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1206A2000101MCBE03

产品描述Ceramic Capacitor, Ceramic, 200V, 20% +Tol, 20% -Tol, C0G, -/+30ppm/Cel TC, 0.0001uF, 1206,
产品类别无源元件    电容器   
文件大小413KB,共2页
制造商Knowles
官网地址http://www.knowles.com
下载文档 详细参数 全文预览

1206A2000101MCBE03概述

Ceramic Capacitor, Ceramic, 200V, 20% +Tol, 20% -Tol, C0G, -/+30ppm/Cel TC, 0.0001uF, 1206,

1206A2000101MCBE03规格参数

参数名称属性值
是否Rohs认证不符合
Objectid926980806
包装说明, 1206
Reach Compliance Codecompliant
Country Of OriginMainland China
ECCN代码EAR99
YTEOL5.21
电容0.0001 µF
电容器类型CERAMIC CAPACITOR
介电材料CERAMIC
高度1.1 mm
JESD-609代码e0
长度3.2 mm
负容差20%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形式SMT
包装方法Bulk
正容差20%
额定(直流)电压(URdc)200 V
系列X2Y
尺寸代码1206
温度特性代码C0G
温度系数30ppm/Cel ppm/°C
端子面层Tin/Lead (Sn90Pb10) - with Nickel (Ni) barrier
宽度1.6 mm

文档预览

下载PDF文档
sales@syfer.co.uk
www.syfer.com
Surface mount EMI filters
X2Y Integrated Passive Components
X2Y
The Syfer X2Y Integrated Passive Component is a 3
terminal EMI chip device.
When used in balanced line applications, the
revolutionary design provides simultaneous line-to-
line and line-to-ground filtering, using a single ceramic
chip. In this way, differential and common mode
filtering are provided in one device.
For unbalanced applications, it provides ultra low ESL
(equivalent series inductance). Capable of replacing 2
or more conventional devices, it is ideal for balanced
and unbalanced lines, twisted pairs and dc motors, in
automotive, audio, sensor and other applications.
Available in sizes from 0603 to 2220, these filters can
prove invaluable in meeting stringent EMC demands.
Manufactured in the UK by Syfer Technology Limited under licence from X2Y attenuators LLC.
+44 1603 723310
+44 1603 723301
Dielectric
X7R or C0G/NP0
Typical capacitance matching
Better than 5%
Temperature rating
-55°C to 125°C
Insulation resistance
100Gohms or 1000s (whichever is the less)
Syfer Technology Limited
Electrical configuration
Multiple capacitance
Capacitance measurement
At 1000hr point
Dielectric withstand voltage
<200V 2.5 times rated Volts for 5 secs
500V 1.5 times rated Volts for 5 secs
Charging current limited to 50mA Max.
Type
Chip size
Rated
voltage
16Vdc
25Vdc
50Vdc
100Vdc
200Vdc
500Vdc
Dielectric
C0G/NP0
X7R
C0G/NP0
X7R
C0G/NP0
X7R
C0G/NP0
X7R
C0G/NP0
X7R
C0G/NP0
X7R
150pF
15nF
120pF
12nF
10pF - 100pF
150pF - 10nF
-
-
-
-
-
-
-
-
560pF - 820pF
56nF - 68nF
390pF - 470pF
18nF - 47nF
10pF - 330pF
470pF - 15nF
-
-
-
-
0603
L
W
1.6±0.2
(0.063±0.008)
0.8±0.2
(0.03±0.008)
0.5±0.15
(0.02±0.006)
0.4±0.15
(0.016±0.006)
0.25±0.15
(0.010±0.006)
E03
0603
0805
1206
1410
1812
2220
Minimum and maximum capacitance values
-
-
1.8nF - 3.3nF
-
1.2nF - 1.5nF
56nF - 220nF
22pF - 1.0nF
1.5nF - 47nF
22pF - 1.0nF
820pF - 33nF
-
-
0805
2.0±0.3
(0.08±0.012)
1.25±0.2
(0.05±0.008)
1.0±0.15
(0.04±0.006)
0.5±0.25
(0.02±0.01)
0.3±0.15
(0.012±0.006)
-
-
6.8nF - 8.2nF
470nF
4.7nF - 5.6nF
180nF - 400nF
100pF - 3.9nF
4.7nF - 150nF
100pF - 3.3nF
1.2nF - 120nF
-
-
1206
3.2±0.3
(0.126±0.012)
1.60±0.2
(0.063±0.008)
1.1±0.2
(0.043±0.008)
0.95±0.3
(0.037±0.012)
0.5±0.25
(0.02±0.01)
-
-
12nF - 15nF
820nF
8.2nF - 10nF
390nF - 680nF
820pF - 6.8nF
8.2nF - 330nF
820pF - 5.6nF
2.7nF - 180nF
820pF - 3.9nF
2.7nF - 100nF
1410
3.6±0.3
(0.14±0.012)
2.5±0.3
(0.1±0.012)
2.0 max.
(0.08 max.)
1.20±0.3
(0.047±0.012)
0.5±0.25
(0.02±0.01)
-
-
22nF - 33nF
1.2µF
18nF
560nF - 1.0µF
1.0nF - 15nF
10nF - 470nF
1.0nF - 15nF
4.7nF - 470nF
1.0nF - 10nF
4.7nF - 180nF
2220
5.7±0.4
(0.22±0.016)
5.0±0.4
(0.2±0.016)
2.5 max.
(0.1 max.)
2.25±0.4
(0.09±0.016)
0.75±0.25
(0.03±0.01)
Notes: 1) For some lower capacitance parts, higher voltage
rated parts may be supplied.
1812
4.5±0.35
(0.18±0.014)
3.2±0.3
(0.126±0.012)
2.1 max.
(0.08 max.)
1.4±0.35
(0.06±0.014)
0.75±0.25
(0.03±0.01)
L
T
B1
T
W
B2
B2
B1
Notes: 1) All dimensions mm (inches).
2) Pad widths less than chip width gives improved mechanical performance.
3) The solder stencil should place 4 discrete solder pads. The un-printed distance between
ground pads is shown as dim E.
4) Insulating the earth track underneath the filters is acceptable and can help avoid
displacement of filter during soldering
but can result in residue entrapment under the chip.
Recommended solder lands
D
B
E
A
0603
A
B
C
D
0.6 (0.024)
0.6 (0.024)
0.4 (0.016)
0.2 (0.008)
0.4 (0.016)
0805
0.95 (0.037)
0.9 (0.035)
0.3 (0.012)
0.4 (0.016)
0.75 (0.030)
1206
1.2 (0.047)
0.9 (0.035)
0.6 (0.024)
0.8 (0.031 )
1.0 (0.039)
1410
2.05 (0.08)
1.0 (0.040)
0.7 (0.028)
0.9 (0.035)
1.85 (0.071)
1812
2.65 (0.104)
1.4 (0.055)
0.8 (0.031)
1.4 (0.055)
2.05 (0.080)
2220
4.15 (0.163)
1.4 (0.055)
1.2 (0.047)
1.8 (0.071)
3.95 (0.156)
C
E
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