|
OPA875IDGKTG4 |
OPA875ID |
OPA875IDGKT |
OPA875IDR |
OPA875IDG4 |
OPA875IDGKR |
描述 |
Single 2:1 High-Speed Video Multiplexer 8-VSSOP -40 to 85 |
Single 2:1 High-Speed Video Multiplexer 8-SOIC -40 to 85 |
Single 2:1 High-Speed Video Multiplexer 8-VSSOP -40 to 85 |
Single 2:1 High-Speed Video Multiplexer 8-SOIC -40 to 85 |
Single 2:1 High-Speed Video Multiplexer 8-SOIC -40 to 85 |
Single 2:1 High-Speed Video Multiplexer 8-VSSOP -40 to 85 |
Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
是否无铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
是否Rohs认证 |
符合 |
符合 |
符合 |
符合 |
符合 |
符合 |
厂商名称 |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
零件包装代码 |
MSOP |
SOIC |
MSOP |
SOIC |
SOIC |
MSOP |
包装说明 |
TSSOP, TSSOP8,.19 |
SOP, SOP8,.25 |
TSSOP, TSSOP8,.19 |
SOP, SOP8,.25 |
SOP, SOP8,.25 |
VSSOP-8 |
针数 |
8 |
8 |
8 |
8 |
8 |
8 |
Reach Compliance Code |
compli |
compli |
compli |
compli |
compli |
compli |
Factory Lead Time |
6 weeks |
1 week |
1 week |
12 weeks |
6 weeks |
1 week |
模拟集成电路 - 其他类型 |
VIDEO MULTIPLEXER |
VIDEO MULTIPLEXER |
VIDEO MULTIPLEXER |
VIDEO MULTIPLEXER |
VIDEO MULTIPLEXER |
VIDEO MULTIPLEXER |
JESD-30 代码 |
S-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
R-PDSO-G8 |
JESD-609代码 |
e4 |
e4 |
e4 |
e4 |
e4 |
e4 |
长度 |
3 mm |
4.9 mm |
3 mm |
4.9 mm |
4.9 mm |
3 mm |
湿度敏感等级 |
2 |
2 |
2 |
2 |
2 |
2 |
负电源电压最大值(Vsup) |
-6 V |
-6 V |
-6 V |
-6 V |
-6 V |
-6 V |
负电源电压最小值(Vsup) |
-3 V |
-3 V |
-3 V |
-3 V |
-3 V |
-3 V |
标称负供电电压 (Vsup) |
-5 V |
-5 V |
-5 V |
-5 V |
-5 V |
-5 V |
正常位置 |
NO/NC |
NO/NC |
NO/NC |
NO/NC |
NO/NC |
NO/NC |
信道数量 |
2 |
2 |
2 |
2 |
2 |
2 |
功能数量 |
1 |
1 |
1 |
1 |
1 |
1 |
端子数量 |
8 |
8 |
8 |
8 |
8 |
8 |
标称断态隔离度 |
70 dB |
70 dB |
70 dB |
70 dB |
70 dB |
70 dB |
最高工作温度 |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
85 °C |
最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
TSSOP |
SOP |
TSSOP |
SOP |
SOP |
TSSOP |
封装等效代码 |
TSSOP8,.19 |
SOP8,.25 |
TSSOP8,.19 |
SOP8,.25 |
SOP8,.25 |
TSSOP8,.19 |
封装形状 |
SQUARE |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
封装形式 |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
SMALL OUTLINE |
SMALL OUTLINE |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
峰值回流温度(摄氏度) |
260 |
260 |
260 |
260 |
260 |
260 |
电源 |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
认证状态 |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
Not Qualified |
座面最大高度 |
1.1 mm |
1.58 mm |
1.1 mm |
1.75 mm |
1.75 mm |
1.07 mm |
最大供电电流 (Isup) |
12 mA |
12 mA |
12 mA |
12 mA |
12 mA |
12 mA |
最大供电电压 (Vsup) |
6 V |
6 V |
6 V |
6 V |
6 V |
6 V |
最小供电电压 (Vsup) |
3 V |
3 V |
3 V |
3 V |
3 V |
3 V |
标称供电电压 (Vsup) |
5 V |
5 V |
5 V |
5 V |
5 V |
5 V |
表面贴装 |
YES |
YES |
YES |
YES |
YES |
YES |
技术 |
BIPOLAR |
BIPOLAR |
BIPOLAR |
BIPOLAR |
BIPOLAR |
BIPOLAR |
温度等级 |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
端子面层 |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
GULL WING |
端子节距 |
0.65 mm |
1.27 mm |
0.65 mm |
1.27 mm |
1.27 mm |
0.65 mm |
端子位置 |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
DUAL |
处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
宽度 |
3 mm |
3.91 mm |
3 mm |
3.9 mm |
3.9 mm |
3 mm |