4 Pad Ceramic Package Quartz Crystal, 2.0mm x 1.6mm
Product Features:
Low Cost SMD Package
Ultra Miniature Package
Compatible with Leadfree Processing
ILCX19 Series
Applications:
Fibre Channel
Server & Storage
Sonet / SDH
802.11 / WiFi
T1/E1, T3/E3
Electrical Specifications
Frequency
Equivalent Series Resistance
16MHz – 23.999999MHz
24MHz – 25.999999MHz
26MHz – 72MHz
Shunt Capacitance (C0)
Frequency Tolerance (at 25°C)
Frequency Stability (over Temperature)
Mode of Operation
Crystal Cut
Load Capacitance
Drive Level
Aging
Operating Temperature Range
Storage Temperature Range
16MHz to 72MHz
150 Ohms Maximum
80 Ohms Maximum
60 Ohms Maximum
3pF Maximum
±50ppm, ±30ppm, ±25ppm, ±20ppm, ±15ppm, or ±10ppm
±50ppm, ±30ppm, ±25ppm, ±20ppm, ±15ppm, or ±10ppm
Fundamental
AT Cut
8pF to 32pF or Specify
100µW Maximum
5ppm/Year
Maximum
See Part Number Guide
-40°C to +85°C
Mechanical and Solder Pad Dimensions
Part Number Guide
Sample Part Number: ILCX19 – FB1F18 - 20.000 MHz
Package
Frequency
Tolerance
B = ±50ppm
F = ±30ppm
ILCX19 -
G = ±25ppm
H = ±20ppm
I = ±15ppm
J = ±10ppm*
Frequency
Stability
B = ±50ppm
F = ±30ppm
G = ±25ppm
H = ±20ppm
I = ±15ppm*, **
J = ±10ppm*, **
Operating
Temperature Range
0 = 0°C to +50°C
1 = 0°C to +70°C
2 = -10°C to +60°C
3 = -20°C to +70°C
5 = -40°C to +85°C
9 = -10°C to +50°C
Mode of
Operations
Load Capacitance
Frequency
F = Fundamental
8pF to 32pF or
Specify
20.000 MHz
* Not available at all frequencies. ** Not available for all temperature ranges.
ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 03/29/18_E
Page 1 of 2
4 Pad Ceramic Package Quartz Crystal, 2.0mm x 1.6mm
Pb Free Solder Reflow Profile:
Ts max to T
L
(Ramp-up Rate)
Preheat
Temperature min (Ts min)
Temperature typ (Ts typ)
Temperature max (Ts max)
Time (Ts)
Ramp-up Tate (T
L
to Tp
Time Maintained Above
Temperature (T
L
)
Time (T
L)
Peak Temperature (Tp)
ILCX19 Series
3ºC / second max
150ºC
175ºC
200ºC
60 to180 seconds
3ºC / second max
217ºC
60 to 150 seconds
260ºC max for 10
seconds
20 to 40 seconds
6ºC / second max
8 minutes max
Units are backward compatible with +240°C reflow processes
Time within 5ºC to Peak
Temperature (Tp)
Ramp-down Rate
Tune 25ºC to Peak Temperature
Package Information:
MSL = 1 (package does not contain plastic, storage life is unlimited under normal room conditions)
Termination = e4 (Au over Ni over W base metallization)
Tape and Reel Information:
PITCH
TAPE WIDTH
REEL DIA
QTY PER REEL
4.00
8.00
180
3,000
Environmental Specifications:
Mechanical Shock
Vibration
Resistance to Soldering Heat
Solderability
Gross Leak
Fine Leak
MIL-STD-202, Method 213
MIL-STD-202, Method 204
MIL-STD-202, Method 210
J-STD-002
MIL-STD-883, Method 1014, Condition C
MIL-STD-883, Method 1014, Condition A2
Marking:
Line 1: I, Date Code (YWW)
ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: e-mail@ilsiamerica.com ●
www.ilsiamerica.com
Specifications subject to change without notice
Rev: 03/29/18_E
Page 2 of 2
FPGA/CPLD
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
