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1N5932APE3

产品描述Zener Diode
产品类别分立半导体    二极管   
文件大小354KB,共5页
制造商Microsemi
官网地址https://www.microsemi.com
标准
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1N5932APE3概述

Zener Diode

1N5932APE3规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
Reach Compliance Codecompliant
ECCN代码EAR99
Is SamacsysN
二极管类型ZENER DIODE
JESD-609代码e3
湿度敏感等级1
峰值回流温度(摄氏度)NOT SPECIFIED
端子面层MATTE TIN OVER COPPER
处于峰值回流温度下的最长时间NOT SPECIFIED
Base Number Matches1

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1N5913BPe3 – 1N5956BPe3 (Plastic)
Compliant
Axial-Leaded 1.5 Watt Plastic Zener Diodes
DESCRIPTION
The 1N5913BPe3 – 5956BPe3 series of 1.5 watt Zeners provides voltage regulation in a
selection from 3.3 to 200 volts with different tolerances available. These plastic encapsulated
Zeners have moisture classification of Level 1 with no dry pack required. They are also
available in various military equivalent screening levels for high reliability. The plastic molded
Zeners with a P suffix provide a lower thermal resistance (junction to lead) compared to the
optional glass body (G suffix) for these same JEDEC part numbers. Both package options are
available by Microsemi.
Important:
For the latest information, visit our website
http://www.microsemi.com.
FEATURES
JEDEC registered 1N5913B – 1N5956B number series.
Zener voltage available 3.3 V to 200 V.
Tolerances of 10%, 5%, and 2% are available.
RoHS compliant.
Optional glass body axial-leaded Zeners available as
1N5913BG – 1N5956BG
(see separate data sheet).
DO-41
(DO-204AL)
Plastic Package
Also available in:
SMB package
(tabbed surface mount)
SMBG(J)5913B –
SMBG(J)5956B
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating current and temperature range.
Flexible axial-lead mounting terminals.
Non-sensitive to ESD per MIL-STD-750 method 1020.
Moisture classification is Level 1 per IPC/JEDEC J-STD-020B with no dry pack required.
SMAJ package
(tabbed surface mount)
SMAJ5913B –
SMAJ5956B
Powermite package
(tabbed surface mount)
1PMT5913B –
1PMT5956B
MAXIMUM RATINGS
@ T
A
= 25 C unless otherwise specified
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance Junction-to-Lead
@ 3/8 inch (10 mm) lead length from body
(1)
Thermal Resistance Junction-to-Ambient
(2)
Steady State Power Dissipation
@ T
L
≤ 82.5 ºC
(1)
@ T
A
= 25 ºC
Rated Average Power Dissipation (also see
Figure 1)
Forward Voltage @ 200 mA
Solder Temperature @ 10 s
Symbol
T
J
& T
STG
R
ӨJL
R
ӨJA
P
D
P
M(AV)
V
F
Value
-65 to +150
45
105
1.5
1.19
1.5
1.2
260
Unit
o
C
o
C/W
o
o
C/W
W
W
V
o
C
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: +353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Notes:
1. When mounted on FR4 PC board (1 oz Cu) with 4 mm
2
copper pads and track width 1 mm, length 25 mm.
2. At 3/8 inch (10 mm) lead length from body.
RF01133, Rev. A (5/28/13)
©2013 Microsemi Corporation
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