电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

1N3018CUR-1TR

产品描述Zener Diode, 8.2V V(Z), 2%, 1.25W, Silicon, Unidirectional, DO-213AB, HERMETIC SEALED, LEADLESS, GLASS, MELF-2
产品类别分立半导体    二极管   
文件大小161KB,共3页
制造商Microsemi
官网地址https://www.microsemi.com
下载文档 详细参数 全文预览

1N3018CUR-1TR概述

Zener Diode, 8.2V V(Z), 2%, 1.25W, Silicon, Unidirectional, DO-213AB, HERMETIC SEALED, LEADLESS, GLASS, MELF-2

1N3018CUR-1TR规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Microsemi
零件包装代码DO-213AB
包装说明HERMETIC SEALED, LEADLESS, GLASS, MELF-2
针数2
Reach Compliance Codeunknown
ECCN代码EAR99
Is SamacsysN
其他特性METALLURGICALLY BONDED, HIGH RELIABILITY
外壳连接ISOLATED
配置SINGLE
二极管元件材料SILICON
二极管类型ZENER DIODE
最大动态阻抗4.5 Ω
JEDEC-95代码DO-213AB
JESD-30 代码O-LELF-R2
JESD-609代码e0
元件数量1
端子数量2
最高工作温度175 °C
封装主体材料GLASS
封装形状ROUND
封装形式LONG FORM
峰值回流温度(摄氏度)NOT SPECIFIED
极性UNIDIRECTIONAL
最大功率耗散1.25 W
认证状态Not Qualified
标称参考电压8.2 V
表面贴装YES
技术ZENER
端子面层TIN LEAD
端子形式WRAP AROUND
端子位置END
处于峰值回流温度下的最长时间NOT SPECIFIED
最大电压容差2%
工作测试电流31 mA
Base Number Matches1

文档预览

下载PDF文档
1N3016BUR-1 thru 1N3051BUR-1, e3
(or MLL3016B thru MLL3051B, e3)
SCOTTSDALE DIVISION
Surface Mount 1.5 W
GLASS ZENER DIODES
DESCRIPTION
This surface mountable zener diode series is similar to the 1N3016 thru
1N3051 JEDEC registration in the DO-13 package except that it meets the
surface mount DO-213AB outline. It is an ideal selection for applications of
high density and low parasitic requirements. Due to its glass hermetic seal
qualities and metallurgically enhanced internal construction, it is also well
suited for high-reliability applications. This can be acquired by a source
control drawing (SCD), or by ordering device types with MQ, MX, or MV
prefix to part number for equivalent screening to JAN, JANTX or JANTXV.
APPEARANCE
WWW .
Microsemi
.C
OM
DO-213AB
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
FEATURES
Leadless surface mount package equivalents to the
JEDEC registered 1N3016 thru 1N3051 except with
higher power rating of 1.5 Watts
Ideal for high-density mounting
Voltage range: 6.8 to 200 volts
Hermetically sealed, double-slug glass construction
Metallurgically enhanced contact construction.
Options for screening in accordance with MIL-PRF-
19500/115 for JAN, JANTX, JANTXV, and JANS with
MQ, MX, MV, or MSP prefixes respectively for part
numbers, e.g. MX1N3016BUR-1, MV1N3051BUR-1,
etc.
Axial lead “thru-hole” DO-13 packages per JEDEC
registration available as 1N3016B thru 1N3051B (see
separate data sheet with MIL-PRF-19500/115
qualification)
RoHS Compliant devices available by adding “e3” suffix
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating current
and temperature range
Wide selection from 6.8 to 200 V
Tight voltage tolerances available
Low reverse (leakage) currents
Leadless package for surface mounting
Ideal for high-density mounting
Metallurgically enhanced internal contact design for
greater reliability and lower thermal resistance
Nonsensitive to ESD
Hermetically sealed glass package
Specified capacitance (see Figure 2)
Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
Power dissipation at 25
º
C: 1.5 watts (also see
derating in Figure 1).
Operating and Storage temperature: -65
º
C to
+175
º
C
Thermal Resistance: 40
º
C/W junction to end cap,
º
or 120 C/W junction to ambient when mounted on
FR4 PC board (1 oz Cu) with recommended
footprint (see last page)
Steady-State Power: 1.50 watts at end-cap
temperature T
EC
< 115
o
C, or 1.25 watts at T
A
= 25
º
C
when mounted on FR4 PC board and
recommended footprint as described for thermal
resistance (also see Figure 1)
Forward voltage @200 mA: 1.2 volts (maximum)
º
Solder Temperatures: 260 C for 10 s (max)
MECHANICAL AND PACKAGING
CASE: Hermetically sealed glass MELF package
TERMINALS: Tin-lead or RoHS compliant
annealed matte-Tin plating solderable per MIL-
STD-750, method 2026
POLARITY: Cathode indicated by band. Diode to
be operated with the banded end positive with
respect to the opposite end for Zener regulation
MARKING: Cathode band only
TAPE & REEL optional: Standard per EIA-481-1-A
with 12 mm tape, 1500 per 7 inch reel or 5000 per
13 inch reel (add “TR” suffix to part number)
WEIGHT: 0.05 grams
See package dimensions on last page
1N3016BUR-1, e3 thru
1N3051BUR-1, e3
Copyright
©
2006
3-12-2006 REV D
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
PB5.0升级2008全年升级包后 定制内核 生成的NK.nb0无法运行
第一步:把PB5.0升级2008全年升级包,在优龙2410开发板资料提供的ARMSYS2410.pbxml基础上把.net compact framework 2.0 add to OS,编译通过,生成的NK.nb0(大小为29M),在DNW下可以通过USB下 ......
lao3 嵌入式系统
两种硬件描述语言VHDL_Verilog的发展及其应用_罗杰
新人贴,希望咱们的论坛越来越火吧,现在感觉缺点人气 呵呵...
super红红55 FPGA/CPLD
采用RF技术的无人超市,你体验过吗?
各类零售企业——从杂货店到五金以及消费电子产品门店——都正迅速采用电子货架标签;零售商将这些标签置于零售货架以更新产品信息。根据 Verified Market Research 的数据 ......
zqy1111 无线连接
IC 开漏输出引脚Hiz
645867这个IC的错误输出PIN FAULT_B是个开漏输出,这里面的Hiz是什么意思有大佬知道吗。我找了整个说明书,没有说明呀 ...
小太阳yy 开关电源学习小组
【Altera SOC体验之旅】(二)PS2键盘
本帖最后由 Jackzhang1992 于 2015-4-17 11:04 编辑 (二)PS2键盘一、老式的电脑都采用PS/2接口协议的键盘。 194847(该图转自http://www.cnblogs.com/jianyungsun/archive/2011/03/18/198 ......
Jackzhang1992 FPGA/CPLD
TI 电源设计小贴士 30
欢迎来到电源设计小贴士!随着现在对更高效、更低成本电源解决方案需求的强调,我们创建了该专栏,就各种电源管理课题提出一些对您有帮助的小技巧。该专栏面向各级设计工程师。无论您是从事电 ......
trevor 模拟与混合信号

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1408  1066  2834  1114  1030  58  53  31  17  15 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved