电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

4309T-101-2212DBL

产品描述Array/Network Resistor, Bussed, Thin Film, 1.13W, 50V, 0.5% +/-Tol, 50ppm/Cel, Through Hole Mount, SIP, ROHS COMPLIANT
产品类别无源元件    电阻器   
文件大小198KB,共2页
制造商Bourns
官网地址http://www.bourns.com
标准
下载文档 详细参数 全文预览

4309T-101-2212DBL概述

Array/Network Resistor, Bussed, Thin Film, 1.13W, 50V, 0.5% +/-Tol, 50ppm/Cel, Through Hole Mount, SIP, ROHS COMPLIANT

4309T-101-2212DBL规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Bourns
包装说明SIP, ROHS COMPLIANT
Reach Compliance Codenot_compliant
ECCN代码EAR99
Is SamacsysN
元件功耗0.1 W
第一元件电阻22100 Ω
JESD-609代码e3
制造商序列号4300T
安装特点THROUGH HOLE MOUNT
网络类型BUSSED
元件数量8
功能数量1
端子数量9
最高工作温度125 °C
最低工作温度-55 °C
封装形状RECTANGULAR PACKAGE
额定功率耗散 (P)1.13 W
额定温度70 °C
电阻器类型ARRAY/NETWORK RESISTOR
表面贴装NO
技术THIN FILM
温度系数50 ppm/°C
温度系数跟踪5 ppm/°C
端子面层Tin (Sn)
端子形状FLAT
容差0.5%
工作电压50 V
Base Number Matches1

文档预览

下载PDF文档
oH
VE S CO
AV R M
AI SIO PL
LA N IA
BL S NT
E
Features
RoHS compliant* (see How to Order
“Termination” option)
Low profile provides compatibility with
DIPs
Also available in medium profile (4300S -
.250 ”) and high profile (4300K - .350 ”)
Marking on contrasting background
Custom circuits available per factory
*R
4300T, S, K Series - Thin Film Molded SIP
Product Characteristics
Resistance Range
Bussed ...................49.9 to 100K ohms
Isolated ......................20 to 200K ohms
Series.........................20 to 100K ohms
Resistance Tolerance
.........................±0.1 %, ±0.5 %, ±1 %
Temperature Coefficient
..................±100 ppm/°C, ±50 ppm/°C,
±25 ppm/°C
Temperature Range ....-55 °C to +125 °C
Insulation Resistance
..................10,000 megohms minimum
TCR Tracking .........................±5 ppm/°C
Maximum Operating Voltage............50 V
Environmental Characteristics
Thermal Shock and
Power Conditioning ...................... 0.1 %
Short Time Overload ..................... 0.1 %
Terminal Strength ........................ 0.25 %
Resistance to Soldering Heat ....... 0.1 %
Moisture Resistance ..................... 0.1 %
Life .............................................. 0.50 %
Physical Characteristics
Body Material Flammability
...........................Conforms to UL94V-0
Lead Frame Material
..........................Copper, solder coated
Body Material ..................Novolac epoxy
How To Order
Package Power Temp. Derating Curve
(Low Profile, 4300T)
(
)
1.75
1.50
4311T
WATTS
1.25
1.00
.75
.50
.25
4310T
4309T
4308T
4306T
Product Dimensions
27.53
MAX.
(1.084)
22.45
MAX.
(.884)
14.83 MAX.
(.584)
24.99
MAX.
(.984)
19.92
MAX.
(.784)
PIN #1 REF.
4.95
(.195)
MAX.
.381 + .127/ - .000
(.015 + .005/ - 000)
2.54
±
.07
(.100
±
.003*)
TYP.
NON-ACCUM.
3.43 + .38/ - .25
(.135 + .015/ - .010)
1.02
±
.12
(.040
±
.005)
.483
±
.050
TYP.
(.020
±
.002)
2.16
±
.10
(.085
±
.004)
25
70
150
125
AMBIENT TEMPERATURE (
°
C )
0
Package Power Ratings at 70°C
T
S
K
4304 .......... ............ 0.60...... 0.80 watts
4306 ...... 0.75.......... 0.90...... 1.20 watts
4308 ...... 1.00.......... 1.20...... 1.60 watts
4309 ...... 1.13 ................................watts
4310 ...... 1.25.......... 1.50...... 2.00 watts
4311 ...... 1.38 ................................watts
1.02
±
.05
(.0425
±
.002)
.254
±
.050
(.010
±
.002)
Governing dimensions are in metric. Dimensions in parentheses
are inches and are approximate.
*Terminal centerline to centerline measurements made at point of
emergence of the lead from the body.
43 11 T - 101 - 2222 F A B __
Model
(43 = Molded SIP)
Number of Pins
Physical Config.
•T = Low Profile Thin Film
•S = Med. Profile Thin Film
•K = High Profile Thin Film
Electrical Configuration
•101 = Bussed
•102 = Isolated
•106 = Series
Resistance Code
•First 3 digits are significant
•Fourth digit represents the
number of zeros to follow.
Absolute Tolerance Code
•B = ±0.1%
•F = ±1%
•D = ±0.5%
Temperature Coefficient Code
•A = ±100ppm/°C •C = ±25ppm/°C
•B = ±50ppm/°C
Ratio Tolerance (Optional)
•A = ±0.05% to R1 •D = ±0.5% to R1
•B = ±0.1% to R1
Terminations
• L = Tin-plated (RoHS compliant version)
• Blank = Tin/Lead-plated
Consult factory for other available options.
Typical Part Marking
Represents total content. Layout may vary.
PART
NUMBER
4311T-101-
1003BB
YYWW
CIRCUIT
RESISTANCE
CODE
DATE CODE
PIN ONE
INDICATOR
MANUFACTURER'S
TRADEMARK
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice.
Customers should verify actual device performance in their specific applications.
测控的进来看看
本人是学测控技术于仪器的,不知道前景怎么样?请各位前辈指点一下,先谢谢了!...
beihairen 模拟电子
好的,我来扯一个其实不怎么技术的技术问题
现在接近1点了。嗯嗯。。。额,我好像有一段时间没写博客了。事实上,我懒的写。不过好吧,技术话题除外。其实没啥技术含量。现在摆在我面前的,最要紧的一件事情是我的毕业设计。事实上它已经 ......
辛昕 51单片机
新手问题关于开发环境的配置
尽管网上很多地方都在提到过这个环境配置的问题 但不知道是我笨还是哪里弄的不太清楚或是不对,最终没能正确的编译我的工程.. 所以无奈间还是要劳繁哪位大哥在这再给小弟说一下,在此先行谢过~ ......
hezongquan 嵌入式系统
开发环境安装 (二)交叉编译环境
开发环境安装 二 MYD-J1028X 开发板的开发环境,搭建比较麻烦,不像其他开发办的开发环境一样安装完虚拟机,再安装完系统之后就可以正常开发了。这款开发板开发环境需要安装gcc编译甚至还需 ......
小火苗 NXP MCU
Win7下MSP430 launchpad 驱动无法安装的问题
最近把launchpad拿到我的32位Win7操作系统的电脑上来用,按道理我已经安装了IAR驱动会自动安装,或者我手动指定目录D:\Program Files\IAR Systems\Embedded Workbench 7.3\430\drivers\TIUSBFET ......
灞波儿奔 微控制器 MCU
DIY显存8M的单片机显卡设计需求
DIY显存8M的单片机显卡设计需求能具体指出来吗?比如硬件方面:PCB板尺寸、是否允许两面贴、多少层板?软件方面:要做哪些功能模块等...
xiaolinzi133 DIY/开源硬件专区

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2375  1049  1871  1817  258  19  39  52  29  27 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved