
100
80
60
40
20
0
20
40
60
80
100
120
140
160
180
200
220
240
PREHEAT TIME
COOLING TIME
Time (Sec.)
Specifications are subject to change without notice.
Users should verify actual device performance in their specific applications.
The products described herein and this document are subject to specific legal disclaimers as set forth on the last page of this document, and at www.bourns.com/docs/legal/disclaimer.pdf.
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