电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

1N3033AUR-1TRE3

产品描述Zener Diode, 36V V(Z), 10%, 1.5W,
产品类别分立半导体    二极管   
文件大小161KB,共3页
制造商Microsemi
官网地址https://www.microsemi.com
标准
下载文档 详细参数 全文预览

1N3033AUR-1TRE3概述

Zener Diode, 36V V(Z), 10%, 1.5W,

1N3033AUR-1TRE3规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Microsemi
Reach Compliance Codecompliant
ECCN代码EAR99
Is SamacsysN
配置SINGLE
二极管类型ZENER DIODE
最大动态阻抗50 Ω
元件数量1
最高工作温度175 °C
最大功率耗散1.5 W
标称参考电压36 V
表面贴装YES
最大电压容差10%
工作测试电流7 mA
Base Number Matches1

文档预览

下载PDF文档
1N3016BUR-1 thru 1N3051BUR-1, e3
(or MLL3016B thru MLL3051B, e3)
SCOTTSDALE DIVISION
Surface Mount 1.5 W
GLASS ZENER DIODES
DESCRIPTION
This surface mountable zener diode series is similar to the 1N3016 thru
1N3051 JEDEC registration in the DO-13 package except that it meets the
surface mount DO-213AB outline. It is an ideal selection for applications of
high density and low parasitic requirements. Due to its glass hermetic seal
qualities and metallurgically enhanced internal construction, it is also well
suited for high-reliability applications. This can be acquired by a source
control drawing (SCD), or by ordering device types with MQ, MX, or MV
prefix to part number for equivalent screening to JAN, JANTX or JANTXV.
APPEARANCE
WWW .
Microsemi
.C
OM
DO-213AB
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
FEATURES
Leadless surface mount package equivalents to the
JEDEC registered 1N3016 thru 1N3051 except with
higher power rating of 1.5 Watts
Ideal for high-density mounting
Voltage range: 6.8 to 200 volts
Hermetically sealed, double-slug glass construction
Metallurgically enhanced contact construction.
Options for screening in accordance with MIL-PRF-
19500/115 for JAN, JANTX, JANTXV, and JANS with
MQ, MX, MV, or MSP prefixes respectively for part
numbers, e.g. MX1N3016BUR-1, MV1N3051BUR-1,
etc.
Axial lead “thru-hole” DO-13 packages per JEDEC
registration available as 1N3016B thru 1N3051B (see
separate data sheet with MIL-PRF-19500/115
qualification)
RoHS Compliant devices available by adding “e3” suffix
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating current
and temperature range
Wide selection from 6.8 to 200 V
Tight voltage tolerances available
Low reverse (leakage) currents
Leadless package for surface mounting
Ideal for high-density mounting
Metallurgically enhanced internal contact design for
greater reliability and lower thermal resistance
Nonsensitive to ESD
Hermetically sealed glass package
Specified capacitance (see Figure 2)
Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
Power dissipation at 25
º
C: 1.5 watts (also see
derating in Figure 1).
Operating and Storage temperature: -65
º
C to
+175
º
C
Thermal Resistance: 40
º
C/W junction to end cap,
º
or 120 C/W junction to ambient when mounted on
FR4 PC board (1 oz Cu) with recommended
footprint (see last page)
Steady-State Power: 1.50 watts at end-cap
temperature T
EC
< 115
o
C, or 1.25 watts at T
A
= 25
º
C
when mounted on FR4 PC board and
recommended footprint as described for thermal
resistance (also see Figure 1)
Forward voltage @200 mA: 1.2 volts (maximum)
º
Solder Temperatures: 260 C for 10 s (max)
MECHANICAL AND PACKAGING
CASE: Hermetically sealed glass MELF package
TERMINALS: Tin-lead or RoHS compliant
annealed matte-Tin plating solderable per MIL-
STD-750, method 2026
POLARITY: Cathode indicated by band. Diode to
be operated with the banded end positive with
respect to the opposite end for Zener regulation
MARKING: Cathode band only
TAPE & REEL optional: Standard per EIA-481-1-A
with 12 mm tape, 1500 per 7 inch reel or 5000 per
13 inch reel (add “TR” suffix to part number)
WEIGHT: 0.05 grams
See package dimensions on last page
1N3016BUR-1, e3 thru
1N3051BUR-1, e3
Copyright
©
2006
3-12-2006 REV D
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
LM324四运放的应用.pdf
本帖最后由 paulhyde 于 2014-9-15 09:28 编辑 大赛中很有用哦~~~ ...
贺增甫 电子竞赛
BeagleBone外围电路设计最终版
昨晚奋斗了一下,终于把PCB整晚了。 系统框图如下: 96515 PCB正面: 96517 PCB反面: 96516...
chenzhufly DSP 与 ARM 处理器
DeviceIoControl与u盘硬件通信
利用DeviceIoControl()与u盘进行通信, 通信方式为IOCTL_SCSI_PASS_THROUGH_DIRECT, 这里需要一个CDB命令块,这个CDB命令是如何得到的。 我看到别人的程序中有BYTE Cdb = {0x12, 0x01, 0x ......
xi19871208 嵌入式系统
STM32 有关USART寄存器手册的问题
255770 我的问题是:这个RXNE什么时候置1,是当转一位数据到USART_DR就置1,还是当把一帧数据全部传完才置1? ...
electrics stm32/stm8
进制转化问题
数值的补码表示分两种情况: (1)正数的补码:与原码相同。 (2)负数的补码:符号位为1,其余位为该数绝对值的原码按位取反;然后整个数加1。 每当有人问我怎么把原码转化成补码时我就 ......
cqk62 嵌入式系统
SensorTag活动 智能水平尺应用视频
应管理员要求,重新录制了一份智能水平尺的应用视频。 158698 http://v.youku.com/v_show/id_XNzM5OTE4MzQw.html ...
littleshrimp 无线连接

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 832  1819  2260  1742  121  31  43  13  2  23 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved