6/9/2015
ARK | Intel® Celeron® Processor G1820TE (2M Cache, 2.20 GHz)
Intel® Celeron® Processor G1820TE
(2M Cache, 2.20 GHz)
Specifications
‐
Essentials
Launched
Q1'14
G1820TE
2 MB
5 GT/s
64-bit
SSE4.1/4.2
Yes
22 nm
1S Only
PCG 2013A
TRAY: $42.00
Yes
Link
Link
Status
Launch Date
Processor Number
Intel® Smart Cache
DMI2
Instruction Set
Instruction Set Extensions
Embedded Options Available
Lithography
Scalability
Thermal Solution Specification
Recommended Customer Price
Conflict Free
Datasheet
Additional Information URL
‐
Performance
2
2
[X]
Did you find the information you were
looking for today?
Yes
# of Cores
# of Threads
Processor Base Frequency
TDP
‐
2.2 GHz
35 W
Memory Specifications
No
Max Memory Size (dependent on memory type)
Memory Types
Max # of Memory Channels
Max Memory Bandwidth
ECC Memory Supported
‡
32 GB
DDR3 1333
2
21.3 GB/s
Yes
‐
Graphics Specifications
Intel® HD Graphics
350 MHz
1 GHz
1 GB
Yes
Yes
3
Processor Graphics
‡
Graphics Base Frequency
Graphics Max Dynamic Frequency
Graphics Video Max Memory
Intel® Quick Sync Video
Intel® Flexible Display Interface (Intel® FDI)
# of Displays Supported
‡
http://ark.intel.com/products/78957/IntelCeleronProcessorG1820TE2MCache2_20GHz#@ordering
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6/9/2015
ARK | Intel® Celeron® Processor G1820TE (2M Cache, 2.20 GHz)
‐
Expansion Options
Up to 3.0
Up to 1x16, 2x8, 1x8/2x4
16
PCI Express Revision
PCI Express Configurations
‡
Max # of PCI Express Lanes
‐
Package Specifications
1
37.5mm x 37.5mm
22 nm
FCLGA1150
See MDDS
Max CPU Configuration
Package Size
Graphics and IMC Lithography
Sockets Supported
Low Halogen Options Available
‐
Advanced Technologies
No
No
No
Yes
No
Yes
No
Yes
Yes
Yes
Yes
No
No
Intel® Turbo Boost Technology
‡
Intel® vPro Technology
‡
Intel® Hyper-Threading Technology
‡
Intel® Virtualization Technology (VT-x)
‡
Intel® Virtualization Technology for Directed I/O (VT-d)
‡
Intel® VT-x with Extended Page Tables (EPT)
‡
Intel® TSX-NI
Intel® 64
‡
Idle States
Enhanced Intel SpeedStep® Technology
Thermal Monitoring Technologies
Intel® Identity Protection Technology
‡
Intel® Stable Image Platform Program (SIPP)
‐
Intel® Data Protection Technology
No
Yes
AES New Instructions
Secure Key
‐
Intel® Platform Protection Technology
No
Yes
Trusted Execution Technology
‡
Execute Disable Bit
‡
Compatible Products
‐
Chipsets
Compare
Compare All
+
Intel® C226 Chipset
(Intel® DH82C226 PCH)
Intel® Z87 Chipset
(Intel® DH82Z87 PCH)
Intel® Q87 Chipset
Launched
Launched
Launched
Yes
No
Yes
4.1 W
4.1 W
4.1 W
T&R : $49.00
N/A
T&R : $47.00
Product Name
Status
Embedded Options Available
TDP
Recommended Customer Price
http://ark.intel.com/products/78957/IntelCeleronProcessorG1820TE2MCache2_20GHz#@ordering
2/4
6/9/2015
ARK | Intel® Celeron® Processor G1820TE (2M Cache, 2.20 GHz)
(Intel® DH82Q87 PCH)
Intel® H87 Chipset
(Intel® DH82H87 PCH)
Intel® B85 Chipset
(Intel® DH82B85 PCH)
Intel® Q85 Chipset
(Intel® DH82Q85 PCH)
Intel® H81 Chipset
(Intel® DH82H81 PCH)
Launched
Launched
Launched
Launched
No
No
No
Yes
4.1 W
4.1 W
4.1 W
4.1 W
T&R : $32.00
T&R : $28.00
N/A
T&R : $26.00
Ordering and Spec Information
Trade Compliance Information
ECCN
5A992A
Ordering and Spec Information
Spec Code
Ordering Code
Step
RCP
VT-x
NA
CCATS
8542310000-HYBRD
US HTS
Intel® Celeron® Processor G1820TE (2M Cache, 2.20 GHz) FC-LGA12C, Tray
SR1T6
Retired and Discontinued
Spec Code
Ordering Code
Step
RCP
VT-x
CM8064601618705
C0
$42.00
Yes
Intel® Celeron® Processor G1820TE (3M Cache, 2.20 GHz) FC-LGA12C, Tray
SR182
CM8064601484601
C0
N/A
All information provided is subject to change at any time, without notice. Intel may make changes to manufacturing life cycle, specifications, and product descriptions at any time, without notice. The
information herein is provided "as-is" and Intel does not make any representations or warranties whatsoever regarding accuracy of the information, nor on the product features, availability,
functionality, or compatibility of the products listed. Please contact system vendor for more information on specific products or systems.
"Intel classifications" consist of Export Control Classification Numbers (ECCN) and Harmonized Tariff Schedule (HTS) numbers. Any use made of Intel classifications are without recourse to Intel and
shall not be construed as a representation or warranty regarding the proper ECCN or HTS. Your company may be the exporter of record, and as such, your company is responsible for determining the
correct classification of any item at the time of export.
Refer to Datasheet for formal definitions of product properties and features.
“Announced” SKUs are not yet available. Please refer to the Launch Date for market availability.
Some products can support AES New Instructions with a Processor Configuration update, in particular, i7-2630QM/i7-2635QM, i7-2670QM/i7-2675QM, i5-2430M/i5-2435M, i5-2410M/i5-2415M.
Please contact OEM for the BIOS that includes the latest Processor configuration update.
‡ This feature may not be available on all computing systems. Please check with the system vendor to determine if your system delivers this feature, or reference the system specifications
(motherboard, processor, chipset, power supply, HDD, graphics controller, memory, BIOS, drivers, virtual machine monitor-VMM, platform software, and/or operating system) for feature compatibility.
Functionality, performance, and other benefits of this feature may vary depending on system configuration.
“Conflict free” and “conflict-free” means “DRC conflict free”, which is defined by the U.S. Securities and Exchange Commission rules to mean products that do not contain conflict minerals (tin,
tantalum, tungsten and/or gold) that directly or indirectly finance or benefit armed groups in the Democratic Republic of the Congo (DRC) or adjoining countries. Intel also uses the term "conflict-free"
in a broader sense to refer to suppliers, supply chains, smelters and refiners whose sources of conflict minerals do not finance conflict in the DRC or adjoining countries. Intel processors manufactured
before January 1, 2013 are not confirmed conflict free. The conflict free designation refers only to product manufactured after that date. For Intel Boxed Processors, the conflict free designation refers
to the processor only, not to any additional included accessories, such as heatsinks/coolers.
See
http://www.intel.com/content/www/us/en/architecture-and-technology/hyper-threading/hyper-threading-technology.html?wapkw=hyper+threading
for more information including details on
which processors support Intel® HT Technology.
Max Turbo Frequency refers to the maximum single-core processor frequency that can be achieved with Intel® Turbo Boost Technology. See
www.intel.com/technology/turboboost/
for more
information.
The Recommended Customer Price (“RCP”) is pricing guidance for Intel products. Prices are for direct Intel customers and are subject to change without notice. Taxes and shipping, etc. not included.
Prices may vary for other package types and shipment quantities, and special promotional arrangements may apply. Listing of these RCP does not constitute a formal pricing offer from Intel. Please
work with your appropriate Intel representative to obtain a formal price quotation.
System and Maximum TDP is based on worst case scenarios. Actual TDP may be lower if not all I/Os for chipsets are used.
Low Halogen: Applies only to brominated and chlorinated flame retardants (BFRs/CFRs) and PVC in the final product. Intel components as well as purchased components on the finished assembly
meet JS-709 requirements, and the PCB / substrate meet IEC 61249-2-21 requirements. The replacement of halogenated flame retardants and/or PVC may not be better for the environment.
For benchmarking data see
http://www.intel.com/performance.
Intel processor numbers are not a measure of performance. Processor numbers differentiate features within each processor family, not across different processor families. See
http://www.intel.com/content/www/us/en/processors/processor-numbers.html
for details.
Processors that support 64-bit computing on Intel® architecture require an Intel 64 architecture-enabled BIOS.
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