IC,ECL-TO-TTL TRANSLATOR,ECL100/TTL,DIP,24PIN,CERAMIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | National Semiconductor（TI ） |
| Reach Compliance Code | compliant |
| Is Samacsys | N |
| 接口集成电路类型 | ECL TO TTL TRANSLATOR |
| JESD-30 代码 | R-XDIP-T24 |
| JESD-609代码 | e0 |
| 端子数量 | 24 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 5,-4.5 V |
| 认证状态 | Not Qualified |
| 表面贴装 | NO |
| 技术 | ECL100K |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| F100328DM | F100328QCQR | F100328DMQR | 2N6125-6258 | F100328FM | 2N7271D2 | |
|---|---|---|---|---|---|---|
| 描述 | IC,ECL-TO-TTL TRANSLATOR,ECL100/TTL,DIP,24PIN,CERAMIC | IC,ECL-TO-TTL TRANSLATOR,ECL100/TTL,LDCC,28PIN,PLASTIC | IC,ECL-TO-TTL TRANSLATOR,ECL100/TTL,DIP,24PIN,CERAMIC | 4A, 60V, PNP, Si, POWER TRANSISTOR, TO-220AB | IC,ECL-TO-TTL TRANSLATOR,ECL100/TTL,QFL,24PIN,CERAMIC | TRANSISTOR,MOSFET,N-CHANNEL,100V V(BR)DSS,14A I(D),TO-204AA |
| Reach Compliance Code | compliant | unknown | compliant | unknown | compliant | not_compliant |
| 最高工作温度 | 125 °C | 85 °C | 125 °C | 150 °C | 125 °C | 150 °C |
| 表面贴装 | NO | YES | NO | NO | YES | NO |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | - | 不符合 | 不符合 |
| 厂商名称 | National Semiconductor（TI ） | National Semiconductor（TI ） | National Semiconductor（TI ） | - | National Semiconductor（TI ） | - |
| Is Samacsys | N | N | N | - | N | - |
| 接口集成电路类型 | ECL TO TTL TRANSLATOR | ECL TO TTL TRANSLATOR | ECL TO TTL TRANSLATOR | - | ECL TO TTL TRANSLATOR | - |
| JESD-30 代码 | R-XDIP-T24 | S-PQCC-J28 | R-XDIP-T24 | R-PSFM-T3 | S-XQFP-F24 | - |
| JESD-609代码 | e0 | e0 | e0 | - | e0 | e0 |
| 端子数量 | 24 | 28 | 24 | 3 | 24 | - |
| 封装主体材料 | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | CERAMIC | - |
| 封装代码 | DIP | QCCJ | DIP | - | QFF | - |
| 封装等效代码 | DIP24,.4 | LDCC28,.5SQ | DIP24,.4 | - | QFL24,.4SQ | - |
| 封装形状 | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | - |
| 封装形式 | IN-LINE | CHIP CARRIER | IN-LINE | FLANGE MOUNT | FLATPACK | - |
| 电源 | 5,-4.5 V | 5,-4.5 V | 5,-4.5 V | - | 5,-4.5 V | - |
| 技术 | ECL100K | ECL100K | ECL100K | - | ECL100K | - |
| 温度等级 | MILITARY | OTHER | MILITARY | - | MILITARY | - |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | FLAT | - |
| 端子节距 | 2.54 mm | 1.27 mm | 2.54 mm | - | 1.27 mm | - |
| 端子位置 | DUAL | QUAD | DUAL | SINGLE | QUAD | - |
| Base Number Matches | 1 | 1 | 1 | - | 1 | - |
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