U1ZB6.8~U1ZB390
TOSHIBA ZENER DIODE
SILICON DIFFUSED TYPE
U1ZB6.8~U1ZB390
CONSTANT VOLTAGE REGULATION
TRANSIENT SUPPRESSORS
Average Power Dissipation : P = 1.0 W
Zener Voltage
: V
Z
= 6.8 V to 390 V
Surface Mounting Plastic Mold Package
Unit: mm
ABSOLUTE MAXIMUM RATINGS
(Ta = 25°C)
CHARACTERISTIC
Power Dissipation
Junction Temperature
Storage Temperature Range
SYMBOL
P
Tj
Tstg
RATING
1.0
−40
to 150
−40
to 150
UNIT
W
°C
°C
Note: Using continuously under heavy loads (e.g. the application of high
temperature/current/voltage and the significant change in
temperature, etc.) may cause this product to decrease in the
reliability significantly even if the operating conditions (i.e.
operating temperature/current/voltage, etc.) are within the absolute maximum ratings.
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook
(“Handling Precautions”/Derating Concept and Methods) and individual reliability data (i.e. reliability test report
and estimated failure rate, etc).
JEDEC
JEITA
TOSHIBA
Weight: 0.06g
―
―
3−4D1A
STANDARD SOLDERING PAD
1
2011-01-05
U1ZB6.8~U1ZB390
Handling Precaution
The absolute maximum ratings denote the absolute maximum ratings, which are rated values and must not be
exceeded during operation, even for an instant. The following are the general derating methods that we recommend
when you design a circuit with a device.
P:
We recommend that the worst case power dissipation be no greater than 50% of the absolute
maximum rating of power dissipation. Carry out adequate heat design.
We recommend that a device be used within the recommended area in the figure, P
RSM
-tw.
Derate this rating when using a device in order to ensure high reliability. We recommend that the
device be used at a T
j
of below 120°C.
P
RSM
:
T
j
:
Thermal resistance between junction and ambient fluctuates depending on the device’s mounting condition. When
using a device, design a circuit board and a soldering land size to match the appropriate thermal resistance value.
Organic silicon is used as encapsulation material for this product, which is resin seal product. Therefore, it is
difficult to seal siloxane coming from silicone completely in this product. When using this product, please consider
above.
Please refer to the Rectifiers databook for further information.
5
2011-01-05
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