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IS61NLP51236B-200TQLI

产品描述Standard SRAM, 512KX36, 3ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, LQFP-100
产品类别存储    存储   
文件大小2MB,共39页
制造商Integrated Silicon Solution ( ISSI )
标准
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IS61NLP51236B-200TQLI概述

Standard SRAM, 512KX36, 3ns, CMOS, PQFP100, 14 X 20 MM, 1.40 MM HEIGHT, LEAD FREE, LQFP-100

IS61NLP51236B-200TQLI规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Integrated Silicon Solution ( ISSI )
包装说明LQFP,
Reach Compliance Codecompliant
Factory Lead Time10 weeks
Samacsys Confidence3
Samacsys StatusReleased
Samacsys PartID1584206
Samacsys Pin Count100
Samacsys Part CategoryIntegrated Circuit
Samacsys Package CategoryQuad Flat Packages
Samacsys Footprint NameIS61NLP51236B-200TQLI
Samacsys Released Date2018-11-14 11:38:15
Is SamacsysN
最长访问时间3 ns
JESD-30 代码R-PQFP-G100
长度20 mm
内存密度18874368 bit
内存集成电路类型STANDARD SRAM
内存宽度36
功能数量1
端子数量100
字数524288 words
字数代码512000
工作模式SYNCHRONOUS
最高工作温度85 °C
最低工作温度-40 °C
组织512KX36
封装主体材料PLASTIC/EPOXY
封装代码LQFP
封装形状RECTANGULAR
封装形式FLATPACK, LOW PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)NOT SPECIFIED
座面最大高度1.6 mm
最大供电电压 (Vsup)3.465 V
最小供电电压 (Vsup)3.135 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级INDUSTRIAL
端子形式GULL WING
端子节距0.65 mm
端子位置QUAD
处于峰值回流温度下的最长时间NOT SPECIFIED
宽度14 mm
Base Number Matches1

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IS61NLP51236(32)B/IS61NVP51236(32)B/IS61NVVP51236(32)B
IS61NLP102418B/IS61NVP102418B/IS61NVVP102418B
512K x36 and 1024K x18 18Mb, PIPELINE 'NO WAIT' STATE BUS
SYNCHRONOUS SRAM
JUNE 2016
FEATURES
100 percent bus utilization
No wait cycles between Read and Write
Internal self-timed write cycle
Individual Byte Write Control
Single R/W (Read/Write) control pin
Clock controlled, registered address, data and
control
Interleaved or linear burst sequence control
using MODE input
Three chip enables for simple depth
expansion and address pipelining
Power Down mode
Common data inputs and data outputs
/CKE pin to enable clock and suspend
operation
JEDEC 100-pin QFP, 165-ball BGA and 119-
ball BGA packages
Power supply:
NLP: V
DD
3.3V (± 5%), V
DDQ
3.3V/2.5V (± 5%)
NVP: V
DD
2.5V (± 5%), V
DDQ
2.5V (± 5%)
NVVP: V
DD
1.8V (± 5%), V
DDQ
1.8V (± 5%)
JTAG Boundary Scan for BGA packages
Commercial, Industrial and Automotive (x36)
temperature support
Lead-free available
For leaded option, please contact ISSI.
DESCRIPTION
The 18Meg product family features high-speed, low-
power synchronous static RAMs designed to provide
a burstable, high-performance, 'no wait' state,
device for networking and communications
applications. They are organized as 512K words by
36 bits and 1024K words by 18 bits, fabricated with
ISSI's
advanced CMOS technology.
Incorporating a 'no wait' state feature, wait cycles
are eliminated when the bus switches from read to
write, or write to read. This device integrates a 2-bit
burst counter, high-speed SRAM core, and high-
drive capability outputs into a single monolithic
circuit.
All synchronous inputs pass through registers are
controlled by a positive-edge-triggered single clock
input. Operations may be suspended and all
synchronous inputs ignored when Clock Enable,
/CKE is HIGH. In this state the internal device will
hold their previous values.
All Read, Write and Deselect cycles are initiated by
the ADV input. When the ADV is HIGH the internal
burst counter is incremented. New external
addresses can be loaded when ADV is LOW.
Write cycles are internally self-timed and are
initiated by the rising edge of the clock inputs and
when /WE is LOW. Separate byte enables allow
individual bytes to be written.
A burst mode pin (MODE) defines the order of the
burst sequence. When tied HIGH, the interleaved
burst sequence is selected. When tied LOW, the
linear burst sequence is selected
.
FAST ACCESS TIME
Symbol
tKQ
tKC
Parameter
Clock Access Time
Cycle time
Frequency
-250
2.6
4
250
-200
3.0
5
200
Units
ns
ns
MHz
Copyright © 2014 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its
products at any time without notice. ISSI assumes no liability
arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest version
of this device specification before relying on any
published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of
the product can reasonably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products
are not authorized for use in such applications unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
Integrated Silicon Solution, Inc.- www.issi.com
Rev. D1
06/3/2016
1
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