Multilayer Ceramic Chip Capacitors
FEATURES
• CRACK RESISTANT TERMINATION
• SOFT TERMINATION, OPEN MODE FAILURE
• WIDE VOLTAGE RANGE (4V TO 5KV)
• HIGH CAPACITANCE (UP TO
100μF)
• RoHS COMPLIANT
• SAC SOLDER COMPATIBLE**
Temperature Coefficient
Capacitance Range
Capacitance Tolerance
Operating Temperature Range
Temperature Characteristics
Rated Voltages
Q or Dissipation Factor
insulation Resistance
Dielectric Withstanding Voltage
NMC-P Series
RoHS
Compliant
Includes all homogeneous materials
*See Part Number System for Details
NPO
X7R
5pF ~ 0.22μF
180pF ~ 10μF
For 2.2pF ~ 10pF: ±0.1pF (B), ±0.25pF (C),
±0.5pF (D), ±1pF (F)
±10% (K) & ±20% (M)
Above 10pF: ±1% (F), ±2% (G), ±5% (J),
±10% (K)
-55°C ~ +125°C
±30ppm/°C
±15%
∆
Cap.
16Vdc, 25Vdc, 50Vdc, 100Vdc, 200Vdc, 250Vdc, 500Vdc, 630Vdc,
1KVdc, 2Kvdc, 3Kvdc & 5Kvdc
Q = > 1000 (more then 30pF)*
2.5% max.@1KHz,
Q = > 400 + 20 x C in pF (30pF and below)*
1.0V ± 0.2Vrms
10,000Megohm or 500Megohm/μF whichever is less @ +25°C
X5R
22μF ~ 100μF
±20% (M)
-55°C ~ +85°C
±15%
∆
Cap.
4Vdc, 6.3Vdc, 10Vdc, 16Vdc, 25Vdc
10% max.@120Hz, 0.5V ±0.1Vrms
22μF & 47μF 100Megohm/μF @+25°C
100μF 50Megohm/μF @+25°C
250% of rated voltage for
5 seconds, 50mA max.
200% of rated voltage for 5 seconds, 50mA max. (16V ~ 250V)
150% of rated voltage for 5 seconds, 50mA max. (500V ~ 630V)
120% of rated voltage for 5 seconds, 50mA max. (1KV ~ 5KV)
*Test Frequency & Voltage: Up to 100pF 1MHz/1.0Vrms, Above 100pF 1KHz/1.0Vrms
**Reflow soldering is recommended. Contact NIC regarding the use of other soldering methods.
PART NUMBER SYSTEM
NMC-P 1206 X7R 105 K 50 TRP or TRPLP F
Series
RoHS Compliant
Tape & Reel (Plastic Carrier)
Tape & Reel (Punched Carrier)
Voltage (Vdc)
Capacitance Tolerance Code (see chart)
Capacitance Code, expressed in pF, first 2 digits are
significant, 3rd digit is no. of zeros
Temperature Characteristic (NPO, X7R or
X5R)
Size Code (see chart)
CONSTRUCTION
Base layer (Cu 50V ~ 250V)
(Ag 500V ~ up)
Flexible layer (Polymer)
Barrier layer (Ni)
Finish layer (Sn)
OPEN MODE FAILURE AS A RESULT OF BENDING STRESS
Termination Separation
(Open Failure Mode)
®
1
NIC COMPONENTS CORP.
www.niccomp.com
www.lowESR.com
www.RFpassives.com
www.SMTmagnetics.com
Specifications are subject to change
嵌入式系统
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