电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

89H12NT12G2ZCHLG

产品描述FCBGA-324, Tray
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小363KB,共33页
制造商IDT (Integrated Device Technology)
标准
下载文档 详细参数 全文预览

89H12NT12G2ZCHLG在线购买

供应商 器件名称 价格 最低购买 库存  
89H12NT12G2ZCHLG - - 点击查看 点击购买

89H12NT12G2ZCHLG概述

FCBGA-324, Tray

89H12NT12G2ZCHLG规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅不含铅
是否Rohs认证符合
零件包装代码FCBGA
包装说明FCBGA-324
针数324
制造商包装代码HLG324
Reach Compliance Codecompliant
ECCN代码EAR99
Samacsys Confidence3
Samacsys StatusReleased
Samacsys PartID1846198
Samacsys Pin Count324
Samacsys Part CategoryIntegrated Circuit
Samacsys Package CategoryBGA
Samacsys Footprint NameHLG324
Samacsys Released Date2020-01-31 06:16:31
Is SamacsysN
其他特性ALSO OPERATES AT 100 MHZ
总线兼容性I2C; ISA; VGA
最大时钟频率125 MHz
驱动器接口标准IEEE 1149.6AC; IEEE 1149.1
JESD-30 代码S-PBGA-B324
JESD-609代码e1
长度19 mm
湿度敏感等级4
端子数量324
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码BGA
封装等效代码BGA324,18X18,40
封装形状SQUARE
封装形式GRID ARRAY
峰值回流温度(摄氏度)260
电源1,2.5,3.3 V
认证状态Not Qualified
座面最大高度2.88 mm
最大压摆率3300 mA
最大供电电压1.1 V
最小供电电压0.9 V
标称供电电压1 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Silver/Copper (Sn/Ag/Cu)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度19 mm
uPs/uCs/外围集成电路类型BUS CONTROLLER, PCI
Base Number Matches1

文档预览

下载PDF文档
12-Lane 12-Port PCIe® Gen2
System Interconnect Switch
®
89HPES12NT12G2
Datasheet
Device Overview
The 89HPES12NT12G2 is a member of the IDT family of PCI
Express® switching solutions. The PES12NT12G2 is a 12-lane, 12-port
system interconnect switch optimized for PCI Express Gen2 packet
switching in high-performance applications, supporting multiple simulta-
neous peer-to-peer traffic flows. Target applications include multi-host or
intelligent I/O based systems where inter-domain communication is
required, such as servers, storage, communications, and embedded
systems.
Features
High Performance Non-Blocking Switch Architecture
12-lane, 12-port PCIe switch with flexible port configuration
Integrated SerDes supports 5.0 GT/s Gen2 and 2.5 GT/s
Gen1 operation
Delivers up to 12 GBps (96 Gbps) of switching capacity
Supports 128 Bytes to 2 KB maximum payload size
Low latency cut-through architecture
Supports one virtual channel and eight traffic classes
Port Configurability
Twelve x1 ports configurable as follows:
One x4 stack
• Four x1 ports (ports 0 through 3 are not capable of
merging with an adjacent port)
Two x4 stacks configurable as:
• Two x4 ports
• Four x2 ports
• Eight x1 ports
Automatic per port link width negotiation
(x4
x2
x1)
Crosslink support
Automatic lane reversal
Per lane SerDes configuration
De-emphasis
Receive equalization
Drive strength
Innovative Switch Partitioning Feature
Supports up to 4 fully independent switch partitions
Logically independent switches in the same device
Configurable downstream port device numbering
Supports dynamic reconfiguration of switch partitions
Dynamic port reconfiguration — downstream, upstream,
non-transparent bridge
Dynamic migration of ports between partitions
Movable upstream port within and between switch partitions
Non-Transparent Bridging (NTB) Support
Supports up to 3 NT endpoints per switch, each endpoint can
communicate with other switch partitions or external PCIe
domains or CPUs
6 BARs per NT Endpoint
Bar address translation
All BARs support 32/64-bit base and limit address translation
Two BARs (BAR2 and BAR4) support look-up table based
address translation
32 inbound and outbound doorbell registers
4 inbound and outbound message registers
Supports up to 64 masters
Unlimited number of outstanding transactions
Multicast
Compliant with the PCI-SIG multicast
Supports 64 multicast groups
Supports multicast across non-transparent port
Multicast overlay mechanism support
ECRC regeneration support
Integrated Direct Memory Access (DMA) Controllers
Supports up to 2 DMA upstream ports, each with 2 DMA chan-
nels
Supports 32-bit and 64-bit memory-to-memory transfers
Fly-by translation provides reduced latency and increased
performance over buffered approach
Supports arbitrary source and destination address alignment
Supports intra- as well as inter-partition data transfers using
the non-transparent endpoint
Supports DMA transfers to multicast groups
Linked list descriptor-based operation
Flexible addressing modes
Linear addressing
Constant addressing
Quality of Service (QoS)
Port arbitration
Round robin
Request metering
IDT proprietary feature that balances bandwidth among
switch ports for maximum system throughput
High performance switch core architecture
Combined Input Output Queued (CIOQ) switch architecture
with large buffers
Clocking
Supports 100 MHz and 125 MHz reference clock frequencies
Flexible port clocking modes
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 32
December 16, 2013
请教高手-关于LM3S8962 电路设计的问题
LM3S8962的VDD与GND之间的电路问题: 1.\一种设计方式,所有的GND短接接地,所有的VDD25短接,然后接电容接地;所有的VDD33短接,然后接电容接地。(美国原厂的电路图就是这样的) 2。 ......
eeleader 微控制器 MCU
arm下GPRS拨号,能拨号上去,却不能通信。
PPP link to ppp0 terminated. # ./ppp-on Serial connection established. using channel 4 Using interface ppp0 Connect: ppp0 /dev/ttyS2 Warning - secret file /etc/ppp/pap-secre ......
simbill ARM技术
STM32微控制器系列介绍
302384 STM32微控制器的简介。 ...
低调的路人 stm32/stm8
DSP 28335Control Suit点灯实验
本帖最后由 Aguilera 于 2020-8-8 18:18 编辑 首先Example_2833xLEDBlink为官方TI公司所提供的代码 DSP2833x eZdsp LED Blink Getting Started Program. 能够发现自己的基础不是太好,主要 ......
Aguilera DSP 与 ARM 处理器
AT89C51中文说明书
AT89C51中文说明书...
呱呱 51单片机
手机Quick-Jack
这不是一个MSP430的设备,但是确实非常适合MSP430的应用领域 151018恩智浦半导体公司(纳斯达克代码:NXPI)今日宣布推出一种新型多功能智能手机Quick-Jack解决方案,简化了各种外部设备与智能 ......
wstt 微控制器 MCU

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2758  2578  475  1339  517  11  30  51  1  17 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved