HEX TTL TO ECL TRANSLATOR, INVERTED OUTPUT, CQFP24, CERPACK-24
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Texas Instruments(德州仪器) |
包装说明 | QFF, QFL24,.4SQ |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
Is Samacsys | N |
最大延迟 | 3.3 ns |
输入特性 | STANDARD |
接口集成电路类型 | TTL TO ECL TRANSLATOR |
JESD-30 代码 | S-GQFP-F24 |
JESD-609代码 | e0 |
长度 | 9.398 mm |
位数 | 1 |
功能数量 | 6 |
端子数量 | 24 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出特性 | OPEN-EMITTER |
输出锁存器或寄存器 | NONE |
输出极性 | INVERTED |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | QFF |
封装等效代码 | QFL24,.4SQ |
封装形状 | SQUARE |
封装形式 | FLATPACK |
电源 | 5,-4.5 V |
认证状态 | Not Qualified |
筛选级别 | MIL-STD-883 |
座面最大高度 | 2.159 mm |
最大供电电压 | 5.5 V |
最小供电电压 | 4.5 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | ECL |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | FLAT |
端子节距 | 1.27 mm |
端子位置 | QUAD |
宽度 | 9.398 mm |
Base Number Matches | 1 |
100324FMQB | 5962-9153001VYA | 5962-9153001MYA | 100324DM | 100324FM | |
---|---|---|---|---|---|
描述 | HEX TTL TO ECL TRANSLATOR, INVERTED OUTPUT, CQFP24, CERPACK-24 | HEX TTL TO ECL TRANSLATOR, COMPLEMENTARY OUTPUT, CQFP24, CERQUAD-24 | HEX TTL TO ECL TRANSLATOR, COMPLEMENTARY OUTPUT, CQFP24, CERQUAD-24 | HEX TTL TO ECL TRANSLATOR, COMPLEMENTARY OUTPUT, CDIP24, 0.400 INCH, CERAMIC, DIP-24 | HEX TTL TO ECL TRANSLATOR, COMPLEMENTARY OUTPUT, CQFP24, CERPACK-24 |
包装说明 | QFF, QFL24,.4SQ | QFF, QFL24,.4SQ | QFF, QFL24,.4SQ | DIP, DIP24,.4 | QFF, QFL24,.4SQ |
Reach Compliance Code | unknown | unknow | unknow | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最大延迟 | 3.3 ns | 2.9 ns | 2.9 ns | 3.3 ns | 3.3 ns |
接口集成电路类型 | TTL TO ECL TRANSLATOR | TTL TO ECL TRANSLATOR | TTL TO ECL TRANSLATOR | TTL TO ECL TRANSLATOR | TTL TO ECL TRANSLATOR |
JESD-30 代码 | S-GQFP-F24 | S-GQFP-F24 | S-GQFP-F24 | R-GDIP-T24 | S-GQFP-F24 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 |
位数 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 6 | 6 | 6 | 6 | 6 |
端子数量 | 24 | 24 | 24 | 24 | 24 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
输出特性 | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER | OPEN-EMITTER |
输出锁存器或寄存器 | NONE | NONE | NONE | NONE | NONE |
输出极性 | INVERTED | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装代码 | QFF | QFF | QFF | DIP | QFF |
封装等效代码 | QFL24,.4SQ | QFL24,.4SQ | QFL24,.4SQ | DIP24,.4 | QFL24,.4SQ |
封装形状 | SQUARE | SQUARE | SQUARE | RECTANGULAR | SQUARE |
封装形式 | FLATPACK | FLATPACK | FLATPACK | IN-LINE | FLATPACK |
电源 | 5,-4.5 V | 5,-4.5 V | 5,-4.5 V | 5,-4.5 V | 5,-4.5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 2.159 mm | 2.159 mm | 2.159 mm | 5.72 mm | 2.159 mm |
最大供电电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | NO | YES |
技术 | ECL | ECL100K | ECL100K | BIPOLAR | BIPOLAR |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | FLAT | FLAT | FLAT | THROUGH-HOLE | FLAT |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
端子位置 | QUAD | QUAD | QUAD | DUAL | QUAD |
宽度 | 9.398 mm | 9.398 mm | 9.398 mm | 10.16 mm | 9.398 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 |
是否Rohs认证 | 不符合 | - | - | 不符合 | 不符合 |
厂商名称 | Texas Instruments(德州仪器) | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
Is Samacsys | N | - | - | N | N |
输入特性 | STANDARD | - | - | STANDARD | STANDARD |
长度 | 9.398 mm | 9.398 mm | 9.398 mm | - | 9.398 mm |
筛选级别 | MIL-STD-883 | MIL-PRF-38535 Class V | MIL-STD-883 | - | - |
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