IC,A/D CONVERTER,SINGLE,12-BIT,DIP,28PIN
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | ADI(亚德诺半导体) |
零件包装代码 | DIP |
针数 | 28 |
Reach Compliance Code | not_compliant |
ECCN代码 | 3A001.A.2.C |
Is Samacsys | N |
最大模拟输入电压 | 20 V |
转换器类型 | A/D CONVERTER |
JESD-30 代码 | R-XDIP-T28 |
最大线性误差 (EL) | 0.012% |
位数 | 12 |
功能数量 | 1 |
端子数量 | 28 |
最高工作温度 | 70 °C |
最低工作温度 | |
输出位码 | OFFSET BINARY |
封装主体材料 | CERAMIC |
封装代码 | DIP |
封装等效代码 | DIP28,.6 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 5,+-15 V |
认证状态 | Not Qualified |
表面贴装 | NO |
温度等级 | COMMERCIAL |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
Base Number Matches | 1 |
5962-01-145-3422 | 5962-01-176-1784 | NTR06C2701DTRF | 09VR1H25F1N104A2 | AD574ALP | 5962-01-244-5521 | 5962-01-274-4213 | |
---|---|---|---|---|---|---|---|
描述 | IC,A/D CONVERTER,SINGLE,12-BIT,DIP,28PIN | IC,A/D CONVERTER,SINGLE,12-BIT,DIP,28PIN | Fixed Resistor, Thin Film, 0.063W, 2700ohm, 50V, 0.25% +/-Tol, 50ppm/Cel, Surface Mount, 0603, CHIP, ROHS COMPLIANT | 9mm Panel Potentiometer | IC,A/D CONVERTER,SINGLE,12-BIT,BIPOLAR,LDCC,28PIN | IC,A/D CONVERTER,SINGLE,12-BIT,DIP,28PIN | IC,A/D CONVERTER,SINGLE,12-BIT,LLCC,28PIN |
是否Rohs认证 | 不符合 | - | 符合 | - | 不符合 | 不符合 | - |
厂商名称 | ADI(亚德诺半导体) | - | - | - | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
零件包装代码 | DIP | DIP | - | - | - | DIP | QFN |
针数 | 28 | 28 | - | - | - | 28 | 28 |
Reach Compliance Code | not_compliant | unknow | compliant | - | not_compliant | unknow | unknown |
ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | EAR99 | - | - | 3A001.A.2.C | 3A001.A.2.C |
最大模拟输入电压 | 20 V | 20 V | - | - | 20 V | 20 V | 20 V |
转换器类型 | A/D CONVERTER | A/D CONVERTER | - | - | A/D CONVERTER | A/D CONVERTER | A/D CONVERTER |
JESD-30 代码 | R-XDIP-T28 | R-XDIP-T28 | - | - | S-PQCC-J28 | R-XDIP-T28 | S-XQCC-N28 |
最大线性误差 (EL) | 0.012% | 0.024% | - | - | 0.012% | 0.024% | 0.024% |
位数 | 12 | 12 | - | - | 12 | 12 | 12 |
功能数量 | 1 | 1 | - | - | 1 | 1 | 1 |
端子数量 | 28 | 28 | 2 | - | 28 | 28 | 28 |
最高工作温度 | 70 °C | 125 °C | 155 °C | - | 70 °C | 125 °C | 125 °C |
最低工作温度 | - | -55 °C | -55 °C | - | - | -55 °C | -55 °C |
输出位码 | OFFSET BINARY | OFFSET BINARY | - | - | OFFSET BINARY | OFFSET BINARY | OFFSET BINARY |
封装主体材料 | CERAMIC | CERAMIC | - | - | PLASTIC/EPOXY | CERAMIC | CERAMIC |
封装代码 | DIP | DIP | - | - | QCCJ | DIP | QCCN |
封装等效代码 | DIP28,.6 | DIP28,.6 | - | - | LDCC28,.5SQ | DIP28,.6 | LCC28,.45SQ |
封装形状 | RECTANGULAR | RECTANGULAR | - | - | SQUARE | RECTANGULAR | SQUARE |
封装形式 | IN-LINE | IN-LINE | SMT | - | CHIP CARRIER | IN-LINE | CHIP CARRIER |
电源 | 5,+-15 V | 5,+-12/+-15 V | - | - | 5,+-12/+-15 V | 5,+-15 V | 5,+-12/+-15 V |
认证状态 | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | NO | NO | YES | - | YES | NO | YES |
温度等级 | COMMERCIAL | MILITARY | - | - | COMMERCIAL | MILITARY | MILITARY |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | - | - | J BEND | THROUGH-HOLE | NO LEAD |
端子节距 | 2.54 mm | 2.54 mm | - | - | 1.27 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | - | - | QUAD | DUAL | QUAD |
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