TTL to ECL Translator, 6 Func, Complementary Output, ECL, CQFP24, CERPACK-24
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Fairchild |
零件包装代码 | QFP |
包装说明 | QFF, QFL24,.4SQ |
针数 | 24 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
Is Samacsys | N |
最大延迟 | 2.8 ns |
接口集成电路类型 | TTL TO ECL TRANSLATOR |
JESD-30 代码 | S-GQFP-F24 |
JESD-609代码 | e0 |
长度 | 9.398 mm |
位数 | 1 |
功能数量 | 6 |
端子数量 | 24 |
最高工作温度 | 85 °C |
最低工作温度 | |
输出特性 | OPEN-EMITTER |
输出锁存器或寄存器 | NONE |
输出极性 | COMPLEMENTARY |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | QFF |
封装等效代码 | QFL24,.4SQ |
封装形状 | SQUARE |
封装形式 | FLATPACK |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 5,-4.5 V |
认证状态 | Not Qualified |
座面最大高度 | 2.159 mm |
最大供电电压 | 5.5 V |
最小供电电压 | 4.5 V |
标称供电电压 | 5 V |
电源电压1-最大 | -5.7 V |
电源电压1-分钟 | -4.2 V |
电源电压1-Nom | -4.5 V |
表面贴装 | YES |
技术 | ECL |
温度等级 | OTHER |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | FLAT |
端子节距 | 1.27 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 9.398 mm |
Base Number Matches | 1 |
100324FC | 100324DMQB | 100324DM | 0502-950K500-BE224 | 100324FM | |
---|---|---|---|---|---|
描述 | TTL to ECL Translator, 6 Func, Complementary Output, ECL, CQFP24, CERPACK-24 | TTL to ECL Translator, 6 Func, Complementary Output, ECL, CDIP24, 0.400 INCH, CERAMIC, DIP-24 | TTL to ECL Translator, 6 Func, Complementary Output, ECL, CDIP24, 0.400 INCH, CERAMIC, DIP-24 | Potentiometer, Carbon, 0.2W, 220000ohm, 10% +/-Tol, 7963 | TTL to ECL Translator, 6 Func, Complementary Output, ECL, CQFP24, CERPACK-24 |
包装说明 | QFF, QFL24,.4SQ | DIP, DIP24,.4 | DIP, | Panel Mount, | QFF, |
Reach Compliance Code | unknown | unknown | unknown | compliant | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
端子数量 | 24 | 24 | 24 | 3 | 24 |
最高工作温度 | 85 °C | 125 °C | 125 °C | 70 °C | 125 °C |
最低工作温度 | - | -55 °C | -55 °C | -25 °C | -55 °C |
封装形式 | FLATPACK | IN-LINE | IN-LINE | Panel Mount | FLATPACK |
表面贴装 | YES | NO | NO | NO | YES |
技术 | ECL | ECL | ECL | CARBON | ECL |
是否Rohs认证 | 不符合 | 不符合 | - | 符合 | - |
厂商名称 | Fairchild | Fairchild | Fairchild | - | Fairchild |
零件包装代码 | QFP | DIP | DIP | - | QFP |
针数 | 24 | 24 | 24 | - | 24 |
Is Samacsys | N | N | N | - | N |
最大延迟 | 2.8 ns | 3.3 ns | 3.3 ns | - | 3.3 ns |
接口集成电路类型 | TTL TO ECL TRANSLATOR | TTL TO ECL TRANSLATOR | TTL TO ECL TRANSLATOR | - | TTL TO ECL TRANSLATOR |
JESD-30 代码 | S-GQFP-F24 | R-GDIP-T24 | R-GDIP-T24 | - | S-GQFP-F24 |
JESD-609代码 | e0 | e0 | - | e3 | - |
位数 | 1 | 1 | 1 | - | 1 |
功能数量 | 6 | 6 | 6 | - | 6 |
输出特性 | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | - | OPEN-EMITTER |
输出锁存器或寄存器 | NONE | NONE | NONE | - | NONE |
输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | - | COMPLEMENTARY |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - | CERAMIC, GLASS-SEALED |
封装代码 | QFF | DIP | DIP | - | QFF |
封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | - | SQUARE |
认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified |
座面最大高度 | 2.159 mm | 5.72 mm | 5.72 mm | - | 2.159 mm |
最大供电电压 | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V |
最小供电电压 | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V |
标称供电电压 | 5 V | 5 V | 5 V | - | 5 V |
电源电压1-最大 | -5.7 V | -5.7 V | -5.7 V | - | -5.7 V |
电源电压1-分钟 | -4.2 V | -4.2 V | -4.2 V | - | -4.2 V |
电源电压1-Nom | -4.5 V | -4.5 V | -4.5 V | - | -4.5 V |
温度等级 | OTHER | MILITARY | MILITARY | - | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Matte Tin (Sn) | - |
端子形式 | FLAT | THROUGH-HOLE | THROUGH-HOLE | - | FLAT |
端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | - | 1.27 mm |
端子位置 | QUAD | DUAL | DUAL | - | QUAD |
宽度 | 9.398 mm | 10.16 mm | 10.16 mm | - | 9.398 mm |
Base Number Matches | 1 | 1 | 1 | - | 1 |
电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved