Product
Specification
.100 Inch Centerline Crimp-Snap Connectors
1.
1.1.
SCOPE
Content
108-1328
11Mar11 Rev C
This specification covers performance, tests and quality requirements for the TE Connectivity (TE)
.100 inch centerline Crimp-Snap connectors. The Crimp-Snap Terminal .100 product is a wire-to-board
connection consisting of crimp-snap contacts seated in a housing that mates to .025 inch square post
headers on .100 inch centerline and is designed to be terminated to 22 to 26 AWG wire.
1.2.
Qualification
When tests are performed on the subject product line, procedures specified in Figure 1 shall be used.
All inspections shall be performed using the applicable inspection plan and product drawing.
1.3.
Successful qualification testing on the subject product line was completed on 18Apr96. The
Qualification Test Report number for this testing is 501-341. Additional testing was completed on
10Jul09 and 27Jul10. This documentation is on file at and available from Engineering Practices and
Standards (EPS).
APPLICABLE DOCUMENTS
The following documents form a part of this specification to the extent specified herein. Unless
otherwise specified, the latest edition of the document applies. In the event of conflict between the
requirements of this specification and the product drawing, the product drawing shall take precedence.
In the event of conflict between requirements of this specification and the referenced documents, this
specification shall take precedence.
2.1.
TE Documents
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2.2.
109-1: Test Specification (General Requirements for Test Specifications)
109 Series: Test Specifications as indicated in Figure 1
109-151: Test Specification (Current Rating Verification)
114-16019: Application Specification (CST-100 Connectors for Crimp Snap Terminals)
501-341: Qualification Test Report (.100 Inch Centerline Crimp-Snap Connectors)
2.
Industry Standard
EIA-364: Electrical Connector/Socket Test Procedures Including Environmental Classifications
3.
3.1.
REQUIREMENTS
Design and Construction
Product shall be of the design, construction and physical dimensions specified on the applicable product
drawing.
3.2.
Materials
Materials used in the construction of this product shall be as specified on the applicable product
drawing.
©2011 Tyco Electronics Corporation, | Indicates change
a TE Connectivity Ltd. Company
*Trademark
All Rights Reserved
TE logo is a trademark.
For latest revision, visit our website at www.te.com/documents.
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Other products, logos, and company names might be trademarks of their respective owners.
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LOC B
108-1328
3.3.
Ratings
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3.4.
Voltage: 250 volts AC
Current: See Figure 4 for applicable current carrying capability
Temperature: -55 to 105°
C
Performance and Test Description
Product is designed to meet the electrical, mechanical and environmental performance requirements
specified in Figure 1. Unless otherwise specified, all tests shall be performed at ambient environmental
conditions per Test Specification 109-1.
3.5.
Test Requirements and Procedures Summary
Test Description
Requirement
Meets requirements of product
drawing and Application
Specification 114-16019.
ELECTRICAL
10 milliohms maximum final.
Procedure
Visual, dimensional and functional
per applicable quality inspection
plan.
TE 109-6-1.
Subject mated contacts assembled
in housing to 50 millivolts maximum
open circuit at 100 milliamperes
maximum.
See Figure 3.
TE Spec 109-28-4.
Test between adjacent contacts of
mated or unmated specimens.
TE Spec 109-29-1.
1000 volts AC at sea level.
Test between adjacent contacts of
mated or unmated specimens.
Examination of product.
Termination resistance.
Insulation resistance.
1000 megohms minimum initial.
100 megohms minimum final.
One minute hold with no breakdown
or flashover.
1.3 milliamperes maximum leakage
current.
Dielectric withstanding voltage.
Temperature rise vs current.
30° maximum temperatur e rise at TE Spec 109-45-1.
C
specified current.
Measure temperature rise vs
current.
See Figure 4.
MECHANICAL
Solderable area shall have a
minimum of 95% solder coverage.
TE Spec 109-11-2.
Subject header posts to
solderability.
Solderability.
Sinusoidal vibration.
No discontinuities of 1 microsecond TE Spec 109-21-1.
or longer duration.
Subject mated specimens to 10-55-
10 Hz traversed in 1 minute with .06
See Note.
inch maximum excursion. Two
hours in each of 3 mutually
perpendicular planes.
See Figure 5.
Figure 1 (continued)
Rev C
2 of 8
108-1328
Test Description
Physical shock.
Requirement
Procedure
No discontinuities of 1 microsecond TE Spec 109-26-1.
or longer duration.
Subject mated specimens to 50 G's
See Note.
half-sine shock pulses of 11
milliseconds duration. Three shocks
in each direction applied along 3
mutually perpendicular planes, 18
total shocks.
See Figure 5.
See Note.
TE Spec 109-27.
Manually mate and unmate
specimens friction lock headers for
15 cycles at maximum rate of 10
cycles per minute.
Durability.
Mating force.
Two pounds maximum per contact. TE Spec 109-42, Condition A.
Measure force necessary to mate
specimens with friction lock headers
a distance of .200 inch from point of
initial contact at a maximum rate of
.5 inch per minute.
.80 pound minimum per contact.
TE Spec 109-42, Condition A.
Measure force necessary to unmate
specimens from friction lock
headers at a maximum rate of .5
inch per minute.
EIA-364-8.
Measure crimp tensile at a
maximum rate of 1 inch per minute.
Unmating force.
Crimp tensile.
Wire Size
(AWG)
22
24
26
See Note.
Crimp Tensile
(Lbs minimum)
11
10
7
ENVIRONMENTAL
Thermal shock.
TE Spec 109-22.
Subject mated specimens to 10
cycles between -55 and 105°
C.
TE Spec 109-23-3, Condition B.
Subject mated specimens to 10
cycles between 25 and 65° at 95%
C
RH.
TE Spec 109-43.
Subject mated specimens to
temperature life at 105° for 792
C
hours.
TE Spec 109-85-2.
Subject mated specimens to
environmental class II for 14 days.
Humidity/temperature cycling.
See Note.
Temperature life.
See Note.
Mixed flowing gas.
See Note.
NOTE
Shall meet visual requirements, show no physical damage and shall meet requirements of
additional tests as specified in Test Sequence in Figure 2.
Figure 1 (end)
Rev C
3 of 8
108-1328
3.6.
Product Qualification and Requalification Test Sequence
Test Group (a)
Test or Examination
Examination of product
Termination resistance
Insulation resistance
Dielectric withstanding voltage
Temperature rise vs current
Solderability
Sinusoidal vibration
Physical shock
Durability
Mating force
Unmating force
Crimp tensile
Thermal shock
Humidity/temperature cycling
Temperature life
Mixed flowing gas
NOTE
(a)
(b)
(c)
(d)
4(d)
5
3
4
5
6
4
2
8
2
6(c)
3,8
2
1
1,9
3,7
2
1,9
2,7
2,5
3,6
3
1,7
4
1,5
2,4
5
1,3
6
1,3
Test Sequence (b)
See paragraph 4.1.A.
Numbers indicate sequence in which tests are performed.
Discontinuities shall not be measured. Energize at 18
E
C level for 100% loadings per
Test Specification 109-151.
Precondition specimens with 10 cycles durability.
Figure 2
Rev C
4 of 8
108-1328
4.
4.1.
QUALITY ASSURANCE PROVISIONS
Qualification Testing
A.
Specimen Selection
Specimens shall be prepared in accordance with applicable Instruction Sheets and shall be
selected at random from current production. Test groups 1, 2, 3 and 4 shall each consist of a
minimum of 5 connector assemblies with a minimum of 30 data points. Test group 5 shall consist
of a minimum of 5 headers with a minimum of 30 header posts. Test group 6 shall consist of 25
specimens of each wire size. Specimens for additional testing in test group 1 shall consist of 24, 6
position assemblies with the following plating configurations for CST-100 contact to header: 30
µin
Au to 30
µin
Au; 30
µin
Au to 30
µin
PdNi; 30
µin
PdNi to 30
µin
Au; and 30
µin
PdNi to 30
µin
PdNi. Specimens for additional testing in test group 4 shall consist of 24, 6 position assemblies
with the following plating configurations for CST-100 contact to header: 30
µin
Au to 30
µin
Au; 30
µin
Au to 30
µin
PdNi; 30
µin
PdNi to 30
µin
Au; 30
µin
PdNi to 30
µin
PdNi; 15
µin
Au to 15
µin
Au;
15
µin
Au to 15
µin
PdNi; 15
µin
PdNi to 15
µin
Au; and 15
µin
PdNi to 15
µin
PdNi.
B.
Test Sequence
Qualification inspection shall be verified by testing specimens as specified in Figure 2.
4.2.
Requalification Testing
If changes significantly affecting form, fit or function are made to the product or manufacturing process,
product assurance shall coordinate requalification testing, consisting of all or part of the original testing
sequence as determined by development/product, quality and reliability engineering.
4.3.
Acceptance
Acceptance is based on verification that the product meets the requirements of Figure 1. Failures
attributed to equipment, test setup or operator deficiencies shall not disqualify the product. If product
failure occurs, corrective action shall be taken and specimens resubmitted for qualification. Testing to
confirm corrective action is required before resubmittal.
4.4.
Quality Conformance Inspection
The applicable quality inspection plan will specify the sampling acceptable quality level to be used.
Dimensional and functional requirements shall be in accordance with the applicable product drawing
and this specification.
Rev C
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