电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

1N3045BUR-1E3TR

产品描述Zener Diode, 110V V(Z), 5%, 1.25W, Silicon, Unidirectional, DO-213AB, ROHS COMPLIANT, HERMETIC SEALED, LEADLESS, GLASS, MELF-2
产品类别分立半导体    二极管   
文件大小161KB,共3页
制造商Microsemi
官网地址https://www.microsemi.com
标准
下载文档 详细参数 全文预览

1N3045BUR-1E3TR概述

Zener Diode, 110V V(Z), 5%, 1.25W, Silicon, Unidirectional, DO-213AB, ROHS COMPLIANT, HERMETIC SEALED, LEADLESS, GLASS, MELF-2

1N3045BUR-1E3TR规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Microsemi
零件包装代码DO-213AB
包装说明O-LELF-R2
针数2
Reach Compliance Codeunknown
ECCN代码EAR99
Is SamacsysN
其他特性METALLURGICALLY BONDED, HIGH RELIABILITY
外壳连接ISOLATED
配置SINGLE
二极管元件材料SILICON
二极管类型ZENER DIODE
JEDEC-95代码DO-213AB
JESD-30 代码O-LELF-R2
JESD-609代码e3
元件数量1
端子数量2
封装主体材料GLASS
封装形状ROUND
封装形式LONG FORM
峰值回流温度(摄氏度)NOT SPECIFIED
极性UNIDIRECTIONAL
最大功率耗散1.25 W
认证状态Not Qualified
标称参考电压110 V
表面贴装YES
技术ZENER
端子面层MATTE TIN
端子形式WRAP AROUND
端子位置END
处于峰值回流温度下的最长时间NOT SPECIFIED
最大电压容差5%
工作测试电流2.3 mA
Base Number Matches1

文档预览

下载PDF文档
1N3016BUR-1 thru 1N3051BUR-1, e3
(or MLL3016B thru MLL3051B, e3)
SCOTTSDALE DIVISION
Surface Mount 1.5 W
GLASS ZENER DIODES
DESCRIPTION
This surface mountable zener diode series is similar to the 1N3016 thru
1N3051 JEDEC registration in the DO-13 package except that it meets the
surface mount DO-213AB outline. It is an ideal selection for applications of
high density and low parasitic requirements. Due to its glass hermetic seal
qualities and metallurgically enhanced internal construction, it is also well
suited for high-reliability applications. This can be acquired by a source
control drawing (SCD), or by ordering device types with MQ, MX, or MV
prefix to part number for equivalent screening to JAN, JANTX or JANTXV.
APPEARANCE
WWW .
Microsemi
.C
OM
DO-213AB
IMPORTANT:
For the most current data, consult
MICROSEMI’s
website:
http://www.microsemi.com
FEATURES
Leadless surface mount package equivalents to the
JEDEC registered 1N3016 thru 1N3051 except with
higher power rating of 1.5 Watts
Ideal for high-density mounting
Voltage range: 6.8 to 200 volts
Hermetically sealed, double-slug glass construction
Metallurgically enhanced contact construction.
Options for screening in accordance with MIL-PRF-
19500/115 for JAN, JANTX, JANTXV, and JANS with
MQ, MX, MV, or MSP prefixes respectively for part
numbers, e.g. MX1N3016BUR-1, MV1N3051BUR-1,
etc.
Axial lead “thru-hole” DO-13 packages per JEDEC
registration available as 1N3016B thru 1N3051B (see
separate data sheet with MIL-PRF-19500/115
qualification)
RoHS Compliant devices available by adding “e3” suffix
APPLICATIONS / BENEFITS
Regulates voltage over a broad operating current
and temperature range
Wide selection from 6.8 to 200 V
Tight voltage tolerances available
Low reverse (leakage) currents
Leadless package for surface mounting
Ideal for high-density mounting
Metallurgically enhanced internal contact design for
greater reliability and lower thermal resistance
Nonsensitive to ESD
Hermetically sealed glass package
Specified capacitance (see Figure 2)
Inherently radiation hard as described in Microsemi
MicroNote 050
MAXIMUM RATINGS
Power dissipation at 25
º
C: 1.5 watts (also see
derating in Figure 1).
Operating and Storage temperature: -65
º
C to
+175
º
C
Thermal Resistance: 40
º
C/W junction to end cap,
º
or 120 C/W junction to ambient when mounted on
FR4 PC board (1 oz Cu) with recommended
footprint (see last page)
Steady-State Power: 1.50 watts at end-cap
temperature T
EC
< 115
o
C, or 1.25 watts at T
A
= 25
º
C
when mounted on FR4 PC board and
recommended footprint as described for thermal
resistance (also see Figure 1)
Forward voltage @200 mA: 1.2 volts (maximum)
º
Solder Temperatures: 260 C for 10 s (max)
MECHANICAL AND PACKAGING
CASE: Hermetically sealed glass MELF package
TERMINALS: Tin-lead or RoHS compliant
annealed matte-Tin plating solderable per MIL-
STD-750, method 2026
POLARITY: Cathode indicated by band. Diode to
be operated with the banded end positive with
respect to the opposite end for Zener regulation
MARKING: Cathode band only
TAPE & REEL optional: Standard per EIA-481-1-A
with 12 mm tape, 1500 per 7 inch reel or 5000 per
13 inch reel (add “TR” suffix to part number)
WEIGHT: 0.05 grams
See package dimensions on last page
1N3016BUR-1, e3 thru
1N3051BUR-1, e3
Copyright
©
2006
3-12-2006 REV D
Microsemi
Scottsdale Division
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503
Page 1
USB开发--DEVICE_INFO
程序如下: typedef struct _DEVICE_INFO { uint8_t USBbmRequestType; /* bmRequestType */ uint8_t USBbRequest; /* bRequest */ uint16_t_uint8_t US ......
liuchang--- stm32/stm8
232接收问题,
我的程序自发自收都正常,但接收触摸串口终端的数据,只能每次复位后收到二个字节,后面的数据就收不到了。我的程序是在中断里收。收完二个字节后,就在也不会产生中断了,DEBUG断点看,中断是 ......
ywqaxiwang stm32/stm8
UART1不能发送数据
我像发个数据05到串口上,函数如下,但是串口上显示不出来,请问下这是什么问题?#include"stm32f10x.h" GPIO_InitTypeDef GPIO_InitStructure; USART_InitTypeDef  USART_InitS ......
vipczx stm32/stm8
鸿蒙开发板Neptune (三)  —— 开发环境遇到的问题
鸿蒙开发板Neptune(三)——开发环境遇到的问题 经过两周终于能更新了,期间的起起落落,一一道来。 在第二篇文档里,放了官方的文档Neptune/软件使用手册.md · HiHope ......
wxd123com 嵌入式系统
今天上午10:00直播【解锁 TI Sitara AM2x MCU 在电机驱动中的新可能】
本次研讨会将介绍 TI 最新的 AM243x 高性能 MCU ,该 MCU 解决了基于闪存的 MCU 与处理器之间的性能差距;也将介绍 Sitara AM243x MCU 产品组合如何伴随工业 4.0 和智能工厂的兴起,来增强电机 ......
EEWORLD社区 微控制器 MCU
用protel99进行逻辑电路设计.asp
用protel99进行逻辑电路设计.asp...
fighting PCB设计

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 1044  502  483  1622  251  22  20  25  35  31 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved