OT PLD, 30ns, CDIP20
| 参数名称 | 属性值 |
| 厂商名称 | Texas Instruments(德州仪器) |
| 零件包装代码 | DIP |
| 包装说明 | CERAMIC, DIP-20 |
| 针数 | 20 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A001.A.2.C |
| Is Samacsys | N |
| 其他特性 | POWER-UP RESET |
| 架构 | PAL-TYPE |
| 最大时钟频率 | 25 MHz |
| 系统内可编程 | NO |
| JESD-30 代码 | R-GDIP-T20 |
| JTAG BST | NO |
| 专用输入次数 | 8 |
| I/O 线路数量 | 4 |
| 输入次数 | 16 |
| 输出次数 | 4 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 8 DEDICATED INPUTS, 4 I/O |
| 输出函数 | MIXED |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 可编程逻辑类型 | OT PLD |
| 传播延迟 | 30 ns |
| 认证状态 | Qualified |
| 筛选级别 | MIL-STD-883 |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | TTL |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| Base Number Matches | 1 |
| 5962-8515508RX | 5962-8605301KX | 5962-8605301LX | 5962-8515505RX | JM38510/50601BSA | JM38510/50601B2A | |
|---|---|---|---|---|---|---|
| 描述 | OT PLD, 30ns, CDIP20 | OT PLD, 30ns, CDFP24 | OT PLD, 30ns, CDIP24, CERAMIC, DIP-24 | OT PLD, 30ns, CDIP20, CERAMIC, DIP-20 | OT PLD, 20ns, CDFP20 | OT PLD, 20ns, CQCC20 |
| 包装说明 | CERAMIC, DIP-20 | DFP, | DIP, | CERAMIC, DIP-20 | DFP, | QCCN, |
| Reach Compliance Code | compliant | compliant | compliant | compliant | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| JESD-30 代码 | R-GDIP-T20 | R-GDFP-F24 | R-GDIP-T24 | R-GDIP-T20 | R-GDFP-F20 | S-CQCC-N20 |
| 端子数量 | 20 | 24 | 24 | 20 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出函数 | MIXED | MACROCELL | MACROCELL | COMBINATORIAL | COMBINATORIAL | COMBINATORIAL |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DIP | DFP | DIP | DIP | DFP | QCCN |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE |
| 封装形式 | IN-LINE | FLATPACK | IN-LINE | IN-LINE | FLATPACK | CHIP CARRIER |
| 可编程逻辑类型 | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD | OT PLD |
| 传播延迟 | 30 ns | 30 ns | 30 ns | 30 ns | 20 ns | 20 ns |
| 认证状态 | Qualified | Qualified | Not Qualified | Qualified | Not Qualified | Not Qualified |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | NO | NO | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT | NO LEAD |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | QUAD |
| 厂商名称 | Texas Instruments(德州仪器) | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
| 专用输入次数 | 8 | 11 | 11 | 10 | - | - |
| I/O 线路数量 | 4 | 10 | 10 | 6 | - | - |
| 组织 | 8 DEDICATED INPUTS, 4 I/O | 11 DEDICATED INPUTS, 10 I/O | 11 DEDICATED INPUTS, 10 I/O | 10 DEDICATED INPUTS, 6 I/O | - | - |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | - | - |
| 最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | - | - |
| 最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | - | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - |
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