Wide Temperature Range Version 16 M SRAM (1-Mword x 16-bit / 2-Mword x 8-bit)
| 参数名称 | 属性值 |
| Brand Name | Renesas |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Renesas(瑞萨电子) |
| 零件包装代码 | TSOP(1) |
| 包装说明 | TSOP1, |
| 针数 | 48 |
| 制造商包装代码 | PTSA0048KH-A48 |
| Reach Compliance Code | compliant |
| Samacsys Confidence | 3 |
| Samacsys Status | Released |
| Samacsys PartID | 938498 |
| Samacsys Pin Count | 48 |
| Samacsys Part Category | Integrated Circuit |
| Samacsys Package Category | Small Outline Packages |
| Samacsys Footprint Name | P-TSOP(1) 48-12×18.4-0.50-1 |
| Samacsys Released Date | 2019-11-30 05:51:24 |
| Is Samacsys | N |
| 最长访问时间 | 45 ns |
| 备用内存宽度 | 8 |
| JESD-30 代码 | R-PDSO-G48 |
| 内存密度 | 16777216 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端子数量 | 48 |
| 字数 | 1048576 words |
| 字数代码 | 1000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 1MX16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP1 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| R1LV1616HSA-4SI#B1 | R1LV1616HSA-4SI#B0 | R1LV1616HSA-4SI#S1 | R1LV1616HSA-5SI#S0 | R1LV1616HSA-5SI#B0 | R1LV1616HSA-4SI#S0 | R1LV1616HSA-5SI#B1 | R1LV1616HSA-5SI#S1 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Wide Temperature Range Version 16 M SRAM (1-Mword x 16-bit / 2-Mword x 8-bit) | Wide Temperature Range Version 16 M SRAM (1-Mword x 16-bit / 2-Mword x 8-bit) | Wide Temperature Range Version 16 M SRAM (1-Mword x 16-bit / 2-Mword x 8-bit) | Wide Temperature Range Version 16 M SRAM (1-Mword x 16-bit / 2-Mword x 8-bit) | Wide Temperature Range Version 16 M SRAM (1-Mword x 16-bit / 2-Mword x 8-bit) | Wide Temperature Range Version 16 M SRAM (1-Mword x 16-bit / 2-Mword x 8-bit) | Wide Temperature Range Version 16 M SRAM (1-Mword x 16-bit / 2-Mword x 8-bit) | Wide Temperature Range Version 16 M SRAM (1-Mword x 16-bit / 2-Mword x 8-bit) |
| Brand Name | Renesas | Renesas | Renesas | Renesas | Renesas | Renesas | Renesas | Renesas |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
| 零件包装代码 | TSOP(1) | TSOP(1) | TSOP(1) | TSOP(1) | TSOP(1) | TSOP(1) | TSOP(1) | TSOP(1) |
| 针数 | 48 | 48 | 48 | 48 | 48 | 48 | 48 | 48 |
| 制造商包装代码 | PTSA0048KH-A48 | PTSA0048KA-A48 | PTSA0048KH-A48 | PTSA0048KA-A48 | PTSA0048KA-A48 | PTSA0048KA-A48 | PTSA0048KH-A48 | PTSA0048KH-A48 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compli | compli | compli |
| 包装说明 | TSOP1, | 12 X 18.40 MM, 0.50 MM PITCH, ROHS COMPLIANT, PLASTIC, TSOP1-48 | TSOP1, | PLASTIC, LEAD FREE, TSOP1-48 | - | TSOP1, TSSOP48,.8,20 | SOP, | , |
| 最长访问时间 | 45 ns | - | 45 ns | 55 ns | 55 ns | 45 ns | 55 ns | - |
| 备用内存宽度 | 8 | - | 8 | 8 | - | 8 | 8 | - |
| JESD-30 代码 | R-PDSO-G48 | - | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | - |
| 内存密度 | 16777216 bit | - | 16777216 bit | 16777216 bit | 16777216 bit | 16777216 bi | 16777216 bi | - |
| 内存集成电路类型 | STANDARD SRAM | - | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 16 | - | 16 | 16 | 16 | 16 | 16 | - |
| 功能数量 | 1 | - | 1 | 1 | - | 1 | 1 | - |
| 端子数量 | 48 | - | 48 | 48 | 48 | 48 | 48 | - |
| 字数 | 1048576 words | - | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | - |
| 字数代码 | 1000000 | - | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | - |
| 工作模式 | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | - |
| 最高工作温度 | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | - |
| 最低工作温度 | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | - |
| 组织 | 1MX16 | - | 1MX16 | 1MX16 | 1MX16 | 1MX16 | 1MX16 | - |
| 封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
| 封装代码 | TSOP1 | - | TSOP1 | TSSOP | TSSOP | TSOP1 | SOP | - |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | - | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE | - |
| 并行/串行 | PARALLEL | - | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | - |
| 最大供电电压 (Vsup) | 3.6 V | - | 3.6 V | 3.6 V | - | 3.6 V | 3.6 V | - |
| 最小供电电压 (Vsup) | 2.7 V | - | 2.7 V | 2.7 V | - | 2.7 V | 2.7 V | - |
| 标称供电电压 (Vsup) | 3 V | - | 3 V | 3 V | - | 3 V | 3 V | - |
| 表面贴装 | YES | - | YES | YES | YES | YES | YES | - |
| 技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS | - |
| 温度等级 | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | - |
| 端子形式 | GULL WING | - | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | - |
| 端子位置 | DUAL | - | DUAL | DUAL | DUAL | DUAL | DUAL | - |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
