Zener Diode, 8.4V V(Z), 5%, 0.5W, Silicon, DO-35, HERMETIC SEALED, GLASS, SIMILAR TO DO-7, 2 PIN
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Microsemi |
| 零件包装代码 | DO-7 |
| 包装说明 | O-LALF-W2 |
| 针数 | 2 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| Is Samacsys | N |
| 其他特性 | METALLURGICALLY BONDED |
| 外壳连接 | ISOLATED |
| 配置 | SINGLE |
| 二极管元件材料 | SILICON |
| 二极管类型 | ZENER DIODE |
| JEDEC-95代码 | DO-35 |
| JESD-30 代码 | O-LALF-W2 |
| JESD-609代码 | e0 |
| 元件数量 | 1 |
| 端子数量 | 2 |
| 最高工作温度 | 175 °C |
| 最低工作温度 | -65 °C |
| 封装主体材料 | GLASS |
| 封装形状 | ROUND |
| 封装形式 | LONG FORM |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 最大功率耗散 | 0.5 W |
| 认证状态 | Qualified |
| 参考标准 | MIL-19500/158P |
| 标称参考电压 | 8.4 V |
| 表面贴装 | NO |
| 技术 | ZENER |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | WIRE |
| 端子位置 | AXIAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 电压温度Coeff-Max | 0.42 mV/°C |
| 最大电压容差 | 5% |
| Base Number Matches | 1 |

| JAN1N3155-1 | JAN1N3154 | JAN1N3155 | JAN1N3156 | JANTX1N3155 | RSF1/20.1541%T | RTAN0603DKE264R | JANTX1N3155-1 | JAN1N3157 | JANTX1N3154 | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | Zener Diode, 8.4V V(Z), 5%, 0.5W, Silicon, DO-35, HERMETIC SEALED, GLASS, SIMILAR TO DO-7, 2 PIN | Zener Diode, 8.4V V(Z), 4.76%, 0.5W, Silicon, DO-204AA, HERMETICALLY SEALED, GLASS, DO-7, 2 PIN | Zener Diode, 8.4V V(Z), 4.76%, 0.5W, Silicon, DO-204AA, HERMETICALLY SEALED, GLASS, DO-7, 2 PIN | Zener Diode, 8.4V V(Z), 4.76%, 0.5W, Silicon, DO-204AA, HERMETICALLY SEALED, GLASS, DO-7, 2 PIN | Zener Diode, 8.4V V(Z), 4.76%, 0.5W, Silicon, DO-204AA, HERMETICALLY SEALED, GLASS, DO-7, 2 PIN | Fixed Resistor, Metal Oxide Film, 0.5W, 0.154ohm, 250V, 1% +/-Tol, 200ppm/Cel, Through Hole Mount, AXIAL LEADED, ROHS COMPLIANT | Fixed Resistor, Thin Film, 0.15W, 264ohm, 75V, 0.5% +/-Tol, 25ppm/Cel, Surface Mount, 0603, CHIP | Zener Diode, 8.4V V(Z), 5%, 0.5W, Silicon, DO-35, HERMETIC SEALED, GLASS, SIMILAR TO DO-7, 2 PIN | Zener Diode, 8.4V V(Z), 4.76%, 0.5W, Silicon, DO-204AA, HERMETICALLY SEALED, GLASS, DO-7, 2 PIN | Zener Diode, 8.4V V(Z), 4.76%, 0.5W, Silicon, DO-204AA, HERMETICALLY SEALED, GLASS, DO-7, 2 PIN |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 符合 | 符合 | 不符合 | 不符合 | 不符合 |
| 包装说明 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 | AXIAL LEADED, ROHS COMPLIANT | CHIP | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 |
| Reach Compliance Code | compliant | _compli | not_compliant | not_compliant | not_compliant | compliant | compliant | compliant | not_compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 端子数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 最高工作温度 | 175 °C | 175 °C | 175 °C | 175 °C | 175 °C | 200 °C | 155 °C | 175 °C | 175 °C | 175 °C |
| 最低工作温度 | -65 °C | -65 °C | -65 °C | -65 °C | -65 °C | -55 °C | -55 °C | -65 °C | -65 °C | -65 °C |
| 封装形式 | LONG FORM | LONG FORM | LONG FORM | LONG FORM | LONG FORM | Axial | SMT | LONG FORM | LONG FORM | LONG FORM |
| 参考标准 | MIL-19500/158P | MIL-19500/158 | MIL-19500/158 | MIL-19500/158 | MIL-19500/158 | MIL-STD-202 | AEC-Q200 | MIL-19500/158P | MIL-19500/158 | MIL-19500/158 |
| 表面贴装 | NO | NO | NO | NO | NO | NO | YES | NO | NO | NO |
| 技术 | ZENER | ZENER | ZENER | ZENER | ZENER | METAL OXIDE FILM | THIN FILM | ZENER | ZENER | ZENER |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | MATTE TIN | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | - | - | 含铅 | 含铅 | 含铅 |
| 厂商名称 | Microsemi | Microsemi | Microsemi | Microsemi | Microsemi | - | - | Microsemi | Microsemi | Microsemi |
| 零件包装代码 | DO-7 | DO-7 | DO-7 | DO-7 | DO-7 | - | - | DO-7 | DO-7 | DO-7 |
| 针数 | 2 | 2 | 2 | 2 | 2 | - | - | 2 | 2 | 2 |
| 其他特性 | METALLURGICALLY BONDED | METALLURGICAL BONDED | METALLURGICAL BONDED | METALLURGICAL BONDED | METALLURGICAL BONDED | - | ANTI-SULFUR | METALLURGICALLY BONDED | METALLURGICAL BONDED | METALLURGICAL BONDED |
| 外壳连接 | ISOLATED | ISOLATED | ISOLATED | ISOLATED | ISOLATED | - | - | ISOLATED | ISOLATED | ISOLATED |
| 配置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | - | - | SINGLE | SINGLE | SINGLE |
| 二极管元件材料 | SILICON | SILICON | SILICON | SILICON | SILICON | - | - | SILICON | SILICON | SILICON |
| 二极管类型 | ZENER DIODE | ZENER DIODE | ZENER DIODE | ZENER DIODE | ZENER DIODE | - | - | ZENER DIODE | ZENER DIODE | ZENER DIODE |
| JEDEC-95代码 | DO-35 | DO-204AA | DO-204AA | DO-204AA | DO-204AA | - | - | DO-35 | DO-204AA | DO-204AA |
| JESD-30 代码 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 | - | - | O-LALF-W2 | O-LALF-W2 | O-LALF-W2 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e3 | - | e0 | e0 | e0 |
| 元件数量 | 1 | 1 | 1 | 1 | 1 | - | - | 1 | 1 | 1 |
| 封装主体材料 | GLASS | GLASS | GLASS | GLASS | GLASS | - | - | GLASS | GLASS | GLASS |
| 封装形状 | ROUND | ROUND | ROUND | ROUND | ROUND | TUBULAR PACKAGE | - | ROUND | ROUND | ROUND |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 最大功率耗散 | 0.5 W | 0.5 W | 0.5 W | 0.5 W | 0.5 W | - | - | 0.5 W | 0.5 W | 0.5 W |
| 认证状态 | Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | - | Qualified | Not Qualified | Not Qualified |
| 标称参考电压 | 8.4 V | 8.4 V | 8.4 V | 8.4 V | 8.4 V | - | - | 8.4 V | 8.4 V | 8.4 V |
| 端子形式 | WIRE | WIRE | WIRE | WIRE | WIRE | - | - | WIRE | WIRE | WIRE |
| 端子位置 | AXIAL | AXIAL | AXIAL | AXIAL | AXIAL | - | - | AXIAL | AXIAL | AXIAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电压温度Coeff-Max | 0.42 mV/°C | 0.84 mV/°C | 0.42 mV/°C | 0.168 mV/°C | 0.42 mV/°C | - | - | 0.42 mV/°C | 0.084 mV/°C | 0.84 mV/°C |
| 最大电压容差 | 5% | 4.76% | 4.76% | 4.76% | 4.76% | - | - | 5% | 4.76% | 4.76% |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - | - | 1 | 1 | - |
| 最大动态阻抗 | - | 15 Ω | 15 Ω | 15 Ω | 15 Ω | - | - | - | 15 Ω | 15 Ω |
| 工作测试电流 | - | 10 mA | 10 mA | 10 mA | 10 mA | - | - | - | 10 mA | 10 mA |
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