电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

C0603X101K2GALAUTO

产品描述Ceramic Capacitor, Multilayer, Ceramic, 200V, 10% +Tol, 10% -Tol, C0G, -/+30ppm/Cel TC, 0.0001uF, 0603,
产品类别无源元件    电容器   
文件大小1MB,共20页
制造商KEMET(基美)
官网地址http://www.kemet.com
下载文档 详细参数 全文预览

C0603X101K2GALAUTO概述

Ceramic Capacitor, Multilayer, Ceramic, 200V, 10% +Tol, 10% -Tol, C0G, -/+30ppm/Cel TC, 0.0001uF, 0603,

C0603X101K2GALAUTO规格参数

参数名称属性值
是否Rohs认证不符合
Objectid7296276019
包装说明, 0603
Reach Compliance Codenot_compliant
ECCN代码EAR99
YTEOL6.9
电容0.0001 µF
电容器类型CERAMIC CAPACITOR
介电材料CERAMIC
高度0.8 mm
长度1.6 mm
安装特点SURFACE MOUNT
多层Yes
负容差10%
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
封装形式SMT
包装方法TR, Punched Paper, 7 Inch
正容差10%
额定(直流)电压(URdc)200 V
参考标准AEC-Q200
尺寸代码0603
表面贴装YES
温度特性代码C0G
温度系数30ppm/Cel ppm/°C
端子形状WRAPAROUND
宽度0.8 mm

文档预览

下载PDF文档
Surface Mount Multilayer Ceramic Chip Capacitors (SMD MLCCs)
Flexible Termination System (FT-CAP), C0G Dielectric,
10 – 250 VDC (Commercial & Automotive Grade)
Overview
KEMET’s Flexible Termination (FT-CAP) Multilayer Ceramic
Capacitor in C0G dielectric incorporates a unique, flexible
termination system that is integrated with KEMET’s
standard termination materials. A conductive silver epoxy
is utilized between the base metal and nickel barrier
layers of KEMET’s standard termination system in order
to establish pliability while maintaining terminal strength,
solderability and electrical performance. This technology
was developed in order to address the primary failure
mode of MLCCs– flex cracks, which are typically the result
of excessive tensile and shear stresses produced during
board flexure and thermal cycling. Flexible termination
technology inhibits the transfer of board stress to the rigid
ceramic body, therefore mitigating flex cracks which can
result in low IR or short circuit failures.
Although this technology does not eliminate the potential
for mechanical damage that may propagate during extreme
environmental and handling conditions, it does provide
superior flex performance over standard termination
systems. FT-CAP complements KEMET’s Open Mode,
Floating Electrode (FE-CAP), Floating Electrode with
Flexible Termination (FF-CAP), and KEMET Power Solutions
(KPS) product lines by providing a complete portfolio of
flex mitigation solutions.
Combined with the stability of C0G dielectric and designed to
accommodate all capacitance requirements, these flex-robust
devices are RoHS Compliant, offer up to 5 mm of flex-bend
capability and exhibit no change in capacitance with respect
to time and voltage. Capacitance change with reference to
ambient temperature is limited to ±30 ppm/ºC from −55°C to
+125°C.
In addition to Commercial Grade, Automotive Grade devices
are available which meet the demanding Automotive
Electronics Council's AEC–Q200 qualification requirements.
Click image above for interactive 3D content
Open PDF in Adobe Reader for full functionality
Ordering Information
C
Ceramic
1206
X
563
Capacitance
Code (pF)
Two significant digits
and number of zeros.
Use 9 for 1.0 – 9.9 pF
Use 8 for 0.5 – .99 pF
e.g., 2.2 pF = 229
e.g., 0.5 pF = 508
J
Capacitance
Tolerance
1
B = ±0.10 pF
C = ±0.25 pF
D = ±0.5 pF
F = ±1%
G = ±2%
J = ±5%
K = ±10%
M = ±20%
3
Rated
Voltage
(VDC)
8 = 10
4 = 16
3 = 25
5 = 50
1 = 100
2 = 200
A = 250
G
Dielectric
G = C0G
A
Failure
Rate/
Design
A = N/A
C
Termination Finish
2
C = 100% Matte Sn
L = SnPb (5% Pb minimum)
TU
Packaging/
Grade (C-Spec)
See
"Packaging
C-Spec
Ordering
Options
Table"
Case Size
Specification/
(L" x W")
Series
0603
0805
1206
1210
1812
1825
2220
2225
X = Flexible
Termination
1
2
Additional capacitance tolerance offerings may be available. Contact KEMET for details.
Additional termination finish options may be available. Contact KEMET for details.
Built Into Tomorrow
© KEMET Electronics Corporation • KEMET Tower • One East Broward Boulevard
Fort Lauderdale, FL 33301 USA • 954-766-2800 • www.kemet.com
C1062_C0G_FT-CAP_SMD • 9/14/2020
1
【EEWORLD第十届社区明星人物】12月明星人物新鲜出炉
又到了网友评选结果出炉的时候了,EEWORLD的例行评选,也是奋战于2009年最后一个月的网友们的回馈。 2010年的评选奖品将更加丰富,HOHO~~~敬请关注 感谢网友们一如既往的关注和各位“斑斑 ......
EEWORLD社区 为我们提建议&公告
c#+wince
请教:在c#下开发wince应用程序,如何显示一副地图?谢谢!...
jim_gao 嵌入式系统
南华大学黄智伟系列-一些典型的运算放大器OP应用电路结构(精华版)
本帖最后由 paulhyde 于 2014-9-15 02:57 编辑 搜集整理了一些典型的运算放大器(OP)应用电路结构如下,供各位参考:(以下内容主要摘自“吴运昌.模拟集成电路原理与应用.广州:华南理工大学 ......
小煜 电子竞赛
设计3D打印,3D机器视觉,光谱分析的童鞋看过来!进入有福利哦!
TI DLP®工业应用研讨会 10月25日 西安 • 10月27日 东莞 2016 TI DLP® 工业应用研讨会火热报名中,继前两轮研讨会成功举办后, DLP 团队将带着最前沿的技术和解决方案来到 ......
EEWORLD社区 DSP 与 ARM 处理器
请问大家谁知道哪些书上有解释BIOS细节的
我想找到自己做个软的.我看虚拟机都是这么做的....
dj0930 嵌入式系统
help:2407对称pwm波发的不正确
...
panama 微控制器 MCU

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 487  2181  626  1140  2643  55  44  33  13  59 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved