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SST39VF1681-90-4C-EKE

产品描述2M X 8 FLASH 2.7V PROM, 90 ns, PDSO48, 12 X 20 MM, MO-142DD, TSOP1-48
产品类别存储    存储   
文件大小389KB,共28页
制造商Microchip(微芯科技)
官网地址https://www.microchip.com
标准
下载文档 详细参数 选型对比 全文预览

SST39VF1681-90-4C-EKE概述

2M X 8 FLASH 2.7V PROM, 90 ns, PDSO48, 12 X 20 MM, MO-142DD, TSOP1-48

SST39VF1681-90-4C-EKE规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
零件包装代码TSOP1
包装说明TSOP1,
针数48
Reach Compliance Codecompliant
ECCN代码EAR99
Is SamacsysN
最长访问时间90 ns
启动块BOTTOM
JESD-30 代码R-PDSO-G48
JESD-609代码e3
长度18.4 mm
内存密度16777216 bit
内存集成电路类型FLASH
内存宽度8
功能数量1
端子数量48
字数2097152 words
字数代码2000000
工作模式ASYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织2MX8
封装主体材料PLASTIC/EPOXY
封装代码TSOP1
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)260
编程电压2.7 V
认证状态Not Qualified
座面最大高度1.2 mm
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)2.7 V
标称供电电压 (Vsup)3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层MATTE TIN
端子形式GULL WING
端子节距0.5 mm
端子位置DUAL
处于峰值回流温度下的最长时间40
类型NOR TYPE
宽度12 mm
Base Number Matches1

文档预览

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16 Mbit (x8) Multi-Purpose Flash Plus
SST39VF1681 / SST39VF1682
SST39VF1681 / 168216Mb (x8) MPF Plus
Preliminary Specifications
FEATURES:
• Organized as 2M x8: SST39VF1681/1682
• Single Voltage Read and Write Operations
– 2.7-3.6V
• Superior Reliability
– Endurance: 100,000 Cycles (Typical)
– Greater than 100 years Data Retention
• Low Power Consumption (typical values at 5 MHz)
– Active Current: 9 mA (typical)
– Standby Current: 3 µA (typical)
– Auto Low Power Mode: 3 µA (typical)
• Hardware Block-Protection/WP# Input Pin
– Top Block-Protection (top 64 KByte)
for SST39VF1682
– Bottom Block-Protection (bottom 64 KByte)
for SST39VF1681
• Sector-Erase Capability
– Uniform 4 KByte sectors
• Block-Erase Capability
– Uniform 64 KByte blocks
• Chip-Erase Capability
• Erase-Suspend/Erase-Resume Capabilities
• Hardware Reset Pin (RST#)
• Security-ID Feature
– SST: 128 bits; User: 128 bits
• Fast Read Access Time:
– 70 ns
– 90 ns
• Latched Address and Data
• Fast Erase and Byte-Program:
– Sector-Erase Time: 18 ms (typical)
– Block-Erase Time: 18 ms (typical)
– Chip-Erase Time: 40 ms (typical)
– Byte-Program Time: 7 µs (typical)
• Automatic Write Timing
– Internal V
PP
Generation
• End-of-Write Detection
– Toggle Bits
– Data# Polling
• CMOS I/O Compatibility
• JEDEC Standard
– Flash EEPROM Pinouts and command sets
• Packages Available
– 48-lead TSOP (12mm x 20mm)
PRODUCT DESCRIPTION
The SST39VF168x devices are 2M x8 CMOS Multi-Pur-
pose Flash Plus (MPF+) manufactured with SST’s propri-
etary, high performance CMOS SuperFlash technology.
The split-gate cell design and thick-oxide tunneling injec-
tor attain better reliability and manufacturability compared
with alternate approaches. The SST39VF168x write (Pro-
gram or Erase) with a 2.7-3.6V power supply. These
devices conform to JEDEC standard pinouts for x8 mem-
ories.
Featuring high performance Byte-Program, the
SST39VF168x devices provide a typical Byte-Program
time of 7 µsec. These devices use Toggle Bit or Data# Poll-
ing to indicate the completion of Program operation. To pro-
tect against inadvertent write, they have on-chip hardware
and Software Data Protection schemes. Designed, manu-
factured, and tested for a wide spectrum of applications,
these devices are offered with a guaranteed typical endur-
ance of 100,000 cycles. Data retention is rated at greater
than 100 years.
The SST39VF168x devices are suited for applications that
require convenient and economical updating of program,
configuration, or data memory. For all system applications,
they significantly improve performance and reliability, while
lowering power consumption. They inherently use less
energy during Erase and Program than alternative flash
technologies. The total energy consumed is a function of
the applied voltage, current, and time of application. Since
for any given voltage range, the SuperFlash technology
uses less current to program and has a shorter erase time,
the total energy consumed during any Erase or Program
operation is less than alternative flash technologies. These
devices also improve flexibility while lowering the cost for
program, data, and configuration storage applications.
The SuperFlash technology provides fixed Erase and Pro-
gram times, independent of the number of Erase/Program
cycles that have occurred. Therefore the system software
or hardware does not have to be modified or de-rated as is
necessary with alternative flash technologies, whose
Erase and Program times increase with accumulated
Erase/Program cycles.
©2003 Silicon Storage Technology, Inc.
S71243-01-000
9/03
1
The SST logo and SuperFlash are registered trademarks of Silicon Storage Technology, Inc.
MPF is a trademark of Silicon Storage Technology, Inc.
These specifications are subject to change without notice.

SST39VF1681-90-4C-EKE相似产品对比

SST39VF1681-90-4C-EKE SST39VF1682-90-4C-EKE
描述 2M X 8 FLASH 2.7V PROM, 90 ns, PDSO48, 12 X 20 MM, MO-142DD, TSOP1-48 2M X 8 FLASH 2.7V PROM, 90 ns, PDSO48, 12 X 20 MM, MO-142DD, TSOP1-48
是否无铅 不含铅 不含铅
是否Rohs认证 符合 符合
零件包装代码 TSOP1 TSOP1
包装说明 TSOP1, TSOP1,
针数 48 48
Reach Compliance Code compliant compliant
ECCN代码 EAR99 EAR99
最长访问时间 90 ns 90 ns
启动块 BOTTOM TOP
JESD-30 代码 R-PDSO-G48 R-PDSO-G48
JESD-609代码 e3 e3
长度 18.4 mm 18.4 mm
内存密度 16777216 bit 16777216 bit
内存集成电路类型 FLASH FLASH
内存宽度 8 8
功能数量 1 1
端子数量 48 48
字数 2097152 words 2097152 words
字数代码 2000000 2000000
工作模式 ASYNCHRONOUS ASYNCHRONOUS
最高工作温度 70 °C 70 °C
组织 2MX8 2MX8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSOP1 TSOP1
封装形状 RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
并行/串行 PARALLEL PARALLEL
峰值回流温度(摄氏度) 260 260
编程电压 2.7 V 2.7 V
认证状态 Not Qualified Not Qualified
座面最大高度 1.2 mm 1.2 mm
最大供电电压 (Vsup) 3.6 V 3.6 V
最小供电电压 (Vsup) 2.7 V 2.7 V
标称供电电压 (Vsup) 3 V 3 V
表面贴装 YES YES
技术 CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL
端子面层 MATTE TIN MATTE TIN
端子形式 GULL WING GULL WING
端子节距 0.5 mm 0.5 mm
端子位置 DUAL DUAL
处于峰值回流温度下的最长时间 40 40
类型 NOR TYPE NOR TYPE
宽度 12 mm 12 mm
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