The documentation and process conversion
measures necessary to comply with this revision
shall be completed by 24 September 2003.
INCH-POUND
MIL-PRF-19500/463F
24 June 2003
SUPERSEDING
MIL-S-19500/463E
12 October 1997
PERFORMANCE SPECIFICATION
SEMICONDUCTOR DEVICE, DIODE, SILICON, CURRENT REGULATOR,
TYPES 1N5283-1 THROUGH 1N5314-1, AND 1N5283UR-1 THROUGH 1N5314UR-1
JAN, JANTX, JANTXV, JANS, JANHC, AND JANKC
This specification is approved for use by all Departments
and Agencies of the Department of Defense.
1. SCOPE
1.1 Scope. This specification covers the performance requirements for 100 volt, silicon, current regulator diodes.
Four levels of product assurance are provided for each encapsulated device type as specified in MIL-PRF-19500.
Two levels of product assurance are provided for each unencapsulated device type.
1.2 Physical dimensions. See figure 1 (DO-7), figure 2 (DO-213AB), and figure 3 (JANHC and JANKC).
1.3 Maximum ratings. Maximum ratings are as shown in maximum test ratings (see 3.10) and as follows:
a. PT = 500 mW (DO-7) at TL = +50°C, L = .375 inch (9.53 mm); both ends of case or diode body to heat sink
at
L = .375 inch (9.53 mm). (Derate to 0 at +175°C).
b. PT = 500 mW (DO-213AB) at TEC = +125°C. (Derate to 0 at +175°C).
c. -65°C
≤
Tj
≤
+175°C; -65°C
≤
TSTG
≤
+175°C.
1.4 Primary electrical characteristics. Primary electrical ratings are as shown in maximum test ratings (see 3.10)
and as follows, (nominally 0.22 mA dc
≤
IP
≤
4.70 mA dc):
a. R
ΘJL
= 250°C/W (maximum) at L = .375 inch (9.53 mm) (DO-7).
b. R
ΘJEC
= 100°C/W (maximum) junction to end-caps (DO-213AB).
2. APPLICABLE DOCUMENTS
2.1 General. The documents listed in this section are specified in sections 3 and 4 of this specification. This
section does not include documents cited in other sections of this specification or recommended for additional
information or as examples. While every effort has been made to ensure the completeness of this list, document
users are cautioned that they must meet all specified requirements documents cited in sections 3 and 4 of this
specification, whether or not they are listed.
Beneficial comments (recommendations, additions, deletions) and any pertinent data which may be of use in
improving this document should be addressed to: Defense Supply Center, Columbus, ATTN: DSCC-VAC, P.O.
Box 3990, Columbus, OH 43216-5000, by using the Standardization Document Improvement Proposal (DD
Form 1426) appearing at the end of this document or by letter.
AMSC N/A
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
FSC 5961
MIL-PRF-19500/463F
DO-7
Symbol
BD
BL
LD
LL
Dimensions
Inches
Millimeters
Min
Max
Min
Max
.085
.107
2.16
2.72
.230
.300
5.84
7.62
.018
.022
0.46
0.56
1.000
1.300
25.4
38.1
Notes
3, 4
4,5
NOTES:
1. Dimensions are in inches.
2. Metric equivalents are given for general information only.
3. The minimum body diameter shall be maintained over .15 inch (0.38 mm) inch of body length.
4. The specified lead diameter applies in the zone between .050 inch (1.27 mm) and
the end of the lead. Outside of this zone the lead diameter shall not exceed BD.
5. Both leads shall be within the specified dimension.
6. See 3.3 for L and TL definitions.
7. Dimensions are in accordance with ASME Y14.5M.
FIGURE 1. Physical dimensions (1N5283-1 through 1N5314-1).
2
MIL-PRF-19500/463F
DO-213AB
Symbol
BD
BL
ECT
S
Dimensions
Inches
Millimeters
Min
Max
Min
Max
.094
.105
2.39
2.67
.189
.205
4.80
5.21
.016
.022
0.41
0.55
.001 min
0.03 min
NOTES:
1. Dimensions are in inches.
2. Metric equivalents are given for general information only.
FIGURE 2. Physical dimensions (1N5283UR-1 through 1N5314UR-1).
3
MIL-PRF-19500/463F
Symbol
A
B
Dimensions
Inches
Millimeters
Min
Max
Min
Max
.012
.014
0.305 0.355
.026
.030
0.660 0.762
Design data
Metallization:
Top: (Anode) ......... Al.
Back: (Cathode) .... Au.
Al thickness ............ 25000 Å Min.
Gold thickness ........ 4000 Å Min.
Chip thickness ....... .010 ±.002 inch (0.254 ±0.0508 mm).
NOTES:
1. Dimensions are in inches.
2. Metric equivalents are given for general information only.
FIGURE 3. Physical dimensions, JANHCA and JANKCA die.
4
MIL-PRF-19500/463F
2.2 Government documents.
2.2.1 Specifications, standards, and handbooks. The following specifications, standards, and handbooks form a
part of this document to the extent specified herein. Unless otherwise specified, the issues of these documents are
those listed in the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and
supplement thereto, cited in the solicitation (see 6.2).
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-19500 - Semiconductor Devices, General Specification for.
STANDARD
DEPARTMENT OF DEFENSE
MIL-STD-750 - Test Methods for Semiconductor Devices.
(Unless otherwise indicated, copies of the above specifications, standards, and handbooks are available from the
Document Automation and Production Services (DAPS), Building 4D (DPM-DODSSP), 700 Robbins Avenue,
Philadelphia, PA 19111-5094.)
2.3 Order of precedence. In the event of a conflict between the text of this document and the references cited
herein, the text of this document takes precedence. Nothing in this document, however, supersedes applicable laws
and regulations unless a specific exemption has been obtained.
3. REQUIREMENTS
3.1 General. The individual item requirements shall be as specified in MIL-PRF-19500 and as modified herein.
3.2 Qualification. Devices furnished under this specification shall be products that are manufactured by a
manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturer's list (QML)
before contract award (see 4.2 and 6.5).
3.3 Abbreviations, symbols, and definitions. Abbreviations, symbols, and definitions shall be as specified in
MIL-PRF-19500 and as follows:
L
-
Lead thermal path length. Lead thermal path length is the distance from the end of the diode body to
the point of lead-temperature measurement. For purposes of this measurement, the same heat sinking
at the same distance from the diode body shall be applied to each lead. No heat sinking shall occur
between the diode body and the point of lead-temperature measurement. This measurement may be
made from either end of the diode body. (The diode body includes slugs, if any, but does not include
braze fillet, paint, etc., within the zone of uncontrollable lead diameter.)
Lead temperature. Lead temperature is the temperature of the lead measured at the lead thermal path
length, L. Lead temperature shall be measured by means of a No. 30 copper-constantan
thermocouple, or equivalent. All reference to TL will be Tend-cap for "UR" devices.
Pinch-off current. IP Pinch-off current is defined as the regulator current at specified test voltage, V
S
.
Peak Operating Voltage. Peak operating voltage is the maximum voltage that shall be applied to the
device.
Steady-state power dissipation. Power dissipated under steady-state conditions.
TL
-
IP
-
VPOV -
PD
-
3.4 Interface and physical dimensions. Interface and physical dimensions shall be as specified in
MIL-PRF-19500, and figure 1 (DO-7), figure 2 (DO-213AB), and figure 3 (JANHC and JANKC die) herein.
5
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