Datasheet> 器件分类 > 无源元件> 电容器> OP31B471M501LG

OP31B471M501LG: 产品描述Ceramic Capacitor, Multilayer, Ceramic, 500V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.00047uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT; 产品类别无源元件电容器; 文件大小539KB，共10页; 制造商Walsin_Technology_Corporation; 标准

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OP31B471M501LG概述

Ceramic Capacitor, Multilayer, Ceramic, 500V, 20% +Tol, 20% -Tol, X7R, 15% TC, 0.00047uF, Surface Mount, 1206, CHIP, ROHS COMPLIANT

OP31B471M501LG规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
Objectid	1714322283
包装说明	, 1206
Reach Compliance Code	compliant
ECCN代码	EAR99
电容	0.00047 µF
电容器类型	CERAMIC CAPACITOR
介电材料	CERAMIC
JESD-609代码	e3
安装特点	SURFACE MOUNT
多层	Yes
负容差	20%
端子数量	2
最高工作温度	125 °C
最低工作温度	-55 °C
封装形状	RECTANGULAR PACKAGE
包装方法	TR, PLASTIC, 13 INCH
正容差	20%
额定（直流）电压（URdc）	500 V
尺寸代码	1206
表面贴装	YES
温度特性代码	X7R
温度系数	15% ppm/°C
端子面层	Tin (Sn) - with Nickel (Ni) barrier
端子形状	WRAPAROUND

OP31B471M501LG文档预览

Approval sheet

Open Mode Series

MULTILAYER CERAMIC CAPACITORS

Open-Mode Series (100V to 500V)

0805 to 1812 Sizes

X7R Dielectric

RoHS Compliance

*Contents in this sheet are subject to change without prior notice.

Page 1 of 10

ASC_ Open Mode_012K_AS

Apr. 2011

Approval sheet

Open Mode Series

1. INTRODUCTION

WTC open-mode series MLCC is designed by a special internal electrode pattern, which can reduce voltage

concentrations by distributing voltage gradients throughout the entire capacitor. This special design also affords

open-mode pattern to prevent circuit leakage when focused to failure in a board flex situation.

2. FEATURES

High voltage in a given case size.

Circuit open during product cracking.

High stability and reliability.

3. APPLICATIONS

High current applications.

Power supply and related industries

The other mechanical stress concerned products.

4. HOW TO ORDER

Series

OP=Open-mode

Size

21=0805

(2012)

31=1206

(3216)

32=1210

(3225)

43=1812

(4532)

Dielectric

B=X7R

103

Capacitance

Tolerance

201

Rated voltage

Termination

Packaging

T=7”

reeled

G=13”

reeled

Two significant

K=±10%

digits followed

M=±20%

by no. of zeros.

And R is in

place of

decimal point.

eg.:

102=10x10

=1000pF

Two significant

L=Ag/Ni/Sn

digits followed by

C=Cu/Ni/Sn

no. of zeros. And (Note 1)

R is in place of

decimal point.

101=100

VDC

201=200

VDC

251=250

VDC

501=500

VDC

Note 1: Please see below product range to find right termination code.

Page 2 of 10

ASC_ Open Mode_012K_AS

Apr. 2011

Approval sheet

Open Mode Series

5. EXTERNAL DIMENSIONS

Size

Inch (mm)

0805 (2012)

L (mm)

2.00±0.15

W (mm)

1.25±0.10

T (mm)/Symbol

0.80±0.10

1.25±0.10

0.80±0.10

0.95±0.10

1.25±0.10

1.60±0.20

0.95±0.10

1.25±0.10

1.60±0.20

2.50±0.30

1.25±0.10

2.00±0.20

Remark

(mm)

0.40±0.20

1206 (3216)

3.20±0.15

3.20±0.20

3.20±0.30

1.60±0.15

1.60±0.20

2.50±0.20

2.50±0.30

3.20±0.30

1210 (3225)

3.20±0.40

1812 (4532)

4.50+0.5/-0.3

0.50±0.20

Fig. 1 The outline of MLCC

0.50±0.25

0.60±0.25

# Reflow soldering only is recommended.

6. GENERAL ELECTRICAL DATA

Dielectric

Size

Capacitance*

Capacitance tolerance**

Rated voltage (WVDC)

Tan

δ*

Insulation resistance at Ur

Dielectric strength

Operating temperature

Capacitance characteristic

Termination

X7R

0805, 1206, 1210, 1812

100pF to 1µF

K (±10%), M (±20%)

100V, 200V, 250V, 500V

≤2.5%

≥10G

or RxC≥500 -F whichever is smaller

100V:

≥2.5

x WVDC

200V and 250V:

≥2

x WVDC

500V:

≥1.5

x WVDC

-55 to +125°

±15%

Ni/Sn (lead-free termination)

* Measured at 25° ambient temperature and 30~70% r elated humidity. Apply 1.0±0.2Vrms, 1.0kHz±10%.

** Preconditioning for Class II MLCC: Perform a heat treatment at 150±10° for 1 hour, then leave in a mbient condition for 24±2 hours

before measurement.

Page 3 of 10

ASC_ Open Mode_012K_AS

Apr. 2011

Approval sheet

Open Mode Series

7. CAPACITANCE RANGE

DIELECTRIC

SIZE

RATED VOLTAGE (VDC) 100

100pF (101)

120pF (121)

150pF (151)

180pF (181)

220pF (221)

270pF (271)

330pF (331)

390pF (391)

470pF (471)

560pF (561)

680pF (681)

820pF (821)

1,000pF (102)

1,200pF (122)

1,500pF (152)

1,800pF (182)

2,200pF (222)

2,700pF (272)

3,300pF (332)

3,900pF (392)

4,700pF (472)

5,600pF (562)

6,800pF (682)

8,200pF (822)

0.010µF (103)

0.012µF (123)

0.015µF (153)

0.018µF (183)

0.022µF (223)

0.027µF (273)

0.033µF (333)

0.039µF (393)

0.047µF (473)

0.056µF (563)

0.068µF (683)

0.082µF (823)

0.10µF (104)

0.12µF (124)

0.15µF (154)

0.18µF (184)

0.22µF (224)

0.27µF (274)

0.33µF (334)

0.39µF (394)

0.47µF (474)

0.56µF (564)

0.68µF (684)

0.82µF (824)

1.0µF (105)

Capacitance

X7R

0805

200 250

500

100

1206

200 250

500

100

1210

200 250

500

100

1812

200 250

500

1. The letter in cell is expressed the symbol of product thickness.

2. The letter in cell with “^” mark is expressed product with Ag/Ni/Sn terminations.

Page 4 of 10

ASC_ Open Mode_012K_AS

Apr. 2011

Approval sheet

Open Mode Series

8. PACKAGING DIMENSION AND QUANTITY

Size

0805

Thickness (mm)/Symbol

0.80±0.10

1.25±0.10

0.80±0.10

1206

0.95±0.10

1.25±0.10

1.60±0.20

0.95±0.10

1210

1.25±0.10

1.60±0.20

2.50±0.30

1812

1.25±0.10

2.00±0.20

Paper tape

7” reel

13” reel

15k

7” reel

Plastic tape

13” reel

10k

Unit: pieces

9. INNER CONSTRUCTION OF OPEN-MODE DESIGN

Crack

Fig. 2 Normal design (CP<M

) –

circuit leakage during cracking.

Fig. 3 Open-mode design (CP>M

) –

circuit open during cracking.

Fig. 4 Floating design (one kind of

open-mode design)– circuit open

during cracking.

Page 5 of 10

ASC_ Open Mode_012K_AS

Apr. 2011

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