The documentation and process conversion
measures necessary to comply with this revision
shall be completed by 19 October 2007.
INCH-POUND
MIL-PRF-19500/118H
19 July 2007
SUPERSEDING
MIL-PRF-19500/118G
22 June 2006
PERFORMANCE SPECIFICATION SHEET
SEMICONDUCTOR DEVICE, DIODE, SILICON,
TYPES 1N483B, 1N485B, 1N486B, 1N5194, 1N5194UR, 1N5194US, 1N5195, 1N5195UR,
1N5195US,1N5196, 1N5196UR, AND 1N5196US, JAN, JANTX, AND JANTXV
This specification is approved for use by all Departments and Agencies
of the Department of Defense.
The requirements for acquiring the product described herein shall consist
of this specification sheet and MIL-PRF-19500.
Types 1N483B, 1N485B, 1N486B are inactive for new design. See 6.4.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for silicon diodes. Three levels of product
assurance are provided for each device type as specified in MIL-PRF-19500.
1.2 Physical dimensions. See figure 1, figure 2 (DO-213AA), and figure 3.
1.3 Maximum ratings. TA = +25°C unless otherwise specified.
VRM VRWM
Type (1)
IO
(1) (2)
TA=75°C
mA
200
IO
TA =
150°C
mA
50
TJ and
IFSM
R
ΘJL
R
ΘJEC
R
ΘJA(PCB)
tp = 1/120 s TSTG
L=
LD = 0
.375 inch
TA = 25°C
(9.53 mm)
A
°C
°C/W
°C/W
°C/W
250
2
-65 to
250
275
+175
100
40
250
250
100
40
250
250
100
40
V (pk) V (pk)
1N483B
1N5194
1N5194UR
1N5194US
1N485B
1N5195
1N5195UR
1N5195US
1N486B
1N5196
1N5196UR
1N5196US
80
70
200
180
250
225
(1) The electrical characteristics for UR and US suffix devices are identical to their corresponding leaded devices
unless otherwise noted (applies only to the 1N5194, 1N5195, and 1N5196).
(2) Derate 1.2 mA/°C between 25°C and 150°C. Derate 2 mA/°C between 150°C and 175°C (see figure 4).
* Comments, suggestions, or questions on this document should be addressed to Defense Supply Center,
Columbus, ATTN: DSCC-VAC, P.O. Box 3990, Columbus, OH 43218-3990, or emailed to
semiconductor@dscc.dla.mil
. Since contact information can change, you may want to verify the currency of
this address information using the ASSIST Online database at
http://assist.daps.dla.mil .
AMSC N/A
FSC 5961
MIL-PRF-19500/118H
1.4 Primary electrical characteristics at T
A
= +25°C, unless otherwise indicated.
Type
VF1
V dc
1.0
1.0
1.0
IR1 at VRWM
nA dc
25
25
25
IR3 at VRWM
TA = 150°C
µA
dc
5
5
5
Z
ΘJX
°C/W
1N483B, 1N5194, 1N5194UR, 1N5194US
1N485B, 1N5195, 1N5195UR, 1N5195US
1N486B, 1N5196, 1N5196UR, 1N5196US
2. APPLICABLE DOCUMENTS
70
2.1 General. The documents listed in this section are specified in sections 3, 4, or 5 of this specification. This
section does not include documents cited in other sections of this specification or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements of documents cited in sections 3, 4, or 5 of this
specification, whether or not they are listed.
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are
those cited in the solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-19500
-
Semiconductor Devices, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-750
-
Test Methods for Semiconductor Devices.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D,
Philadelphia, PA 19111-5094.)
2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited
herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws
and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 General. The individual item requirements shall be as specified in MIL-PRF-19500 and as modified herein.
3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list (QML)
before contract award (see 4.2 and 6.3).
3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions used herein shall be as
specified in MIL-PRF-19500.
2
MIL-PRF-19500/118H
Type
1N483B
1N485B
1N486B
(DO-7/35)
1N5194
1N5195
1N5196
(DO-35)
Symbol
BD
BL
LD
LL
BD
BL
LD
LL
Dimensions
Inches
Millimeters
Min
Max
Min
Max
.055
.107
1.40
2.72
.120
.300
3.05
7.62
.018
.022
0.46
0.56
1.00
1.500
25.40
38.10
.056
.120
.018
1.00
.075
.180
.022
1.500
1.42
3.56
0.46
25.40
1.90
4.57
0.56
38.10
Notes
3
2, 5
4, 5
2, 5
4, 5
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Dimension BD shall be measured at the largest diameter.
4. The minimum dimension of BD shall apply over at least .065 inch (1.65 mm) of dimension BL.
5. The specified lead diameter applies in the zone between .050 inch (1.27 mm) from the diode body to the end
of the lead. Outside of this zone lead shall not exceed BD. Applies to both leads.
6. In accordance with ASME Y14.5M, diameters are equivalent to
Φx
symbology.
* FIGURE 1. Physical dimensions (DO-7, DO-35).
3
MIL-PRF-19500/118H
DO-213AA
UR
Symbol
BD
BL
ECT
S
Dimensions
Inches
Millimeters
Min
Max
Min
Max
.063
.067
1.60
1.70
.130
.146
3.30
3.71
.016
.022
0.41
0.56
.001
0.03
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Dimensions are pre-solder dip.
4. Minimum clearance of glass body to mounting surface on all orientations.
5. In accordance with ASME Y14.5M, diameters are equivalent to
Φx
symbology.
FIGURE 2. Physical dimensions 1N5194UR, 1N5195UR, and 1N5196UR (DO-213AA).
4
MIL-PRF-19500/118H
US
Symbol
BD
BL
ECT
S
Dimensions
Inches
Millimeters
Min
Max
Min
Max
.091
.103
2.31
2.62
.168
.200
4.27
5.08
.019
.028
0.48
0.71
.003
0.08
NOTES:
1. Dimensions are in inches.
2. Millimeters are given for general information only.
3. Dimensions are pre-solder dip.
4. Minimum clearance of glass body to mounting surface on all orientations.
5. In accordance with ASME Y14.5M, diameters are equivalent to
Φx
symbology.
FIGURE 3. Physical dimensions 1N5194US, 1N5195US, and 1N5196US.
5
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