The documentation and process conversion
measures necessary to comply with this
revision shall be completed by 23 October 1999.
INCH-POUND
MIL-PRF-19500/358E
23 July 1999
SUPERSEDING
MIL-S-19500/358D
26 May 1994
PERFORMANCE SPECIFICATION SHEET
SEMICONDUCTOR DEVICE, DIODE, SILICON, VOLTAGE REGULATOR
TYPES 1N3305 THROUGH 1N3350, B AND RB, 1N4549 THROUGH 1N4554, B AND RB,
JAN, JANTX, JANTXV, AND JANS
This specification is approved for use by all Depart-
ments and Agencies of the Department of Defense.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for B type (standard polarity) and RB type (reverse polarity), 50
watt, silicon, voltage regulator diodes. Four levels of product assurance are provided for each device type as specified in MIL-PRF-
19500.
1.2 Physical dimensions. See figure 1 (D0-5).
1.3 Maximum ratings. Maximum ratings are as shown in columns 3, 7, and 9 of table II herein and as follows:
Derate P
T
= 50 W at T
C
≥
+75°C at 0.5 W/°C above T
C
≥
+75°C.
-65°C
≤
T
C
≤
+150°C; -65°C
≤
T
STG
≤
+175°C.
1.4 Primary electrical characteristics. Primary electrical characteristics are as shown in columns 1, 8, 11, and 12 of table II herein,
and as follows:
Thermal resistance (R
θJC
) = 2.0°C/W maximum.
Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in improving this document
should be addressed to: Commander, Defense Supply Center Columbus, ATTN: DSCC-VAC, 3990 East Broad St., Columbus, OH
43216-5000, by using the addressed Standardization Document Improvement Proposal (DD Form 1426) appearing at the end of this
document or by letter.
AMSC N/A
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
FSC 5961
MIL-PRF-19500/358E
Ltr
b
C
CD
CH
HF
HT
OAH
SL
UD
ΦT
Dimensions
Inches
Millimeters
Min
Max
Min
Max
----
.375
----
9.53
----
.080
----
2.03
----
.667
----
16.94
----
.450
----
11.43
.667
.687
16.94
17.45
.060
----
1.52
----
----
1.000
----
25.40
.422
.453
10.72
11.51
.220
.249
----
.175
----
4.45
Notes
2, 3, 6
NOTES:
1. Dimensions are in inches.
2. Maximum pitch diameter of plated threads shall be basic pitch diameter; (.2268). .250-28 UNF-2B UNF-2A THD NF optional.
3. Complete threads to extend to within 2-½ threads of seating plane.
4. Angular orientation of this terminal is undefined.
5. Metric equivalents are given for general information only.
6. Diameter of unthreaded portion shall be .249 maximum and .220 minimum.
FIGURE 1. Physical dimensions.
2
MIL-PRF-19500/358E
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This section does not include
documents cited in other sections of this specification or recommended for additional information or as examples. While every effort has
been made to ensure the completeness of this list, document users are cautioned that they must meet all specified requirements
documents cited in sections 3 and 4 of this specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a part of this document
to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in the issue of the Department
of Defense Index of Specifications and Standards (DODISS) and supplement thereto, cited in the solicitation (see 6.2).
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-19500 - Semiconductor Devices, General Specification for.
STANDARD
MILITARY
MIL-STD-750 - Test Methods for Semiconductor Devices.
(Unless otherwise indicated, copies of the above specifications, standards, and handbooks are available from the Defense Automated
Printing Service, Building 4D (NPM-DODSSP), 700 Robbins Avenue, Philadelphia, PA 19111-5094.)
2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited herein (except for
related associated specifications or specification sheets), the text of this document takes precedence. Nothing in this document,
however, supersedes applicable laws and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 Associated specification. The individual item requirements shall be in accordance with MIL-PRF-19500 and as specified herein.
3.2 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as specified in MIL-PRF-
19500.
3.3 Interface requirements and physical dimensions. The Interface requirements and physical dimensions shall be as specified in
MIL-PRF-19500 and herein.
3.3.1 Lead material and finish. Lead finish shall be solderable as defined in MIL-PRF-19500, MIL-STD-750, and herein. Where a
choice of lead finish is desired, it shall be specified in the acquisition document (see 6.2).
3.3.2 Polarity. Standard units (B) shall have the anode connected to the stud. Reversed units (RB) shall have the cathode connected
to the stud.
3.4 Marking. Marking shall be in accordance with MIL-PRF-19500. At the option of the manufacturer, the marking of the country of
origin may be omitted from the body of the semiconductor.
3.4.1 RB types. Reverse (cathode to stud) units shall be marked with an "R" preceding the "B" in the type designation.
3.5 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as
specified in 1.3, 1.4, and table I.
3.6 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table I.
3.7 Qualification. Devices furnished under this specification shall be products that are authorized by the qualifying activity for listing
on the applicable qualified products list before contract award (see 4.2 and 6.4).
3
MIL-PRF-19500/358E
4. VERIFICATION
4.1 Classification of Inspections. The inspection requirements specified herein are classified as follows:
a. Qualification inspection (see 4.2).
b. Screening (see 4.3)
c. Conformance inspection (see 4.4).
4.2 Qualification inspection. Qualification inspection shall be in accordance with MIL-PRF-19500.
4.3 Screening (JANS, JANTX, and JANTXV levels only). Screening shall be in accordance with table IV of MIL-PRF-19500, and as
specified herein. The following measurements shall be made in accordance with table I herein. Devices that exceed the limits of table I
herein shall not be acceptable.
Screen (see
table IV of
MIL-PRF-19500)
9
Measurement
JANS level
I
R
and V
Z
(for devices with
V
Z(nom)
≥
10 V dc; see
column 1 of table II)
JANTX and JANTXV levels
Not applicable
11
I
R
and V
Z
;
∆I
R
= 100 percent of initial value or
2
µA
dc, whichever is greater;
∆V
Z
= ±1 percent of initial value (for
devices with V
Z(nom)
≥
10 V dc;
see column 1 of table II)
See 4.3.1
Subgroup 2, (except forward voltage
test) and 3 of table I herein;
∆I
R1
= 100 percent of initial value or
2
µA
dc, whichever is greater;
∆V
Z
= ±1% of initial value
I
R1
and V
Z
12
13
See 4.3.1
Subgroup 2 (except forward voltage
test) of table I herein;
∆I
R1
= 100 percent of initial value or 2
µA
dc, whichever is greater;
∆V
Z
= ±1 percent of initial value
4.3.1 Power burn-in conditions. Power burn-in conditions are as follows:
I
Z
= Column 4 of table II at a T
C
= +150°C.
4.4 Conformance inspection. Conformance inspection shall be in accordance with MIL-PRF-19500 and as specified herein. Group A
inspection shall be performed on each sublot.
4.4.1 Group A inspection. Group A inspection shall be conducted in accordance with MIL-PRF-19500 and table I herein. End point
electrical measurements shall be in accordance with table I, group A, subgroup 2 herein.
4.4.2 Group B inspection. Group B inspection shall be conducted in accordance with the conditions specified for subgroup testing in
tables VIa (JANS) and VIb (JAN, JANTX, and JANTXV) of MIL-PRF-19500 and paragraphs 4.4.2.1 and 4.4.2.2 herein. Electrical
measurements (end-points) shall be in accordance with table I, group A, subgroup 2 herein. Delta measurements shall be in accordance
with table III herein.
4
MIL-PRF-19500/358E
4.4.2.1 Group B inspection, table VIa (JANS) of MIL-PRF-19500.
Subgroup
B3
B4
B5
B6
Method
4066
1037
1027
4081
Condition
Not required.
I
Z
= column 7 of table II T
C
= 30°C
±3°C,
t
on
= t
off
= 3 minutes minimum for 2,000 cycles.
I
Z
= column 4 of table II for 168 hours, T
A
= 125°C or adjusted as required, to give an average lot T
J
= 225°C.
R
θJC
= 2.0°C/W maximum. For purposes of this test, junction-to-case shall be used in lieu of junction-to-
lead and R
θJC
shall be used in lieu of R
θJL
. The case shall be the reference point for calculation of
junction-to-case thermal resistance (R
θJC
). The mounting arrangement shall be with heat sink to case.
4.4.2.2 Group B inspection, table VIb (JAN, JANTX, and JANTXV) of MIL-PRF-19500.
Subgroup
B2
B2
B3
B5
Method
1051
----
1027
4081
Condition
T
high
= +175°C
Surge (see 4.5.1) I
ZSM
= column 9 or table II.
I
Z
= column 4 of table II min., adjust I
Z
or T
A
to achieve T
J
= 150°C min.
R
θJC
= 2.0°C/W maximum. For purposes of this test, junction-to-case shall be used in lieu of junction-to-
lead and R
θJC
shall be used in lieu of R
θJL
. The case shall be the reference point for calculation of
junction-to-case thermal resistance (R
θJC
). The mounting arrangement shall be with heat sink to case.
B6
1032
T
A
= +175°C.
4.4.3 Group C inspection. Group C inspection shall be conducted in accordance with the conditions specified for subgroup testing in
table VII of MIL-PRF-19500, and as follows. Electrical measurements (end-points) and delta requirements shall be in accordance with
table I, group A, subgroup 2 and table III herein.
Subgroup
C2
Method
2036
Condition
Tension: test condition A, 20 pounds, t = 15 seconds; Torque (stud): Test condition D2,
mounting = normal mounting means, 30 lb-in, t = 30 seconds; bending stress:
Test condition F; 3 pounds, 15 seconds.
Not required.
I
Z
= column 4 of table II min., adjust I
Z
or T
A
to achieve T
J
= 150°C min.
I
Z
= column 4 of table II, T
1
= 30°C ±3°C, T
2
= T
1
+ 100°C each sublot;
αV
Z
= Col. 12 of table II, %/°C;
(sampling plan = 22 devices, c = 0, small lot = 12 devices, c = 0).
C5
C6
C8
4081
1026
4071
5
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