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MAX13035EEBE+

产品描述Interface Circuit, BICMOS, PBGA16, 2 X 2 MM, LEAD FREE, UCSP-16
产品类别模拟混合信号IC    驱动程序和接口   
文件大小325KB,共18页
制造商Maxim(美信半导体)
官网地址https://www.maximintegrated.com/en.html
标准
下载文档 详细参数 选型对比 全文预览

MAX13035EEBE+概述

Interface Circuit, BICMOS, PBGA16, 2 X 2 MM, LEAD FREE, UCSP-16

MAX13035EEBE+规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
零件包装代码BGA
包装说明VFBGA, BGA16,4X4,20
针数16
Reach Compliance Codecompliant
ECCN代码EAR99
Factory Lead Time6 weeks
Is SamacsysN
接口集成电路类型INTERFACE CIRCUIT
JESD-30 代码S-PBGA-B16
长度2.02 mm
湿度敏感等级1
功能数量1
端子数量16
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码VFBGA
封装等效代码BGA16,4X4,20
封装形状SQUARE
封装形式GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度)260
电源2.5/3.3 V
认证状态Not Qualified
座面最大高度0.67 mm
最大供电电压3.2 V
最小供电电压1.62 V
标称供电电压1.8 V
电源电压1-最大3.6 V
电源电压1-分钟2.2 V
电源电压1-Nom3.3 V
表面贴装YES
技术BICMOS
温度等级INDUSTRIAL
端子形式BALL
端子节距0.5 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度2.02 mm
Base Number Matches1

文档预览

下载PDF文档
19-0626; Rev 0; 1/07
KIT
ATION
EVALU
BLE
AVAILA
6-Channel High-Speed Logic-Level Translators
General Description
The MAX13030E–MAX13035E 6-channel, bidirectional
level translators provide the level shifting necessary for
100Mbps data transfer in multivoltage systems. The
MAX13030E–MAX13035E are ideally suited for memo-
ry-card level translation, as well as generic level trans-
lation in systems with six channels. Externally applied
voltages, V
CC
and V
L
, set the logic levels on either side
of the device. Logic signals present on the V
L
side of
the device appear as a higher voltage logic signal on
the V
CC
side of the device and vice versa. The
MAX13035E features a CLK_RET output that returns the
same clock signal applied to the CLK_V
L
input.
The MAX13030E–MAX13035E operate at full speed
with external drivers that source as little as 4mA output
current. Each I/O channel is pulled up to V
CC
or V
L
by
an internal 30µA current source, allowing the
MAX13030E–MAX13035E to be driven by either push-
pull or open-drain drivers.
The MAX13030E–MAX13034E feature an enable (EN)
input that places the device into a low-power shutdown
mode when driven low. The MAX13030E–MAX13035E
features an automatic shutdown mode that disables the
part when V
CC
is less than V
L
. The state of I/O V
CC_
and I/O V
L_
during shutdown is chosen by selecting the
appropriate part version (see
Ordering Information/
Selector Guide).
The MAX13030E–MAX13035E accept V
CC
voltages
from +2.2V to +3.6V and V
L
voltages from +1.62V to
+3.2V, making them ideal for data transfer between
low-voltage ASIC/PLDs and higher voltage systems.
The MAX13030E–MAX13035E are available in 16-bump
UCSP (2mm x 2mm) and 16-pin TQFN (4mm x 4mm)
packages, and operate over the extended -40°C to
+85°C temperature range.
o
100Mbps Guaranteed Data Rate
o
Six Bidirectional Channels
o
Clock Return Output (MAX13035E)
o
Enable Input (MAX13030E–MAX13034E)
o
±15kV ESD Protection on I/O V
CC
Lines
o
+1.62V
V
L
+3.2V and +2.2V
V
CC
+3.6V
Supply Voltage Range
o
Lead-Free, 16-Bump UCSP (2mm x 2mm) and
16-pin TQFN (4mm x 4mm) Packages
Features
o
Compatible with 4mA Input Drivers or Larger
MAX13030E–MAX13035E
Typical Operating Circuits
+1.8V
+3.3V
0.1μF
0.1μF
1μF
V
L
+1.8V
SYSTEM
CONTROLLER
DAT3
DAT2
DAT1
DAT0
CMD
CLOCK
CLOCK_IN
GND
V
CC
+3.3V
SD CARD
MAX13035E
I/O V
L_
I/O V
L_
I/O V
L_
I/O V
L_
I/O V
L_
CLK_V
L
CLK_RET
I/O V
CC_
I/O V
CC_
I/O V
CC_
I/O V
CC_
I/O V
CC_
CLK_V
CC
DAT3
DAT2
DAT1
DAT0
CMD
CLOCK
GND
GND
Applications
SD Card Level Translation
MiniSD Card Level Translation
MMC Level Translation
Transflash Level Translation
Memory Stick Card Level Translation
Typical Operating Circuits continued at end of data sheet.
Functional Diagram and Pin Configurations appear at end
of data sheet.
Ordering Information/Selector Guide
I/O V
L
_ STATE DURING
SHUTDOWN
High impedance
High impedance
I/O V
CC
_ STATE DURING
SHUTDOWN
High impedance
High impedance
PKG CODE
B16-1
T1644-4
PART
MAX13030EEBE+
MAX13030EETE+
PIN-PACKAGE
16 UCSP
16 TQFN-EP**
Note:
All devices are specified over the -40°C to +85°C operating
temperature range.
+Denotes
a lead-free package.
**EP
= Exposed paddle.
Ordering Information/Selector guide continued at end of
data sheet.
________________________________________________________________
Maxim Integrated Products
1
For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at
1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com.

MAX13035EEBE+相似产品对比

MAX13035EEBE+ MAX13032EEBE+
描述 Interface Circuit, BICMOS, PBGA16, 2 X 2 MM, LEAD FREE, UCSP-16 Interface Circuit, BICMOS, PBGA16, 2 X 2 MM, LEAD FREE, UCSP-16
是否无铅 不含铅 不含铅
是否Rohs认证 符合 符合
零件包装代码 BGA BGA
包装说明 VFBGA, BGA16,4X4,20 2 X 2 MM, LEAD FREE, UCSP-16
针数 16 16
Reach Compliance Code compliant compliant
Factory Lead Time 6 weeks 1 week
接口集成电路类型 INTERFACE CIRCUIT INTERFACE CIRCUIT
JESD-30 代码 S-PBGA-B16 S-PBGA-B16
长度 2.02 mm 2.02 mm
湿度敏感等级 1 1
功能数量 1 1
端子数量 16 16
最高工作温度 85 °C 85 °C
最低工作温度 -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 VFBGA VFBGA
封装等效代码 BGA16,4X4,20 BGA16,4X4,20
封装形状 SQUARE SQUARE
封装形式 GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
峰值回流温度(摄氏度) 260 260
电源 2.5/3.3 V 2.5/3.3 V
认证状态 Not Qualified Not Qualified
座面最大高度 0.67 mm 0.67 mm
最大供电电压 3.2 V 3.2 V
最小供电电压 1.62 V 1.62 V
标称供电电压 1.8 V 1.8 V
电源电压1-最大 3.6 V 3.6 V
电源电压1-分钟 2.2 V 2.2 V
电源电压1-Nom 3.3 V 3.3 V
表面贴装 YES YES
技术 BICMOS BICMOS
温度等级 INDUSTRIAL INDUSTRIAL
端子形式 BALL BALL
端子节距 0.5 mm 0.5 mm
端子位置 BOTTOM BOTTOM
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED
宽度 2.02 mm 2.02 mm

 
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