Bus Driver, 100K Series, 1-Func, 8-Bit, True Output, ECL, CQFP24, CERPACK-24
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Fairchild |
零件包装代码 | QFP |
包装说明 | QFF, QFL24,.4SQ |
针数 | 24 |
Reach Compliance Code | unknown |
Is Samacsys | N |
其他特性 | WITH 25 OHM LINE DRIVE CAPABILITY |
控制类型 | ENABLE LOW |
系列 | 100K |
JESD-30 代码 | S-GQFP-F24 |
JESD-609代码 | e0 |
长度 | 9.398 mm |
逻辑集成电路类型 | BUS DRIVER |
位数 | 8 |
功能数量 | 1 |
端口数量 | 2 |
端子数量 | 24 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出特性 | OPEN-EMITTER WITH CUT-OFF |
输出极性 | TRUE |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | QFF |
封装等效代码 | QFL24,.4SQ |
封装形状 | SQUARE |
封装形式 | FLATPACK |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | -4.5 V |
最大电源电流(ICC) | 150 mA |
Prop。Delay @ Nom-Sup | 2.7 ns |
传播延迟(tpd) | 2.7 ns |
认证状态 | Not Qualified |
筛选级别 | 38535Q/M;38534H;883B |
座面最大高度 | 2.16 mm |
表面贴装 | YES |
技术 | ECL |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | FLAT |
端子节距 | 1.27 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 9.398 mm |
Base Number Matches | 1 |
100352FMQB | 100352DM | 4114R-2-183D | 4114T-1-2701BABL | 100352DC | 100352FC | |
---|---|---|---|---|---|---|
描述 | Bus Driver, 100K Series, 1-Func, 8-Bit, True Output, ECL, CQFP24, CERPACK-24 | Bus Driver, 100K Series, 1-Func, 8-Bit, True Output, ECL, CDIP24, 0.400 INCH, CERAMIC, DIP-24 | Array/Network Resistor, Bussed, Metal Glaze/thick Film, 0.125W, 18000ohm, 100V, 0.5% +/-Tol, -100,100ppm/Cel, 7731, | Array/Network Resistor, Bussed, Thin Film, 0.12W, 2700ohm, 50V, 0.1% +/-Tol, -100,100ppm/Cel, 7726, | Bus Driver, 100K Series, 1-Func, 8-Bit, True Output, ECL, CDIP24, 0.400 INCH, CERAMIC, DIP-24 | Bus Driver, 100K Series, 1-Func, 8-Bit, True Output, ECL, CQFP24, CERPACK-24 |
Reach Compliance Code | unknown | unknown | not_compliant | not_compliant | unknown | unknown |
系列 | 100K | 100K | 4100R | 4100T | 100K | 100K |
端子数量 | 24 | 24 | 14 | 14 | 24 | 24 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 85 °C | 85 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | - | - |
封装形式 | FLATPACK | IN-LINE | DIP | DIP | IN-LINE | FLATPACK |
技术 | ECL | ECL | METAL GLAZE/THICK FILM | THIN FILM | ECL | ECL |
厂商名称 | Fairchild | Fairchild | - | - | Fairchild | Fairchild |
零件包装代码 | QFP | DIP | - | - | DIP | QFP |
包装说明 | QFF, QFL24,.4SQ | DIP, | - | - | DIP, | QFF, |
针数 | 24 | 24 | - | - | 24 | 24 |
Is Samacsys | N | N | - | - | N | N |
其他特性 | WITH 25 OHM LINE DRIVE CAPABILITY | WITH 25 OHM LINE DRIVE CAPABILITY | - | - | WITH 25 OHM LINE DRIVE CAPABILITY | WITH 25 OHM LINE DRIVE CAPABILITY |
JESD-30 代码 | S-GQFP-F24 | R-GDIP-T24 | - | - | R-GDIP-T24 | S-GQFP-F24 |
逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | - | - | BUS DRIVER | BUS DRIVER |
位数 | 8 | 8 | - | - | 8 | 8 |
功能数量 | 1 | 1 | - | - | 1 | 1 |
端口数量 | 2 | 2 | - | - | 2 | 2 |
输出特性 | OPEN-EMITTER WITH CUT-OFF | OPEN-EMITTER WITH CUT-OFF | - | - | OPEN-EMITTER WITH CUT-OFF | OPEN-EMITTER WITH CUT-OFF |
输出极性 | TRUE | TRUE | - | - | TRUE | TRUE |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装代码 | QFF | DIP | - | - | DIP | QFF |
封装形状 | SQUARE | RECTANGULAR | - | - | RECTANGULAR | SQUARE |
传播延迟(tpd) | 2.7 ns | 2.7 ns | - | - | 2.2 ns | 2 ns |
认证状态 | Not Qualified | Not Qualified | - | - | Not Qualified | Not Qualified |
座面最大高度 | 2.16 mm | 5.72 mm | - | - | 5.72 mm | 2.16 mm |
表面贴装 | YES | NO | - | - | NO | YES |
温度等级 | MILITARY | MILITARY | - | - | OTHER | OTHER |
端子形式 | FLAT | THROUGH-HOLE | - | - | THROUGH-HOLE | FLAT |
端子节距 | 1.27 mm | 2.54 mm | - | - | 2.54 mm | 1.27 mm |
端子位置 | QUAD | DUAL | - | - | DUAL | QUAD |
宽度 | 9.398 mm | 10.16 mm | - | - | 10.16 mm | 9.398 mm |
Base Number Matches | 1 | 1 | - | - | 1 | 1 |
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